Winbond Electronics Corporation W29N08GVSIAA

安装类型

表面贴装

包装/外壳

48-TFSOP (0.724, 18.40mm Width)

表面安装

YES

供应商器件包装

48-TSOP

终端数量

48

EU RoHS

Compliant

ECCN (US)

3A991b.1.a.

HTS

8542.32.00.71

Automotive

有

PPAP

Unknown

Cell Type

SLC NAND

Chip Density (bit)

8G

Block Organization

Symmetrical

Address Bus Width (bit)

31

Number of Bits/Word (bit)

8

Number of Words

1G

Programmability

有

Timing Type

Asynchronous

Maximum Erase Time (S)

0.01/Block

Maximum Programming Time (ms)

0.7/Page

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Programming Voltage (V)

2.7 to 3.6

Operating Current (mA)

35

Program Current (mA)

35

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

无

ECC Support

有

Support of Page Mode

有

Minimum Endurance (Cycles)

100000

Mounting

表面贴装

Package Height

1

Package Width

18.4

Package Length

12

PCB changed

48

Standard Package Name

SOP

Supplier Package

TSOP-I

Lead Shape

Gull-wing

Package

Tray

厂商

Winbond Electronics

Product Status

活跃

Memory Types

Non-Volatile

Supply Voltage-Nom (Vsup)

2.7V - 3.6V

Dimensions

18.5 x 12.1 x 1.05mm

Minimum Operating Supply Voltage

2.7 V

Package Type

TSOP

Maximum Operating Temperature

+85 °C

Minimum Operating Temperature

-40 °C

Maximum Operating Supply Voltage

3.6 V

Package Description

TSOP1,

Package Style

SMALL OUTLINE, THIN PROFILE

Number of Words Code

1000000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

未说明

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

W29N08GVSIAA

Package Code

TSOP1

Package Shape

RECTANGULAR

Manufacturer

Winbond Electronics Corp

Part Life Cycle Code

活跃

Ihs Manufacturer

WINBOND ELECTRONICS CORP

Risk Rank

2.28

操作温度

-40°C ~ 85°C (TA)

系列

-

零件状态

活跃

类型

SLC NAND Flash

技术

FLASH - NAND (SLC)

电压 - 供电

2.7V ~ 3.6V

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

未说明

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

引脚数量

48

JESD-30代码

R-PDSO-G48

电源电压-最大值(Vsup)

3.6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.7 V

内存大小

8Gbit

速度

40MHz

操作模式

ASYNCHRONOUS

访问时间

25 ns

内存格式

FLASH

内存接口

Parallel

建筑学

Sectored

组织结构

High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set

座位高度-最大

1.2 mm

内存宽度

8

写入周期时间 - 字符、页面

25ns, 700µs

记忆密度

8Gb

并行/串行

PARALLEL

内存IC类型

FLASH

编程电压

3 V

行业规模

128Kbyte x 8192

页面尺寸

2Kbyte

引导模块

无

温度

40ºC ~ 85ºC / -40ºC ~ 105ºC

组织的记忆

1G x 8

宽度

18.5mm

高度

1.05mm

长度

12.1mm