Texas Instruments LMV1088RLX

表面安装

YES

终端数量

36

Manufacturer Part Number

LMV1088RLX

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Package Description

FBGA, BGA36,6X6,20

Risk Rank

5.84

Moisture Sensitivity Levels

1

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA36,6X6,20

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

JESD-609代码

e1

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

端子位置

BOTTOM

终端形式

BALL

功能数量

2

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B36

资历状况

不合格

电源

3.3/5 V

温度等级

INDUSTRIAL

电源电流-最大值

1.5 mA

消费者集成电路类型

音频放大器