Xilinx XCZU3EG-2UBVA530I

包装/外壳

FBGA-530

供应商器件包装

530-FCBGA (16x9.5)

Mounting Styles

SMD/SMT

Core

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

L1 Cache Instruction Memory

2 x 32 kB, 4 x 32 kB

L1 Cache Data Memory

2 x 32 kB, 4 x 32 kB

Data RAM Size

256 kB

Number of Logic Elements

154350 LE

Number of I/Os

82 I/O

Minimum Operating Temperature

- 40 C

Maximum Operating Temperature

+ 100 C

Distributed RAM

1.8 Mb

Number of Logic Array Blocks - LABs

8820 LAB

Factory Pack QuantityFactory Pack Quantity

1

Package

Tray

厂商

AMD 赛灵思

Product Status

活跃

操作温度

-40°C ~ 100°C (TJ)

系列

-

工作电源电压

850 mV

速度

533MHz, 1.3GHz

内存大小

256KB

核心处理器

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

周边设备

DMA, WDT

连接方式

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

建筑学

MPU, FPGA

主要属性

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

核数量

7 Core

闪光大小

-