XKB CONNECTIVITY XKSIM-115

质量

2.365

Overall Dimension

W26.50XD19.35XH2.15

Height from mounting surface (mm)

2.15

Soldering Temp (Max)

260°C

Name

#REF!

Contact Materials

铜合金

Conntact Coatings

Gold plated

Package Specifications

SMD

Maximum Self Height

2.2mm

Connecting Mode

Self-ejecting

零件状态

活跃

引脚数量

8

磁卡种类

MicroSIM卡