XC7S75-1FGGA676C4966详情
Xilinx XC7S75-1FGGA676C4966重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
包装/外壳
BGA-676
Distributed RAM
832 Kb
Factory Pack QuantityFactory Pack Quantity
1
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
0 C
Mounting Styles
SMD/SMT
Number of Logic Array Blocks - LABs
6000 LAB
Number of Logic Elements
76800 LE
Supply Voltage-Max
1 V
Supply Voltage-Min
1 V
系列
XC7S75
工作电源电压
1 V
XC7S75-1FGGA676C4966拓展信息
Xilinx Inc.
Xilinx Inc.
Xilinx Inc.
Xilinx Inc.
Xilinx Inc.
Xilinx Inc.
Xilinx Inc.
Xilinx Inc.
Xilinx Inc.
Xilinx Inc.








哦! 它是空的。