Winbond Electronics Corp W25X40CVUXBG

Contact plating

gold-plated

表面安装

YES

Number of pins

56

终端数量

8

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

WINBOND ELECTRONICS CORP

Package Description

HVSON,

Clock Frequency-Max (fCLK)

80 MHz

Number of Words

524288 words

Number of Words Code

512000

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

HVSON

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Gross weight

4.63 g

Row pitch

2.54mm

Connector pinout layout

2x28

Electrical mounting

THT

Contacts pitch

2.54mm

Spatial orientation

straight

Kind of connector

female

Connector

socket

Type of connector

pin strips

Supply Voltage-Nom (Vsup)

3 V

Operating temperature

-40...163°C

ECCN 代码

EAR99

HTS代码

8542.32.00.51

端子位置

DUAL

终端形式

无铅

峰值回流焊温度（摄氏度）

未说明

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

未说明

JESD-30代码

R-PDSO-N8

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.6 V

操作模式

SYNCHRONOUS

组织结构

512KX8

输出特性

3-STATE

座位高度-最大

0.6 mm

内存宽度

8

记忆密度

4194304 bit

筛选水平

AEC-Q100

并行/串行

SERIAL

内存IC类型

FLASH

编程电压

3 V

Rated voltage

60V

个人资料

beryllium copper

长度

3 mm

宽度

2 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0