Winbond Electronics Corp W25Q16JWXHJQ

表面安装

YES

Contact plating

gold-plated

Number of pins

19

终端数量

8

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

WINBOND ELECTRONICS CORP

Date Of Intro

2019-12-13

Clock Frequency-Max (fCLK)

133 MHz

Number of Words

2097152 words

Number of Words Code

2000000

Operating Temperature-Max

105 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

HVSON

Package Equivalence Code

SOLCC8,.12,20

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Supply Voltage-Nom (Vsup)

1.8 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

SMT

Connector pinout layout

1x19

Gross weight

1.14 g

Operating temperature

-40...163°C

ECCN 代码

EAR99

类型

NOR型号

HTS代码

8542.32.00.51

端子位置

DUAL

终端形式

无铅

峰值回流焊温度（摄氏度）

未说明

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

未说明

JESD-30代码

R-PDSO-N8

电源电压-最大值(Vsup)

1.95 V

电源电压-最小值(Vsup)

1.65 V

操作模式

SYNCHRONOUS

电源电流-最大值

0.018 mA

组织结构

2MX8

输出特性

3-STATE

座位高度-最大

0.4 mm

内存宽度

8

待机电流-最大值

0.00006 A

记忆密度

16777216 bit

并行/串行

SERIAL

内存IC类型

FLASH

编程电压

1.8 V

串行总线类型

QSPI

耐力

100000 Write/Erase Cycles

数据保持时间

20

写入保护

HARDWARE/SOFTWARE

Rated voltage

60V

个人资料

beryllium copper

长度

3 mm

宽度

2 mm

Plating thickness

0.254µm

Flammability rating

UL94V-0