Transcend Information TS512MLK72W6H

ECCN (US)

EAR99

HTS

8473.30.11.40

Module

DRAM模块

Module Density

4Gbyte

Number of Chip per Module

9

Chip Density (bit)

4G

Data Bus Width (bit)

72

Maximum Clock Rate (MHz)

1600

Chip Configuration

512Mx8

ECC Support

有

CAS Latency

11

Standard Package Name

DIM

Supplier Package

DIMM

Mounting

Socket

PCB changed

240

Lead Shape

No Lead

零件状态

活跃

引脚数量

240

组织结构

512Mx72

模块类型

240DIMM

RoHS状态

符合RoHS标准