Texas Instruments LMV243BLX

表面安装

YES

终端数量

8

Manufacturer Part Number

LMV243BLX

Part Life Cycle Code

Obsolete

Ihs Manufacturer

Texas INC

Part Package Code

BGA

Package Description

MICRO, BUMP, SMD-8

Risk Rank

5.83

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Supply Voltage-Nom

2.8 V

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.5 mm

Reach合规守则

unknown

引脚数量

8

JESD-30代码

S-PBGA-B8

温度等级

INDUSTRIAL

座位高度-最大

1.095 mm

通信IC类型

电信电路

长度

1.514 mm

宽度

1.514 mm