Winbond W83C553F-G

表面安装

YES

终端数量

208

Package Description

QFP, QFP208,1.2SQ,20

Package Style

FLATPACK

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

QFP208,1.2SQ,20

Supply Voltage-Nom

5 V

Operating Temperature-Max

70 °C

Rohs Code

有

Manufacturer Part Number

W83C553F-G

Package Code

QFP

Package Shape

SQUARE

Manufacturer

Winbond Electronics Corp

Part Life Cycle Code

Obsolete

Ihs Manufacturer

WINBOND ELECTRONICS CORP

Risk Rank

5.81

子类别

Other uPs/uCs/Peripheral ICs

端子位置

QUAD

终端形式

鸥翼

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PQFP-G208

资历状况

不合格

电源

5 V

温度等级

COMMERCIAL