Xilinx XQV600-4PQ240N

表面安装

YES

终端数量

240

Package Description

HFQFP,

Package Style

FLATPACK, HEAT SINK/SLUG, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-55 °C

Supply Voltage-Nom

2.5 V

Supply Voltage-Min

2.375 V

Operating Temperature-Max

125 °C

Manufacturer Part Number

XQV600-4PQ240N

Package Code

HFQFP

Package Shape

SQUARE

Manufacturer

Xilinx

Part Life Cycle Code

Obsolete

Ihs Manufacturer

XILINX INC

Supply Voltage-Max

2.625 V

Risk Rank

5.81

Usage Level

Military grade

无铅代码

无

技术

CMOS

端子位置

QUAD

终端形式

鸥翼

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PQFP-G240

温度等级

MILITARY

组织结构

3456 CLBS, 661111 GATES

座位高度-最大

4.1 mm

可编程逻辑类型

现场可编程门阵列

筛选水平

MIL-PRF-38535

CLB-Max的组合延时

0.8 ns

逻辑块数量

3456

等效门数

661111

宽度

32 mm

长度

32 mm