Transcend Information TS128MSQ64V6J

ECCN (US)

EAR99

Module

DRAM模块

Module Density

1Gbyte

Number of Chip per Module

16

Chip Density (bit)

512M

Data Bus Width (bit)

64

Maximum Clock Rate (MHz)

667

Chip Configuration

64Mx8

Chip Package Type

FBGA

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.9

ECC Support

无

Number of Ranks

Single

CAS Latency

5

SPD EEPROM Support

有

Standard Package Name

DIM

Supplier Package

SODIMM

Mounting

Socket

Package Height

30

Package Length

67.6

PCB changed

200

Lead Shape

No Lead

零件状态

活跃

引脚数量

200

组织结构

128Mx64

自我刷新

无

模块类型

200SODIMM

RoHS状态

符合RoHS标准