XKB CONNECTIVITY XKTF-1307-18

质量

0.628

Overall Dimension

W13.4XD13.6XH1.8

Height from mounting surface (mm)

1.8

Soldering Temp (Max)

260°C

Name

#REF!

Contact Materials

铜合金

Conntact Coatings

Gold plated

Package Specifications

SMD

Maximum Self Height

1.8mm

Connecting Mode

Flip-lid type

零件状态

活跃

引脚数量

8

磁卡种类

MicroSD卡(TF卡)