类别是'category.存储器' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 组织结构 | 输出特性 | 无卤素 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 访问时间(最大) | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 产品类别 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | GS8662T20BD-450M | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | BGA-165 | YES | 165 | 1.8000 V | Synchronous | 4 MWords | 18 Bit | 表面贴装 | 有 | 450 MHz | + 125 C | 1.9 V | - 55 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaCIO DDR-II | DDR | LBGA, | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | -55 °C | 未说明 | 0.45 ns | 125 °C | 无 | GS8662T20BD-450M | 1.8 V | LBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.73 | Military grade | 450 MHz | FBGA | DDR | Tray | GS8662T20BD | 3A991.B.2.B | SigmaQuad-II+ | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 1.9 V | MILITARY | 1.7 V | 72 Mbit | SYNCHRONOUS | Pipelined | 4 M x 18 | 1.4 mm | 18 | 22 Bit | SRAM | 72 Mbit | 75497472 bit | Military | PARALLEL | DDR SRAM | SRAM | 15 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ED36BK-675I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-260 | YES | 260 | 1.3 V | Synchronous | 2 MWords | 36 Bit | 1.4 V | 表面贴装 | 有 | 675 MHz | + 100 C | 1.4 V | - 40 C | 8 | 1.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-IIIe | DDR | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 2000000 | PLASTIC/EPOXY | 未说明 | 无 | GS8673ED36BK-675I | 1.35 V | HBGA | RECTANGULAR | 不推荐 | GSI TECHNOLOGY | 5.81 | Industrial grade | 675/450 MHz | BGA | QDR | 1.3500 V | -40 to 85 °C | Tray | GS8673ED36BK | 3A991.B.2.B | SigmaQuad-IIIe B4 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 260 | R-PBGA-B260 | 1.4 V | 1.3 V | 72 Mbit | SYNCHRONOUS | 3.17 A | Pipelined | 2 M x 36 | 2.3 mm | 36 | 19 Bit | SRAM | 72 Mbit | 75497472 bit | Industrial | PARALLEL | DDR SRAM | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880E18CGT-150V | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | 133.3@Flow-Through/150@Pipelined MHz | TQFP | SDR | 1.8, 2.5 V | 1.7, 2.3 V | Synchronous | 512 kWords | 18 Bit | 2, 2.7 V | 表面贴装 | 有 | 150 MHz | + 70 C | 2.7 V | 0 C | 66 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | QFP100,.63X.87 | 未说明 | 7.5 ns | 70 °C | 有 | GS880E18CGT-150V | 150 MHz | 1.8 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | QFP | Commercial grade | 0 to 70 °C | Tray | GS880E18CGT | e3 | 有 | 3A991.B.2.B | DCD | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 不合格 | 2 V | 1.8/2.5 V | COMMERCIAL | 1.7 V | 9 Mbit | 2 | SYNCHRONOUS | 105 mA, 115 mA | 7.5 ns | Flow-Through/Pipelined | 512 k x 18 | 3-STATE | 1.6 mm | 18 | 18 Bit | SRAM | 9 Mbit | 0.025 A | 9437184 bit | Commercial | PARALLEL | COMMON | 缓存SRAM | 1.7 V | SRAM | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z36CGD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 3.6 V | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | 有 | 250 MHz | + 85 C | Tray | GS881Z36CGD | NBT Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 175 mA, 215 mA | 5.5 ns | 256 k x 36 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88236CD-200 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8673ET18BGK-550 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-260 | YES | 260 | BGA | DDR | 1.3500 V | 