Winbond Electronics Corporation IS25LP128-JBLE

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

HTS

8542.32.00.71

Automotive

无

PPAP

无

Cell Type

NOR

Chip Density (bit)

128M

Block Organization

Symmetrical

Location of Boot Block

Bottom|Top

Address Bus Width (bit)

24

Number of Bits/Word (bit)

8

Number of Words

16M

Programmability

有

Timing Type

Synchronous

Max. Access Time (ns)

8

Maximum Erase Time (S)

90/Chip

Maximum Programming Time (ms)

0.8/Page

Interface Type

Serial (SPI, Dual SPI, Quad SPI)

Maximum Operating Frequency (MHz)

104

Minimum Operating Supply Voltage (V)

2.3

Typical Operating Supply Voltage (V)

2.5|3|3.3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.3 to 3.6

Operating Current (mA)

14

Program Current (mA)

25

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

105

Supplier Temperature Grade

Extended

Command Compatible

有

ECC Support

无

Support of Page Mode

无

Minimum Endurance (Cycles)

100000

Mounting

表面贴装

Package Height

1.91(Max)

Package Width

5.38(Max)

Package Length

5.38(Max)

PCB changed

8

Standard Package Name

SOP

Supplier Package

SOIC

Lead Shape

Gull-wing

零件状态

活跃

引脚数量

8

建筑学

Sectored

行业规模

4Kbyte x 4096

页面尺寸

256byte

引导模块

有