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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	触点镀层	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量						Core													厂商																																				操作温度	包装	系列	JESD-609代码	无铅代码	温度系数	类型	电阻	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	子类别	额定功率	螺距	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	电阻器类型	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	房屋颜色	工作电源电压	电源	温度等级	电感,电感	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	座位高度-最大
M2S090T-1FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	325-FCBGA (11x13.5)	ARM Cortex M3	微芯片技术	Tray	M2S090	活跃						This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	180	0°C ~ 85°C (TJ)	Tray	SmartFusion2																																166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA											FPGA - 90K Logic Modules			1 Core	512KB
M2S050-1FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	1.14 V	85 °C	有	M2S050-1FCSG325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	1.2000 V	1.14 V	1.26 V	200	Tray	M2S050	0 to 85 °C	Tray	SmartFusion2	e1					Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	0 °C	LG-MIN, WD-MIN	8542.39.00.01				CMOS	BOTTOM	BALL	250	0.5 mm		compliant	40		S-PBGA-B325	200	不合格			1.2 V	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	现场可编程门阵列		1			FPGA - 50K Logic Modules		56340	1 Core	256KB				11 mm	11 mm
M2S025T-1VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-256	256-FPBGA (14x14)	ARM Cortex M3	微芯片技术	活跃					This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	119	138	Tray	M2S025	0°C ~ 85°C (TJ)	Tray	SmartFusion2																																166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA											FPGA - 25K Logic Modules			1 Core	256KB
M2S050TS-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	5.87	1.26 V	MICROSEMI CORP	活跃	SQUARE	BGA	M2S050TS-1FG484	无	85 °C			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	60	267	Tray	M2S050	活跃	FBGA-484	网格排列	3	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0					Tin/Lead (Sn/Pb)				8542.39.00.01				CMOS	BOTTOM	BALL	240	1 mm		not_compliant			S-PBGA-B484	267	不合格				1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列					FPGA - 50K Logic Modules		56340	1 Core	256KB				23 mm	23 mm
M2S050T-VF400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	30	1.14 V	无	M2S050T-VF400I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	90	207	Tray	M2S050	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0					Tin/Lead (Sn/Pb)				8542.39.00.01				CMOS	BOTTOM	BALL	240	0.8 mm		not_compliant			S-PBGA-B400	207	不合格				1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列					FPGA - 50K Logic Modules		56340	1 Core	256KB				17 mm	17 mm
M2S010TS-1VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	VFPBGA-256	YES	256-FPBGA (14x14)	256	ARM Cortex M3	微芯片技术	1.2 V	30	1.14 V	85 °C	无	M2S010TS-1VF256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	119	138	Tray	M2S010	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA256,16X16,32	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0					Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01				CMOS	BOTTOM	BALL	240	0.8 mm		not_compliant			S-PBGA-B256	138	不合格				1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	现场可编程门阵列					FPGA - 10K Logic Modules		12084	1 Core	256KB				14 mm	14 mm
M2S050T-FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	FBGA-484	微芯片技术	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	85 °C	有	M2S050T-FGG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76				This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	60	1.2000 V	267	Tray	M2S050	活跃	0 to 85 °C	Tray	SmartFusion2	e1					Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01				CMOS	BOTTOM	BALL	250	1 mm		compliant			S-PBGA-B484	267	不合格				1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列		STD			FPGA - 50K Logic Modules		56340	1 Core	256KB				23 mm	23 mm
M2S025TS-FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	1.2000 V	1.14 V	1.26 V	267	Tray	M2S025	活跃					60	2308 LAB	有	27696 LE	64 kB	-	-	166 MHz	Details	This product may require additional documentation to export from the United States.	0 to 85 °C	Tray	SmartFusion2																																166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								STD			FPGA - 25K Logic Modules			1 Core	256KB
M2S150TS-FC1152I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1152	YES	1152-FCBGA (35x35)	1152	ARM Cortex M3	微芯片技术	1.2 V	30	1.14 V	无	M2S150TS-FC1152I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.83				This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	24	574	Tray	M2S150	活跃	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0					Tin/Lead (Sn/Pb)				8542.39.00.01				CMOS	BOTTOM	BALL	240	1 mm		not_compliant			S-PBGA-B1152	574	不合格				1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	574	2.9 mm	现场可编程门阵列					FPGA - 150K Logic Modules		146124	1 Core	512KB				35 mm	35 mm