1.25 V | Synchronous | 4 MWords | 18 Bit | 1.4 V | 表面贴装 | 有 | 550 MHz | + 85 C | 1.4 V | 0 C | 8 | 1.25 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-IIIe | Details | DDR-III | HBGA, | GRID ARRAY, HEAT SINK/SLUG | 4000000 | PLASTIC/EPOXY | 未说明 | 0.4 ns | 85 °C | 有 | GS8673ET18BGK-550 | 1.3 V | HBGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.72 | Commercial grade | 550/375 MHz | 0 to 70 °C | Tray | GS8673ET18BGK | 3A991.B.2.B | SigmaDDR-IIIe B2 | IT ALSO OPERATES AT 1.35 V TYPICAL VOLTAGE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 260 | R-PBGA-B260 | 1.4 V | OTHER | 1.25 V | 72 Mbit | SYNCHRONOUS | 1.49 A | Pipelined | 4 M x 18 | 2.3 mm | 18 | SRAM | 72 Mbit | 75497472 bit | Commercial | PARALLEL | DDR SRAM | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8182T19BD-300 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS881Z36CD-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 3.6 V | 0 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | N | SDR | 有 | 250 MHz | + 70 C | Tray | GS881Z36CD | NBT Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 155 mA, 195 mA | 5.5 ns | 256 k x 36 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88236CD-250I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | SDR | 有 | 250 MHz | + 85 C | 3.6 V | - 40 C | Tray | GS88236CD | Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 175 mA, 215 mA | 5.5 ns | 256 k x 36 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS81302TT19E-450 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaDDR-II+ | N | DDR-II | Commercial grade | 450 MHz | FBGA | DDR | 1.8000 V | Synchronous | 8 MWords | 18 Bit | 表面贴装 | 有 | 450 MHz | + 70 C | 1.9 V | 0 C | 10 | 1.7 V | 0 to 85 °C | Tray | GS81302TT19E | SigmaDDR-II+ B2 | Memory & Data Storage | 165 | 144 Mbit | 1 | 1 A | Pipelined | 8 M x 18 | SRAM | 144 Mbit | Commercial | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25AA020A-I/ST | Microchip Technology | 数据表 | 2005 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 40 | 25AA020A | 8 | 5V | SPI, Serial | 2Kb 256 x 8 | 5mA | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 2 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IS25LP128-JLLE | ISSI, Integrated Silicon Solution Inc | 数据表 | 10 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 8-WDFN Exposed Pad | 8 | Non-Volatile | -40°C~105°C TA | Tray | e3 | 活跃 | 3 (168 Hours) | 8 | 3A991.B.1.A | Tin (Sn) | 2.3V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 10 | 3V | 3.6V | SPI | 128Mb 16M x 8 | SYNCHRONOUS | 133MHz | 7 ns | FLASH | SPI - Quad I/O, QPI | 1 | 1ms | 24b | 128 Mb | SERIAL | 2.7V | 256B | 800μm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CAT93C86VI-G | ON Semiconductor | 数据表 | 24900 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 20 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Industrial grade | Non-Volatile | -40°C~85°C TA | Tube | 2008 | e4 | yes | Obsolete | 1 (Unlimited) | 8 | 1.8V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | CAT93C86 | 8 | 5V | Serial | 16Kb 2K x 8 1K x 16 | 3mA | 3MHz | 1 μs | EEPROM | SPI | 16KX1 | 无卤素 | 16 kb | 0.00001A | MICROWIRE | 1000000 Write/Erase Cycles | 100 | HARDWARE/SOFTWARE | 1.5mm | 5mm | 4mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93AA66T-I/SN | Microchip Technology | 数据表 | 2469 In Stock | - | 最小起订量: 1 最小包装量: 1 | 29 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1000K ERASE/WRITE CYCLE; 200 YEAR DATA RETENTION | 1.8V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 93AA66 | 8 | 5.5V | Serial | 4Kb 512 x 8 256 x 16 | 2mA | 2MHz | 2 μs | EEPROM | SPI | 256X16 | 16 | 10ms | 4 kb | MICROWIRE | 10ms | 8 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX25L25645GMI-10G | Macronix | 数据表 | 571 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | Non-Volatile | -40°C~85°C TA | Tube | 2005 | MXSMIO™ | e3 | 不用于新设计 | 3 (168 Hours) | Tin (Sn) | 2.7V~3.6V | 260 | 40 | 256Mb 32M x 8 | 120MHz | FLASH | SPI | 30μs, 750μs | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY62128ELL-45ZXAT | Cypress Semiconductor Corp | 数据表 | 15 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 32-TFSOP (0.724, 18.40mm Width) | 32 | Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2001 | MoBL® | e3 | 活跃 | 3 (168 Hours) | 32 | EAR99 | Matte Tin (Sn) | 4.5V~5.5V | DUAL | 1 | 5V | 0.5mm | CY62128 | 5V | 5V | 1Mb 128K x 8 | 1 | 16mA | SRAM | Parallel | 3-STATE | 8 | 45ns | 17b | 1 Mb | 0.000004A | 45 ns | COMMON | Asynchronous | 8b | 2V | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1372D-167AXC | Cypress Semiconductor Corp | 数据表 | 3 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 100-LQFP | 100 | Volatile | 0°C~70°C TA | Tray | 2011 | NoBL™ | e3 | yes | Obsolete | 3 (168 Hours) | 100 | Matte Tin (Sn) | 流水线结构 | 3.135V~3.6V | QUAD | 260 | 1 | 3.3V | 0.65mm | 20 | CY7C1372 | 100 | 3.3V | 3.6V | 3.135V | 18Mb 1M x 18 | 2 | 275mA | 167MHz | 3.4ns | SRAM | Parallel | 1MX18 | 3-STATE | 20b | 18 Mb | 0.07A | COMMON | Synchronous | 18b | 3.14V | 1.6mm | 14mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1314BV18-200BZC | Cypress Semiconductor Corp | 数据表 | 348 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e0 | Obsolete | 3 (168 Hours) | 165 | Tin/Lead (Sn/Pb) | 流水线结构 | 1.7V~1.9V | BOTTOM | 220 | 1 | 1.8V | 1mm | not_compliant | 未说明 | CY7C1314 | 165 | 不合格 | 1.8V | 1.9V | 1.7V | 18Mb 512K x 36 | 2 | 750mA | 200MHz | 450 ps | SRAM | Parallel | 3-STATE | 36 | 18b | 18 Mb | SEPARATE | Synchronous | 36b | 1.7V | 1.4mm | 15mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC58NVG1S3ETAI0 | Toshiba | 数据表 | 36 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | TFSOP | 48 | EEPROM, NAND, SLC NAND | 2012 | Discontinued | 48 | 3A991.B.1.A | 85°C | -40°C | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 3.3V | 0.5mm | 48 | 3.3V | INDUSTRIAL | Parallel, Serial | 3.6V | 2.7V | 2GB | 30mA | 25 ns | 256MX8 | 1b | 2 Gb | 0.00005A | Synchronous | 8b | NO | NO | 2K | 128K | 2.1kB | YES | 1mm | 18.4mm | 12.4mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IS62WV2568BLL-70BI | ISSI, Integrated Silicon Solution Inc | 数据表 | 12 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 36-TFBGA | YES | 36 | Volatile | -40°C~85°C TA | Tray | e0 | no | 活跃 | 2 (1 Year) | 36 | Tin/Lead (Sn/Pb) | 2.5V~3.6V | BOTTOM | 1 | 3V | 0.75mm | 36 | 3.3V | 3.6V | 2.5V | 2Mb 256K x 8 | 1 | SRAM | Parallel | 256KX8 | 3-STATE | 8 | 70ns | 18b | 2 Mb | 70 ns | COMMON | 1V | 8mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93AA76/P | Microchip Technology | 数据表 | 9 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Automotive