XKB CONNECTIVITY XKSIM-008

质量

1.3

Overall Dimension

W24.6XD17.6XH1.8

Height from mounting surface (mm)

1.8

Soldering Temp (Max)

260°C

Name

#REF!

Contact Materials

铜合金

Conntact Coatings

Gold plated

Package Specifications

SMD

Maximum Self Height

1.8mm

Connecting Mode

Flip-lid type

零件状态

活跃

引脚数量

6

磁卡种类

NanoSIM卡