WINBOND W55F10AG

表面安装

NO

终端数量

8

Package Description

DIP, DIP8(UNSPEC)

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP8(UNSPEC)

Operating Temperature-Max

70 °C

Rohs Code

有

Manufacturer Part Number

W55F10AG

Clock Frequency-Max (fCLK)

1 MHz

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Winbond Electronics Corp

Part Life Cycle Code

活跃

Ihs Manufacturer

WINBOND ELECTRONICS CORP

Risk Rank

5.78

类型

NOR型号

子类别

闪存

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

Reach合规守则

compliant

JESD-30代码

R-PDIP-T8

资历状况

不合格

电源

5 V

温度等级

COMMERCIAL

电源电流-最大值

0.01 mA

待机电流-最大值

0.000004 A

记忆密度

1048576 bit

并行/串行

SERIAL

内存IC类型

FLASH

耐力

100000 Write/Erase Cycles

数据保持时间

10