grade | Non-Volatile | 0°C~70°C TA | Tube | 2012 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~6V | DUAL | 1 | 3V | 2.54mm | 93AA76 | 8 | 6V | 2/5V | Serial | 8Kb 1K x 8 512 x 16 | 3mA | 3MHz | EEPROM | SPI | 512X16 | 3-STATE | 16 | 5ms | 8 kb | 0.00003A | TS 16949 | MICROWIRE | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 8 | 4.32mm | 9.46mm | 7.62mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CAT24M01WI-G | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | Gold | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tube | 2012 | e4 | yes | 活跃 | 1 (Unlimited) | 1.8V~5.5V | 2-Wire, I2C, Serial | 1Mb 128K x 8 | 5mA | 1MHz | 400ns | EEPROM | I2C | 5ms | 1 Mb | SPI | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
S29AS016J70BFI043 | Cypress Semiconductor Corp | 数据表 | 15 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 48-VFBGA | YES | 48 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2015 | AS-J | 活跃 | 3 (168 Hours) | 48 | EAR99 | 底部启动区块 | 8542.32.00.51 | 1.65V~1.95V | BOTTOM | 1 | 1.8V | 0.8mm | 不合格 | 1.95V | 1.65V | 16Mb 2M x 8 1M x 16 | ASYNCHRONOUS | FLASH | Parallel | 1MX16 | 16 | 70ns | 16777216 bit | 70 ns | 1.8V | 8 | BOTTOM | 1mm | 8.15mm | 6.15mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT28C010-20EM/883 | Microchip Technology | 数据表 | 2012 In Stock | - | 最小起订量: 1 最小包装量: 1 | 23 Weeks | Lead, Tin | 表面贴装 | 表面贴装 | 32-CLCC | 32 | Military grade | Non-Volatile | -55°C~125°C TC | Tube | 1998 | e0 | no | 活跃 | 3 (168 Hours) | 32 | Tin/Lead (Sn/Pb) | AUTOMATIC WRITE; DATA RETENTION: 10 YEARS | 4.5V~5.5V | QUAD | 240 | 1 | 5V | 1.27mm | 200GHz | 30 | AT28C010 | 不合格 | 5V | 5V | 1Mb 128K x 8 | 80mA | ASYNCHRONOUS | 200ns | EEPROM | Parallel | 128KX8 | 3-STATE | 8 | 10ms | 1 Mb | 0.0003A | MIL-STD-883 | 5V | 10000 Write/Erase Cycles | 10ms | YES | YES | NO | 128words | 2.54mm | 13.97mm | 11.43mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29AL008J70TFI01 | Cypress Semiconductor | 数据表 | 1000 In Stock | - | 最小起订量: 1 最小包装量: 1 |
GS8662T20BD-450M
GSI Technology
分类:Memory
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GS880E18CGT-150V
GSI Technology
分类:Memory
GS881Z36CGD-250I
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分类:Memory
GS88236CD-200
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分类:Memory
GS8673ET18BGK-550
GSI Technology
分类:Memory
GS8182T19BD-300
GSI Technology
分类:Memory
GS881Z36CD-250
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分类:Memory
GS88236CD-250I
GSI Technology
分类:Memory
GS81302TT19E-450
GSI Technology
分类:Memory
25AA020A-I/ST
Microchip Technology
分类:Memory
IS25LP128-JLLE
ISSI, Integrated Silicon Solution Inc
分类:Memory
CAT93C86VI-G
ON Semiconductor
分类:Memory
1.853564
93AA66T-I/SN
Microchip Technology
分类:Memory
MX25L25645GMI-10G
Macronix
分类:Memory
CY62128ELL-45ZXAT
Cypress Semiconductor Corp
分类:Memory
CY7C1372D-167AXC
Cypress Semiconductor Corp
分类:Memory
CY7C1314BV18-200BZC
Cypress Semiconductor Corp
分类:Memory
TC58NVG1S3ETAI0
Toshiba
分类:Memory
IS62WV2568BLL-70BI
ISSI, Integrated Silicon Solution Inc
分类:Memory
93AA76/P
Microchip Technology
分类:Memory
CAT24M01WI-G
ON Semiconductor
分类:Memory
S29AS016J70BFI043
Cypress Semiconductor Corp
分类:Memory
AT28C010-20EM/883
Microchip Technology
分类:Memory
S29AL008J70TFI01
Cypress Semiconductor
分类:Memory
