Texas Instruments LM8330TMX

表面安装

YES

终端数量

25

Manufacturer Part Number

LM8330TMX

Part Life Cycle Code

Obsolete

Ihs Manufacturer

Texas INC

Package Description

MICRO SMD-25

Risk Rank

5.63

Operating Temperature-Max

85 °C

Operating Temperature-Min

-30 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Max

1.98 V

Supply Voltage-Nom

1.8 V

Supply Voltage-Min

1.62 V

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.4 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B25

温度等级

OTHER

uPs/uCs/外围ICs类型

微处理器电路

座位高度-最大

0.675 mm

长度

2.015 mm

宽度

2.015 mm