类别是'category.微处理器' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 速度 | uPs/uCs/外围ICs类型 | 电源电流-最大值 | 位元大小 | 座位高度-最大 | 地址总线宽度 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 串行I/O数 | 外部中断数量 | DMA通道数 | 长度 | 宽度 | |||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | XC7451ARX800RE | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | STN8810BDS12HPBE | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 26 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.2 V | Obsolete | STMICROELECTRONICS | BGA | LFBGA, | 19.2 MHz | PLASTIC/EPOXY | LFBGA | 8542.31.00.01 | BOTTOM | BALL | 0.5 mm | compliant | 26 | S-PBGA-B26 | 不合格 | 264 MHz | MICROPROCESSOR, RISC | 32 | 1.4 mm | YES | YES | 固定点 | YES | 14 mm | 14 mm | |||||||||||||||||||||||||
![]() | TS80C186EC25 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | QFP, | 50 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | 5.5 V | 4.5 V | 5 V | Obsolete | INTEL CORP | QFP | 3A991.A.2 | DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE; NUMERIC COPROCESSOR INTERFACE | 8542.31.00.01 | QUAD | 鸥翼 | 0.65 mm | unknown | 100 | R-PQFP-G100 | 不合格 | INDUSTRIAL | 25 MHz | MICROPROCESSOR | 125 mA | 16 | 3.15 mm | 20 | NO | YES | 16 | 固定点 | NO | 0 | 2 | 9 | 4 | 20 mm | 14 mm | |||||||||||
![]() | BCM1280 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | BROADCOM CORP | Obsolete | 无 | 8542.31.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IBM25PPC405CR-3BC266C | IBM | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 316 | BGA | BGA, BGA316,20X20,50 | 66.66 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA316,20X20,50 | SQUARE | 网格排列 | 2.7 V | 2.3 V | 2.5 V | Obsolete | IBM MICROELECTRONICS | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 316 | S-PBGA-B316 | 不合格 | INDUSTRIAL | 266 MHz | MICROPROCESSOR, RISC | 32 | 2.65 mm | 13 | YES | YES | 32 | 固定点 | YES | 27 mm | 27 mm | ||||||||||||||||
![]() | NS32GX32ANU-25 | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | NS32GX32ANU-25 | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 175 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | 网格排列 | 5.5 V | 4.5 V | 5 V | Obsolete | NATIONAL SEMICONDUCTOR CORP | PGA, | 50 MHz | 95 °C | 3A991.A.2 | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | S-CPGA-P175 | 不合格 | OTHER | 25 MHz | MICROPROCESSOR | 700 mA | 32 | 4.699 mm | 32 | NO | NO | 32 | 固定点 | NO | 0 | 3 | |||||||||||||||||||
![]() | STLS2E02 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | STMICROELECTRONICS | Obsolete | 8542.31.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MD8080A-2B | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | 无 | Obsolete | ADVANCED MICRO DEVICES INC | DIP, DIP40,.6 | 125 °C | -55 °C | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | 不合格 | MILITARY | 2.6 MHz | MICROPROCESSOR, RISC | 8 | MIL-STD-883 Class B (Modified) | |||||||||||||||||||||||||||
![]() | SME1430LGA-440 | Sun Microsystems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 587 | 66 MHz | CERAMIC, METAL-SEALED COFIRED | BGA | BGA587,28X28,50 | SQUARE | 网格排列 | 1.96 V | 1.84 V | 1.9 V | Obsolete | SUN MICROSYSTEMS INC | LGA | BGA, BGA587,28X28,50 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 587 | S-CBGA-B587 | 不合格 | 440 MHz | MICROPROCESSOR, RISC | 10500 mA | 64 | 4.35 mm | 32 | YES | NO | 32 | 浮点 | YES | 37.5 mm | 37.5 mm | ||||||||||||||||||
