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类别是'category.片上系统（SoC）' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 越来越多的功能 | 触点形状 | 外壳材料 | 供应商器件包装 | 材料 | 插入材料 | 厂商 | Voltage-Input | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 湿度敏感性等级(MSL) | 连接器类型 | 类型 | 电阻 | 定位的数量 | 最高工作温度 | 最小工作温度 | 颜色 | 性别 | 紧固类型 | 触点类型 | 方向 | 屏蔽/屏蔽 | 入口保护 | 外壳完成 | 引脚数量 | 外壳尺寸-插入 | 终端样式 | 接头数量 | 房屋颜色 | 输出类型 | 工作电源电压 | 电路 | 注意 | 界面 | 端口的数量 | 速度 | 内存大小 | 外壳尺寸，MIL | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 数据总线宽度 | 包括 | 电压-负荷 | 速度等级 | 负载电流 | 主要属性 | 闪光大小 | 特征 | 产品长度(mm) | 产品高度(mm) | 材料可燃性等级 | 辐射硬化 | ||||||||||||||||||
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 | XCVE1752-1LSENSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-2LSEVFVC1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 532 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1802-1MSIVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-2MLIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Gold | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 692 | Tray | 活跃 | AMD | Straight | 58(mm) | Panel | Brass | -40°C ~ 100°C (TJ) | Versal™ AI Core | M/F | 9/4(POS) | 1(Port) | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | 32.8(mm) | 16(mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3CG-L1UBVA530I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU1CG-2SBVA484E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | - | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1702-1LSENSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1802-2MSIVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| QLS1046MN1T144AFN3 | Teledyne LeCroy | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-2MLEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-1UBVA530E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-2MLEVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU42DR-2FSVE1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| UPD60802F1-A11-BND-E2-A | Renesas | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 面板安装 | Bulkhead - Front Side Nut | Circular | 铝合金 | Plastic | Renesas Electronics America Inc | -- | 22D | Bulk | 活跃 | -65°C ~ 200°C | Bulk | MIL-DTL-38999 Series III, DTS | 活跃 | -- | 插座外壳 | 用于公引脚 | 128 | Threaded | Crimp | D | Shielded | 抗环境干扰 | 化学镍 | 25-35 | Silver | 不包括触点 | -- | -- | -- | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-3FBG676E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | Plastic, ABS/PC Blend | Thumb-2 | 1.2, 3.3 V | 2 | 130 | Tray | XC7Z045 | 活跃 | AMD | -- | DMB-4774 | 0 to 100 °C | DMB | -- | 活跃 | Cover, Lid | Clear | 676 | 5.25, 4.75, 5 V | 1GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 350K Logic Cells | - | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU9CG-1FFVC900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | DIN Rail | Module | -- | Tray | XCZU9 | 活跃 | AMD | 0.8500 V | 0.808 V | 0.892 V | 204 | 18 ~ 36VAC | -40 to 100 °C | Bulk | DR | 活跃 | 螺旋端子 | AC | SPST-NO (1 Form A) | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 24V ~ 280V | 1 | 3A | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-1MSINSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1369-BFBGA | 1369-BGA (35x35) | AMD | Non-Compliant | 424 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Tape & Reel | Versal™ Prime | 20 % | 1 kΩ | 125 °C | -55 °C | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-1MSIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU1CG-1SBVA484E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | Non-Compliant | - | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU1CG-1SFVA625I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | Non-Compliant | - | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-1MSEVFVC1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-1MSIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | 活跃 | -40°C ~ 100°C (TJ) | * | Obsolete | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU1CG-2SFVA625E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | - | Tray | 活跃 | 0°C ~ 100°C (TJ) | * | 活跃 | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-1MSEVFVC1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 532 | Tray | 活跃 | 0°C ~ 100°C (TJ) | * | 活跃 | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1502-1LSIVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 586 | Tray | 活跃 | -40°C ~ 100°C (TJ) | * | 活跃 | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 80k Logic Cells | - |
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XCVE1752-1LSENSVG1369
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1302-2LSEVFVC1596
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1802-1MSIVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1902-2MLIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU3CG-L1UBVA530I
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU1CG-2SBVA484E
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1702-1LSENSVG1369
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1802-2MSIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
-
QLS1046MN1T144AFN3
Teledyne LeCroy
分类:Embedded - System On Chip (SoC)
-
XCVC1902-2MLEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU2EG-1UBVA530E
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1902-2MLEVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU42DR-2FSVE1156E
AMD
分类:Embedded - System On Chip (SoC)
-
UPD60802F1-A11-BND-E2-A
Renesas
分类:Embedded - System On Chip (SoC)
-
XC7Z045-3FBG676E
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU9CG-1FFVC900I
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1402-1MSINSVF1369
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1402-1MSIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU1CG-1SBVA484E
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU1CG-1SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1802-1MSEVFVC1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1902-1MSIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU1CG-2SFVA625E
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1302-1MSEVFVC1596
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1502-1LSIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)