XC7Z015-2CL485I	AMD	数据表	864 In Stock	-	最小起订量: 1 最小包装量: 1	Gold	484-LFBGA, CSPBGA	484-CSPBGA (19x19)	AMD	1.05 V	130	Bulk	XC7Z015	活跃	Industrial grade					Straight	Solder	Thermoplastic	磷青铜	表面贴装		74,000	CSBGA	1.0000 V	0.95 V	130	-20 to 85 °C		Zynq®-7000													1.0000 mm									485				Socket	Black					766MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Industrial	2			Artix™-7 FPGA, 74K Logic Cells	92,400			-		19.7 mm
M2S010TS-1VFG256T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	256-LBGA	256-FPBGA (17x17)	微芯片技术		1.2000 V	138	Tray	M2S010	活跃		40	有	M2S010TS-1VFG256T2	Microsemi Corporation	活跃	MICROSEMI CORP	5.8					0 to 85 °C		Automotive, AEC-Q100, SmartFusion®2	e1	有	100 ppm/K		28 Ohm	Tin/Silver/Copper (Sn/Ag/Cu)						0.5 W					250		通用型	compliant												166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			现场可编程门阵列					1		1	FPGA - 10K Logic Modules				256KB		3.2	2.5
XCVM1302-1LSEVSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		AEC-Q200	+ 100 C	0 C	Xilinx	Xilinx														100 ppm/K		178 Ohm						SOC - Systems on a Chip	0.125 W							通用型									700 mV														System-On-Modules - SOM						1						SoC FPGA	2 mm	1.25 mm
XCVM2502-2HSIVSVC2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		+ 110 C	- 40 C	1	Xilinx	Xilinx														50.0000 ppm/°C		432 Ohm						SOC - Systems on a Chip	0.05 W																880 mV														System-On-Modules - SOM						1						SoC FPGA	6.2
XCVE2102-1LSESFVA784	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		+ 100 C	0 C	1	Xilinx	Xilinx																						SOC - Systems on a Chip	250 mW							High Reliability, MIL-PRF-39017									700 mV														System-On-Modules - SOM						1						SoC FPGA
XCZU55DR-L1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思		活跃						1	Xilinx	Xilinx	-	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC DR			25.0000 ppm/°C		24.9 kOhm						SOC - Systems on a Chip	0.125 W							High Reliability, MIL-PRF-55182													500MHz, 1.2GHz	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									0.1	Zynq® UltraScale+™ RFSoC				-	SoC FPGA	7.62
XCVM1402-2LLEVSVD1760-5157	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		+ 110 C	0 C	1	Xilinx	Xilinx																						SOC - Systems on a Chip	125 mW							High Reliability, MIL-PRF-55182									700 mV														System-On-Modules - SOM						1						SoC FPGA
XCVE1752-3HSEVSVA1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		+ 100 C	0 C	1	Xilinx	Xilinx																						SOC - Systems on a Chip																	880 mV			15 nH											System-On-Modules - SOM	5				4 GHz							SoC FPGA	1.8	1.25 mm
XCVE2002-1LSESBVA625	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		+ 100 C	0 C	1	Xilinx	Xilinx														100.0000 ppm/°C		150 kOhm						SOC - Systems on a Chip	1.0000 W							Industrial									700 mV														System-On-Modules - SOM						2						SoC FPGA	9.53
XCVE2102-2MSISBVA625	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		SMD	Fundamental	表面贴装	+ 110 C		- 40 C	1	Xilinx	Xilinx								27 MHz	0 to 50 °C						Crystal							SOC - Systems on a Chip											2						800 mV														System-On-Modules - SOM		40 Ohm										SoC FPGA
XCVE2102-1MSESBVA484	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		SMD	Fundamental	表面贴装	+ 100 C		0 C	1	Xilinx	Xilinx								24 MHz	-40 to 85 °C						Crystal							SOC - Systems on a Chip											2						800 mV														System-On-Modules - SOM		40 Ohm										SoC FPGA
XCVE1752-2LLEVSVA1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD 赛灵思	Tray	活跃						700 V	+ 110 C	0 C	1	Xilinx		Xilinx	500	0°C ~ 100°C (TJ)		Versal™ AI Core											SOC - Systems on a Chip																	700 mV				450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA				System-On-Modules - SOM							Versal™ AI Core FPGA, 1M Logic Cells				-	SoC FPGA
XCVE2002-1MSISBVA484	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		+ 110 C	- 40 C	1	Xilinx	Xilinx														200 ppm/K		143 Ohm						SOC - Systems on a Chip	0.05 W							通用型									800 mV														System-On-Modules - SOM						1						SoC FPGA	0.6	0.3
XCVM2502-3HSEVSVC2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		+ 100 C	0 C	1	Xilinx	Xilinx														25 ppm/°C		9.76 kOhm						SOC - Systems on a Chip	0.15 W							高可靠性									880 mV														System-On-Modules - SOM						0.1						SoC FPGA	2.03	1.27
XCVM2502-1MSEVSVC2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		+ 100 C	0 C	1	Xilinx	Xilinx																						SOC - Systems on a Chip	500 mW							High Reliability, MIL-PRF-39017									800 mV														System-On-Modules - SOM						2						SoC FPGA
XCZU65DR-L2FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1						1	Xilinx	Xilinx																		SOC - Systems on a Chip																																										SoC FPGA