![]() | TMPZ84C011AF-6 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | TOSHIBA CORP | QFP | QFP, | 12.12 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | 5.5 V | 2.7 V | 5 V | 无 | Obsolete | e0 | 锡铅 | 8542.31.00.01 | QUAD | 鸥翼 | 0.65 mm | unknown | 100 | R-PQFP-G100 | 不合格 | INDUSTRIAL | 6.144 MHz | MICROPROCESSOR | 30 mA | 8 | 3.05 mm | 16 | NO | YES | 8 | 固定点 | NO | 0 | 2 | 20 mm | 14 mm | ||||||||||||
![]() | PPC440GX-3CF533C | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 552 | Obsolete | APPLIED MICRO CIRCUITS CORP | BGA | BGA, BGA552,24X24,40 | 83 MHz | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA552,24X24,40 | SQUARE | 网格排列 | 1.6 V | 1.4 V | 1.5 V | 无 | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 未说明 | 552 | S-CBGA-B552 | 不合格 | INDUSTRIAL | 533 MHz | MICROPROCESSOR, RISC | 2200 mA | 32 | 3.977 mm | 64 | YES | NO | 64 | 固定点 | YES | 25 mm | 25 mm | |||||||||||
![]() | TMP19A44F10XBG | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | TOSHIBA CORP | BGA | TFBGA, | 8542.31.00.01 | unknown | 241 | 不合格 | OTHER | MICROCONTROLLER | |||||||||||||||||||||||||||||||||||||||||||||
![]() | HW8076504489901SRH4E | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SIN-21T-1.8-LP | JST Manufacturing | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | I5-3330S | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | Obsolete | INTEL CORP | 8542.31.00.01 | compliant | MICROPROCESSOR | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7455BRX1250PF | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 483 | FREESCALE SEMICONDUCTOR INC | BGA | 29 X 29 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-483 | 133 MHz | 1 | CERAMIC, METAL-SEALED COFIRED | BGA | BGA483,22X22,50 | SQUARE | 网格排列 | 1.6 V | 1.52 V | 1.57 V | 无 | Obsolete | e0 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 1.27 mm | not_compliant | 30 | 483 | S-CBGA-B483 | 不合格 | 1250 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 36 | YES | YES | 64 | 浮点 | YES | 29 mm | 29 mm | |||||||||||||
![]() | XC7455BRX1250PF | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 483 | 133 MHz | CERAMIC, METAL-SEALED COFIRED | BGA | BGA483,22X22,50 | SQUARE | 网格排列 | 1.6 V | 1.52 V | 1.57 V | 无 | Transferred | MOTOROLA INC | 29 X 29 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-483 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | S-CBGA-B483 | 不合格 | 1250 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 36 | YES | YES | 64 | 浮点 | YES | 29 mm | 29 mm | ||||||||||||||||||||
![]() | AV80576LH0256M | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 956 | FBGA | BGA956,44X44,20 | SQUARE | GRID ARRAY, FINE PITCH | 1.2 V | 有 | Obsolete | INTEL CORP | BGA | FBGA, BGA956,44X44,20 | PLASTIC/EPOXY | 无 | 3A991.A.1 | 8542.31.00.01 | BOTTOM | BALL | 0.5 mm | compliant | 8 | S-PBGA-B956 | 不合格 | 1600 MHz | MICROPROCESSOR, RISC | 27000 mA | 64 | ||||||||||||||||||||||||||||
![]() | PC755CMGU400LE | Teledyne e2v | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 360 | Obsolete | E2V TECHNOLOGIES PLC | BGA | BGA, BGA360,19X19,50 | 100 MHz | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA360,19X19,50 | SQUARE | 网格排列 | 2.1 V | 1.8 V | 2 V | 无 | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | compliant | 360 | S-CBGA-B360 | 不合格 | MILITARY | 400 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 32 | YES | YES | 64 | 浮点 | YES | 25 mm | 25 mm | |||||||||||||||
