39 In Stock

• 1: ¥685.499277
• 10: ¥646.697432
• 100: ¥610.091913
• 500: ¥575.558415
查看所有的价格

-

10 Weeks

表面贴装

324-LFBGA, CSPBGA

YES

150

Automotive grade

-40°C~125°C TJ

Bulk

2010

Automotive, AEC-Q100, Artix-7 XA

e1

活跃

3 (168 Hours)

325

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

0.95V~1.05V

BOTTOM

BALL

260

1V

0.8mm

30

S-PBGA-B325

150

不合格

1V

1098MHz

150

现场可编程门阵列

33280

1843200

2600

1.27 ns

1.5mm

15mm

15mm

Non-RoHS Compliant

482 In Stock

-

19 Weeks

表面贴装

表面贴装

1156-BBGA, FCBGA

1156

360

0°C~85°C TJ

Tray

1999

Virtex®-5 TXT

e1

yes

活跃

4 (72 Hours)

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

0.95V~1.05V

BOTTOM

BALL

245

1V

1mm

30

XC5VTX150T

360

1V

1MB

现场可编程门阵列

148480

8404992

11600

2

3.5mm

35mm

35mm

无

ROHS3 Compliant

28 In Stock

-

8 Weeks

表面贴装

780-BGA

YES

413

-40°C~100°C TJ

Tray

Cyclone® III

活跃

3 (168 Hours)

780

3A991

8542.39.00.01

1.15V~1.25V

BOTTOM

BALL

1.2V

1mm

EP3CLS200

S-PBGA-B780

413

不合格

1.21.2/3.32.5V

450MHz

413

现场可编程门阵列

198464

8211456

12404

2.4mm

29mm

29mm

符合RoHS标准

8 In Stock

-

10 Weeks

表面贴装

表面贴装

2104-BBGA, FCBGA

702

0°C~100°C TJ

Bulk

2012

Virtex® UltraScale™

e1

活跃

4 (72 Hours)

3A001.A.7.B

Tin/Silver/Copper (Sn/Ag/Cu)

0.922V~0.979V

BOTTOM

BALL

未说明

0.95V

未说明

11.1MB

现场可编程门阵列

1566600

90726400

89520

2

1.43232e+06

ROHS3 Compliant

无铅

175 In Stock

-

8 Weeks

表面贴装

780-BGA

YES

532

-40°C~100°C TJ

Tray

Cyclone® IV E

e1

活跃

3 (168 Hours)

780

3A001.A.7.A

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

0.97V~1.03V

BOTTOM

BALL

245

1V

1mm

40

EP4CE30

S-PBGA-B780

535

不合格

11.2/3.32.5V

362MHz

535

现场可编程门阵列

28848

608256

1803

2.4mm

29mm

29mm

符合RoHS标准

N/A

-

表面贴装

FBGA

YES

896-FBGA (31x31)

896

This product may require additional documentation to export from the United States.

N

620 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

27

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE3000-2FG896I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE3000

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

2

75264

75264

3000000

1.73 mm

31 mm

31 mm

N/A

-

表面贴装

672-BBGA, FCBGA

YES

488

0°C~85°C TJ

Tray

APEX-20KC®

e0

Obsolete

3 (168 Hours)

672

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

1.71V~1.89V

BOTTOM

BALL

220

1.8V

1mm

compliant

30

EP20K400

S-PBGA-B672

480

不合格

1.81.8/3.3V

1.78 ns

480

可加载 PLD

16640

212992

1052000

1664

MACROCELL

4

3.5mm

27mm

27mm

Non-RoHS Compliant

N/A

-

表面贴装

240-BQFP

YES

151

0°C~85°C TJ

Tray

APEX-20KE®

e0

Obsolete

3 (168 Hours)

240

EAR99

Tin/Lead (Sn/Pb)

8542.39.00.01

1.71V~1.89V

QUAD

鸥翼

220

1.8V

0.5mm

compliant

30

EP20K60

S-PQFP-G240

143

不合格

1.81.8/3.3V

160MHz

2.41 ns

143

可加载 PLD

32768

162000

2560

MACROCELL

4

4.1mm

32mm

32mm

Non-RoHS Compliant

791 In Stock

-

8 Weeks

表面贴装

484-BGA

YES

210

0°C~85°C TJ

Tray

Cyclone® III

活跃

3 (168 Hours)

484

3A991

8542.39.00.01

1.15V~1.25V

BOTTOM

BALL

1.2V

1mm

EP3CLS200

S-PBGA-B484

210

不合格

1.21.2/3.32.5V

450MHz

210

现场可编程门阵列

198464

8211456

12404

2.4mm

23mm

23mm

符合RoHS标准

N/A

-

FCBGA

YES

e0

no

4 (72 Hours)

363

Tin/Lead (Sn63Pb37)

85°C

0°C

BOTTOM

BALL

225

0.8mm

30

S-PBGA-B363

240

不合格

1.2V

1.21.2/3.32.5V

81kB

240

现场可编程门阵列

10

12312

符合RoHS标准

2868 In Stock

-

10 Weeks

表面贴装

表面贴装

208-BFQFP

208

158

-40°C~100°C TJ

Tray

2003

Spartan®-3E

e0

no

活跃

3 (168 Hours)

208

Tin/Lead (Sn85Pb15)

1.14V~1.26V

QUAD

鸥翼

225

1.2V

0.5mm

30

XC3S500E

126

不合格

1.2V

1.21.2/3.32.5V

45kB

572MHz

现场可编程门阵列

10476

368640

500000

1164

4

9312

0.76 ns

28mm

28mm

Non-RoHS Compliant

N/A

-

6 Weeks

表面贴装

1704-BBGA, FCBGA

YES

996

0°C~85°C TJ

Bulk

2011

Virtex®-II Pro

e0

no

Obsolete

4 (72 Hours)

