N/A

-

50 microinches Gold Plate

Wall - Front Mount - Thru Holes

不锈钢

Hard Dielectric

53#20

I

H53

Copper Alloy

有

Socket

Meets IP67

化学镍

N/A

-

484-BFBGA, FCBGA

484-FCBGA (19x19)

ITT Cannon, LLC

Bulk

KPSE

活跃

MCU - 136, FPGA - 108

-40°C ~ 125°C (TJ)

KPSE

-

230.4KB

RISC-V

DMA, PCI, PWM

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 23K Logic Modules

128KB

N/A

-

625-BFBGA, FCBGA

625-FCBGA (21x21)

ITT Cannon, LLC

Bulk

MIK0

活跃

180

0°C ~ 100°C (TJ)

*

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

N/A

-

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

82

Tray

XCZU2

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

N/A

-

Gold

自由悬挂

484-BBGA, FCBGA

66

484-FCBGA (23x23)

AMD

Bulk

XC7Z030

活跃

Non-Compliant

130

-40°C ~ 100°C (TJ)

Bulk

Zynq®-7000

Crimp

Plug

66

175 °C

-65 °C

Male

Threaded

66

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 125K Logic Cells

-

Shielded

抗环境干扰

N/A

-

225-LFBGA, CSPBGA

225-CSPBGA (13x13)

AMD

54

Tray

XC7Z007

活跃

-40°C ~ 100°C (TJ)

Zynq®-7000

766MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 23K Logic Cells

-

N/A

-

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

Non-Compliant

180

Tray

XCZU3

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

N/A

-

表面贴装

4-SMD, No Lead

1156-FCBGA (35x35)

AMD

328

Tray

XCZU9

活跃

-20°C ~ 70°C

Tape & Reel (TR)

SiT8208

0.106 L x 0.094 W (2.70mm x 2.40mm)

活跃

XO (Standard)

3.3V

16MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

31mA

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

--

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

0.032 (0.80mm)

--

N/A

-

484-BFBGA, FCBGA

484-UBGA (19x19)

192

Non-Compliant

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

160000 LE

0.423288 oz

1

SMD/SMT

20000 LAB

964673

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

FPGA - 160K Logic Elements

2 Core

--

SoC FPGA

N/A

-

表面贴装

Radial, Can - SMD

485-CSPBGA (19x19)

0.260 L x 0.260 W (6.60mm x 6.60mm)

United Chemi-Con

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

6.3 V

2000 Hrs @ 105°C

150

XC7Z012

-55°C ~ 105°C

Alchip™- MZA

0.248 Dia (6.30mm)

±20%

汽车

100 µF

-

-

Polar

360 mOhms

667MHz

256KB

96 mA @ 120 Hz

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

240 mA @ 100 kHz

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

Artix™-7 FPGA, 55K Logic Cells

-

0.240 (6.10mm)

AEC-Q200

N/A

-

表面贴装

SC-74A, SOT-753

SOT-25-5

Torex Semiconductor Ltd

Tape & Reel (TR)

XC6124

活跃

328

-40°C ~ 85°C (TA)

-

看门狗电路

开路漏极或开路集电极

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

低电平有效

MCU, FPGA

1.8V

1

400ms Typical

1

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

N/A

-

-

-

TE Connectivity Deutsch 连接器

Bag

DIV43E19

活跃

768

-40°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

N/A

-

表面贴装

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Samtec Inc.

Strip

SEAM8-30

10mm

活跃

644

0°C ~ 100°C (TJ)

SEARAY™ SEAM

High Density Array, Male

300

10

0.031 (0.80mm)

Gold

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

电路板指南

30.0µin (0.76µm)

0.297 (7.54mm)

N/A

-

400-LFBGA, CSPBGA

400-CSPBGA (17x17)

AMD

130

Tray

XC7Z010

活跃

0°C ~ 100°C (TJ)

Zynq®-7000

766MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 28K Logic Cells

-

N/A

-

-

-

Intel

744

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

N/A

-

-

-

Intel

Non-Compliant

744

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

N/A

-

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD 赛灵思

561

活跃

0°C ~ 100°C (TJ)

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

通孔

Radial

900-FCBGA (31x31)

Polypropylene (PP), Metallized

AMD

--

2500V (2.5kV)

204

Tray

XCZU15

活跃

900V

-55°C ~ 110°C

Tray

MKP385

1.024 L x 0.236 W (26.00mm x 6.00mm)

±5%

活跃

--

PC引脚

DC Link, DC Filtering; High Frequency, Switching; High Pulse, DV/DT

620pF

0.886 (22.50mm)

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

--

0.472 (12.00mm)

--

N/A

-

表面贴装

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

Compliant

360

Tray

XCZU7

活跃

100 V

100 V

0°C ~ 100°C (TJ)

Tape & Reel

Zynq® UltraScale+™ MPSoC EV

SMD/SMT

125 °C

-55 °C

4.3 pF

810 µm

1608

0603

C0G

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

1.6 mm

812.8 µm

889 µm

无

N/A

-

N/A

-

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

MCU - 208, FPGA - 385

FBGA-1152

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

1.15 V

未说明

1.12 V

100 °C

有

5ASTFD5G3F35I3N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.18 V

5.29

-40°C ~ 100°C (TJ)

Tray

Arria V ST

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

1 mm

compliant

5ASTFD5

S-PBGA-B1152

385

INDUSTRIAL

1.05GHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

385

17434 CLBS

2.7 mm

现场可编程门阵列

FPGA - 462K Logic Elements

17434

462000

--

35 mm

35 mm

N/A

-

484-FBGA

YES

484-UBGA (19x19)

484

MCU - 151, FPGA - 66

FBGA, BGA484,22X22,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA484,22X22,32

1.1 V

未说明

1.07 V

85 °C

有

5CSEBA4U19C7SN

FBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

5.58

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

S-PBGA-B484

66

不合格

1.1,1.2/3.3,2.5 V

OTHER

800MHz

64KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

66

1.9 mm

现场可编程门阵列

FPGA - 40K Logic Elements

40000

--

19 mm

19 mm

N/A

-

1152-BBGA, FCBGA

1152-FBGA (35x35)

欧姆龙自动化与安全

Bulk

3Z4S-LE

活跃

384

Non-Compliant

0°C ~ 100°C (TJ)

Tray

*

Discontinued at Digi-Key

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 270K Logic Elements

--

N/A

-

Axial

Axial

Vishay Dale

2 x 32 kB

-

Bulk

RN55

活跃

492

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

+ 100 C

- 40 C

24

SMD/SMT

82500 LAB

965020

Intel

Intel / Altera

Arria 10 SoC

Details

-65°C ~ 175°C

Tray

Military, MIL-R-10509/7, RN55

0.090 Dia x 0.240 L (2.29mm x 6.10mm)

±1%

活跃

2

±50ppm/°C

69.8 Ohms

Metal Film

0.125W, 1/8W

SOC - Systems on a Chip

950 mV

-

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

FPGA - 660K Logic Elements

2 Core

--

Flame Retardant Coating, Military, Moisture Resistant, Safety

SoC FPGA

-

N/A

-

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

Non-Compliant

574

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-