![]() | PC755CMGU400LE | Atmel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 360 | Transferred | ATMEL CORP | BGA | BGA, BGA360,19X19,50 | 100 MHz | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA360,19X19,50 | SQUARE | 网格排列 | 2.1 V | 1.8 V | 2 V | 无 | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 360 | S-CBGA-B360 | 不合格 | MILITARY | 400 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | 32 | YES | YES | 64 | 浮点 | YES | 21 mm | 21 mm | ||||||||||||||
![]() | XPC745BPX350LD | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | Transferred | MOTOROLA INC | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XPC745BPX350LD | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | Transferred | FREESCALE SEMICONDUCTOR INC | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RPIXP2400BBT | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1356 | BGA1356,37X37,40 | SQUARE | 网格排列 | 无 | Obsolete | INTEL CORP | BGA, BGA1356,37X37,40 | 70 °C | PLASTIC/EPOXY | BGA | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1356 | 不合格 | COMMERCIAL | |||||||||||||||||||||||||||||||||||
![]() | P1750A-15CMB | Pyramid Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 64 | PYRAMID SEMICONDUCTOR CORP | DIP | BRAZE, DIP-64 | 15 MHz | 125 °C | -55 °C | UNSPECIFIED | DIP | RECTANGULAR | IN-LINE | 5.5 V | 4.5 V | 5 V | 无 | 活跃 | 无 | 3A001.A.2.C | TWO PROGRAMMABLE TIMERS | 8542.31.00.01 | DUAL | THROUGH-HOLE | 未说明 | 1.27 mm | compliant | 未说明 | 64 | R-XDIP-T64 | 不合格 | MILITARY | 15 MHz | MICROPROCESSOR | 16 | 4.191 mm | 16 | NO | YES | MIL-STD-883 Class B | 16 | 浮点 | NO | 42.2402 mm | 15.24 mm |
XC7451ARX800RE
NXP Semiconductors
分类:Embedded - Microprocessors
STN8810BDS12HPBE
STMicroelectronics
分类:Embedded - Microprocessors
TS80C186EC25
Intel Corporation
分类:Embedded - Microprocessors
BCM1280
Broadcom Limited
分类:Embedded - Microprocessors
IBM25PPC405CR-3BC266C
IBM
分类:Embedded - Microprocessors
NS32GX32ANU-25
National Semiconductor Corporation
分类:Embedded - Microprocessors
NS32GX32ANU-25
Texas Instruments
分类:Embedded - Microprocessors
STLS2E02
STMicroelectronics
分类:Embedded - Microprocessors
MD8080A-2B
AMD
分类:Embedded - Microprocessors
SME1430LGA-440
Sun Microsystems Inc
分类:Embedded - Microprocessors
TMPZ84C011AF-6
Toshiba America Electronic Components
分类:Embedded - Microprocessors
PPC440GX-3CF533C
Applied Micro Circuits Corporation
分类:Embedded - Microprocessors
TMP19A44F10XBG
Toshiba America Electronic Components
分类:Embedded - Microprocessors
HW8076504489901SRH4E
Intel Corporation
分类:Embedded - Microprocessors
SIN-21T-1.8-LP
JST Manufacturing
分类:Embedded - Microprocessors
I5-3330S
Intel Corporation
分类:Embedded - Microprocessors
XC7455BRX1250PF
Freescale Semiconductor
分类:Embedded - Microprocessors
XC7455BRX1250PF
Motorola Semiconductor Products
分类:Embedded - Microprocessors
AV80576LH0256M
Intel Corporation
分类:Embedded - Microprocessors
PC755CMGU400LE
Teledyne e2v
分类:Embedded - Microprocessors
PC755CMGU400LE
Atmel Corporation
分类:Embedded - Microprocessors
XPC745BPX350LD
Motorola Semiconductor Products
分类:Embedded - Microprocessors
XPC745BPX350LD
Freescale Semiconductor
分类:Embedded - Microprocessors
RPIXP2400BBT
Intel Corporation
分类:Embedded - Microprocessors
P1750A-15CMB
Pyramid Semiconductor Corporation
分类:Embedded - Microprocessors
