United Microelectronics Corp UM23C1025-B/-12

表面安装

NO

终端数量

32

Package

Bulk

Base Product Number

120086

厂商

Molex

Product Status

活跃

Package Description

DIP, DIP32,.6

Package Style

IN-LINE

Number of Words Code

128000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP32,.6

Access Time-Max

120 ns

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

UM23C1025-B/-12

Number of Words

131072 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

United Microelectronics Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

UNITED MICROELECTRONICS CORP

Risk Rank

5.92

系列

*

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

MASK ROMs

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T32

资历状况

不合格

电源

5 V

温度等级

COMMERCIAL

电源电流-最大值

0.04 mA

组织结构

128KX8

内存宽度

8

待机电流-最大值

0.00005 A

记忆密度

1048576 bit

内存IC类型

MASK ROM