Winbond Electronics Corporation W29GL032CB7A/TRAY

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

Automotive

无

PPAP

无

Cell Type

NOR

Chip Density (bit)

32M

Block Organization

Symmetrical

Location of Boot Block

Bottom

Address Bus Width (bit)

21

Number of Bits/Word (bit)

8/16

Number of Words

4M/2M

Programmability

有

Timing Type

Asynchronous

Max. Access Time (ns)

70

Maximum Erase Time (S)

64/Chip

Maximum Page Access Time (ns)

30

Maximum Programming Time (ms)

56000/Chip

OE Access Time (ns)

35

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6

Operating Current (mA)

55

Page Read Current (mA)

25

Program Current (mA)

30

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

有

ECC Support

无

Support of Page Mode

有

Mounting

表面贴装

Package Height

0.79

Package Width

6

Package Length

8

PCB changed

48

Standard Package Name

BGA

Supplier Package

TFBGA

Lead Shape

Ball

零件状态

Obsolete

引脚数量

48

建筑学

Sectored

行业规模

64Kbyte x 64

页面尺寸

8Words/16byte

引导模块

有