8542.39.00.01

1.425V~1.575V

BOTTOM

BALL

225

1.5V

1mm

not_compliant

30

996

不合格

1.5V

1.51.5/3.32/2.52.5V

738kB

1350MHz

996

现场可编程门阵列

74448

6045696

8272

7

66176

0.28 ns

3.45mm

42.5mm

42.5mm

Non-RoHS Compliant

674 In Stock

-

8 Weeks

表面贴装

256-LFBGA

YES

168

0°C~85°C TJ

Tray

Cyclone® III

e1

活跃

3 (168 Hours)

256

3A991

锡银铜

8542.39.00.01

1.15V~1.25V

BOTTOM

BALL

260

1.2V

0.8mm

40

EP3C16

R-PBGA-B256

168

不合格

472.5MHz

168

现场可编程门阵列

15408

516096

963

2.2mm

14mm

14mm

符合RoHS标准

N/A

-

表面贴装

1020-BBGA

YES

773

0°C~85°C TJ

Tray

Stratix®

e1

Obsolete

3 (168 Hours)

3A001.A.7.A

锡银铜

8542.39.00.01

1.425V~1.575V

BOTTOM

BALL

245

1.5V

1mm

compliant

40

EP1S80

S-PBGA-B1020

1238

不合格

1.51.5/3.3V

1238

现场可编程门阵列

79040

7427520

7904

符合RoHS标准

165 In Stock

-

FCBGA

YES

e1

yes

4 (72 Hours)

957

3A991.D

85°C

0°C

BOTTOM

BALL

245

1.5V

1.27mm

30

957

1.5V

OTHER

126kB

2688 CLBS, 2000000 GATES

现场可编程门阵列

5

21504

0.39 ns

2688

2000000

40mm

40mm

无

符合RoHS标准

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

活跃

This product may require additional documentation to export from the United States.

Details

248 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

763 MHz

有

60

Actel

0.014110 oz

1.575 V

Tray

AX250

-40°C ~ 85°C (TA)

Tray

AX250

1.425V ~ 1.575V

1.5 V

55296

250000

4224

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

484-FPBGA (23x23)

微芯片技术

1.575 V

This product may require additional documentation to export from the United States.

N

317 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

763 MHz

有

60

Actel

0.014110 oz

Tray

AX500

活跃

0°C ~ 70°C (TA)

Tray

AX500

1.425V ~ 1.575V

1.5 V

73728

500000

8064

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

- 40 C

+ 85 C

SMD/SMT

微芯片技术

1470.59 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

BGA

AFS600-2FGG484I

有

85 °C

40

1.5 V

-40 °C

PLASTIC/EPOXY

3

网格排列

BGA,

This product may require additional documentation to export from the United States.

Details

7000 LE

172 I/O

1.425 V

-40°C ~ 100°C (TJ)

Tray

AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

110592

600000

1.47059 GHz

2

13824

13824

600000

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

1.575 V

Tray

M7A3P1000

活跃

This product may require additional documentation to export from the United States.

N

177 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

0.014110 oz

ProASIC3

90

有

310 MHz

1.5000 V

1.425 V

1.575 V

0 to 70 °C

Tray

M7A3P1000

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

18 kB

147456

1000000

310 MHz

2

24576

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

YES

256-FPBGA (17x17)

256

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

微芯片技术

90

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

5.3

MICROSEMI CORP

活跃

SQUARE

LBGA

M7AFS600-2FGG256I

有

85 °C

40

1.5 V

-40 °C

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE

LBGA,

Details

119 I/O

1.425 V

-40°C ~ 85°C (TA)

Tray

M7AFS600

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

2

600000

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

341 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

60

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

AGLE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

70 °C

有

AGLE3000V2-FGG484

250 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

AGLE3000V2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

341

不合格

1.2 V to 1.5 V

1.2/1.5 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

+ 70 C

SMD/SMT

870 MHz

微芯片技术

有

60

Actel

0.014110 oz

1.575 V

Tray

AX1000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.5 V

40

70 °C

有

AX1000-2FGG484

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

Details

317 I/O

1.425 V

0 C

0°C ~ 70°C (TA)

Tray

AX1000

e1

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

1000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

870 MHz

S-PBGA-B484

516

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

COMMERCIAL

1.575 V

1.425 V

20.3 kB

740 ps

740 ps

516

12096 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

12096

165888

1000000

870 MHz

18144

12096

2

12096

0.74 ns

12096

18144

1000000

1.73 mm

23 mm

23 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

90

有

1282.05 MHz

SMD/SMT

+ 70 C

0 C

1.425 V

119 I/O

N

1.575 V

Tray

M7AFS600

活跃

0.014110 oz

Fusion

0°C ~ 70°C (TA)

Tray

M7AFS600

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

N

7000 LE

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

-40°C ~ 100°C (TJ)

Tray

AFS600

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.47059 GHz

2

13824

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

484

484-FPBGA (23x23)

400.011771 mg

484

0 C

+ 70 C

SMD/SMT

892.86 MHz

微芯片技术

有

60

IGLOOe

0.014110 oz

1.2, 1.5 V

1.14 V

1.575 V

1.575 V

Tray

M1AGLE3000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

20

70 °C

无

M1AGLE3000V2-FG484

BGA

SQUARE

活跃

MICROSEMI CORP

5.24

This product may require additional documentation to export from the United States.

N

341 I/O

1.14 V

0 to 70 °C

Tray

M1AGLE3000V2

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.2 V to 1.5 V

COMMERCIAL

1.575 V

1.14 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

516096

3000000

892.86 MHz

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

无