类别是'category.FPGA 评估板' (3802)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 传播延迟 | 连接方式 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 筛选水平 | 速度等级 | 输出功能 | 收发器数量 | 宏细胞数 | 主要属性 | CLB-Max的组合延时 | 逻辑块数量 | JTAG BST | 逻辑单元数 | 核数量 | 等效门数 | 系统内可编程 | 闪光大小 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||||||||||||
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![]() | M2S010TS-1VF400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | GRID ARRAY, LOW PROFILE, FINE PITCH | 微芯片技术 | 1.26 V | 1.2 V | 30 | 1.2000 V | 1.14 V | 1.26 V | 195 | Tray | M2S010 | 活跃 | - | 166 MHz | 12084 LE | SMD/SMT | - | 64 kB | 1.14 V | M2S010TS-1VF400I | 无 | 活跃 | MICROSEMI CORP | VFBGA-400 | 5.86 | PLASTIC/EPOXY | LFBGA | SQUARE | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.51 mm | 现场可编程门阵列 | 1 | FPGA - 10K Logic Modules | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150TS-FCS536 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | 微芯片技术 | 活跃 | Non-Compliant | M2GL150TS-FCS536 | 无 | 活跃 | MICROSEMI CORP | BGA, | 5.27 | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.26 V | 1.14 V | 1.2 V | 20 | 293 | Tray | M2GL150 | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B536 | OTHER | 现场可编程门阵列 | 146124 | 5120000 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1A3P400-1FG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 1.425 V | M1A3P400-1FG484I | 无 | Obsolete | MICROSEMI CORP | BGA, | 5.25 | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.575 V | 1.5 V | 30 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 不合格 | INDUSTRIAL | 9216 CLBS, 400000 GATES | 2.44 mm | 现场可编程门阵列 | 9216 | 400000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150TS-FC1152 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 表面贴装 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 微芯片技术 | 1.14 V | 1.26 V | Non-Compliant | 574 | Tray | M2GL150 | 活跃 | 1.14 V | M2GL150TS-FC1152 | 无 | 活跃 | MICROSEMI CORP | BGA, BGA1152,34X34,40 | 5.27 | 85 °C | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 20 | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | OTHER | 574 | 2.9 mm | 现场可编程门阵列 | 146124 | 5120000 | STD | 146124 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150-1FCSG536 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | 微芯片技术 | 5.77 | FBGA-536 | MICROSEMI CORP | 活跃 | 有 | M2S150-1FCSG536 | 293 | Tray | M2S150 | 活跃 | 1.14 V | - | 166 MHz | 146124 LE | - | 64 kB | 40 | 1.2 V | 1.26 V | 网格排列 | SQUARE | BGA536,30X30,20 | BGA | PLASTIC/EPOXY | 85 °C | 3 | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | compliant | S-PBGA-B536 | 293 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL050T-FG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | Tray | M2GL050 | 活跃 | SQUARE | 网格排列 | 1.26 V | 1.14 V | 1.2 V | 20 | BGA484,22X22,40 | BGA | PLASTIC/EPOXY | 3 | 5.27 | BGA, BGA484,22X22,40 | MICROSEMI CORP | 活跃 | 无 | M2GL050T-FG484I | 267 | -40°C ~ 100°C (TJ) | IGLOO2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 267 | 2.44 mm | 现场可编程门阵列 | 56340 | 1869824 | STD | 56340 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL050-1FCS325 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | 微芯片技术 | M2GL050 | 活跃 | 1.14 V | SQUARE | 网格排列 | 1.26 V | 1.2 V | 20 | M2GL050-1FCS325 | 无 | 活跃 | MICROSEMI CORP | 11 X 11 MM, 0.50 MM PITCH, FBGA-325 | 5.27 | 85 °C | PLASTIC/EPOXY | BGA | BGA325,21X21,20 | 200 | Tray | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 200 | 不合格 | 1.2 V | OTHER | 200 | 现场可编程门阵列 | 56340 | 1869824 | 56340 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025TS-VF400 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | LFBGA, BGA400,20X20,32 | 5.27 | 207 | Tray | M2GL025 | 活跃 | 27696 LE | + 85 C | 0 C | SMD/SMT | 1.14 V | 85 °C | PLASTIC/EPOXY | LFBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.26 V | 1.2 V | 20 | M2GL025TS-VF400 | 无 | 活跃 | MICROSEMI CORP | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 1.2 V | OTHER | 207 | 1.51 mm | 现场可编程门阵列 | 27696 | 1130496 | 4 Transceiver | 27696 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050-1FG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 85 °C | 3 | 微芯片技术 | 5.84 | FBGA-484 | MICROSEMI CORP | 活跃 | 无 | M2S050-1FG484 | 1.2000 V | 267 | Tray | M2S050 | 活跃 | - | 166 MHz | 56340 LE | SMD/SMT | - | 64 kB | 1.14 V | 30 | 1.2 V | 1.26 V | 网格排列 | SQUARE | BGA484,22X22,40 | BGA | PLASTIC/EPOXY | 0 to 85 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | 1 | FPGA - 50K Logic Modules | 48672 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||
![]() | M2S050-FG896 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 896-BGA | YES | 896-FBGA (31x31) | 896 | 3 | 85 °C | PLASTIC/EPOXY | BGA | 微芯片技术 | BGA896,30X30,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 30 | 1.2000 V | 1.14 V | 1.26 V | 377 | Tray | M2S050 | 活跃 | - | 166 MHz | 56340 LE | SMD/SMT | - | 64 kB | 1.14 V | M2S050-FG896 | 无 | 活跃 | MICROSEMI CORP | BGA, BGA896,30X30,40 | 5.3 | 0 to 85 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | 896 | S-PBGA-B896 | 377 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | 现场可编程门阵列 | STD | FPGA - 50K Logic Modules | 48672 | 1 Core | 256KB | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||
![]() | XC6VHX565T-2FF1924I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1924 | 网格排列 | 1.05 V | 1 V | 未说明 | 0.95 V | XC6VHX565T-2FF1924I | 无 | 活跃 | XILINX INC | BGA | FBGA-1924 | 5.23 | 1286 MHz | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1924,44X44,40 | SQUARE | e0 | 无 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 1924 | S-PBGA-B1924 | 640 | 不合格 | 1,1.2/2.5 V | INDUSTRIAL | 640 | 3.85 mm | 现场可编程门阵列 | 4.29 ns | 566784 | 45 mm | 45 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC2VPX20-6FFG896C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 896 | SQUARE | 网格排列 | 1.575 V | 1.5 V | 30 | Non-Compliant | 1.425 V | XC2VPX20-6FFG896C | 有 | Obsolete | XILINX INC | BGA | 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FCBGA-896 | 5.78 | 1200 MHz | 4 | 85 °C | PLASTIC/EPOXY | BGA | BGA896,30X30,40 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | not_compliant | 896 | S-PBGA-B896 | 552 | 不合格 | 1.5,1.5/3.3,2/2.5,2.5 V | OTHER | 552 | 2448 CLBS | 3.4 mm | 现场可编程门阵列 | 0.32 ns | 2448 | 22032 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC95288-20BGG352I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 352 | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 5.5 V | 5 V | 30 | 4.5 V | XC95288-20BGG352I | 有 | Obsolete | XILINX INC | BGA | LBGA, | 5.62 | 50 MHz | 3 | 192 | 85 °C | -40 °C | PLASTIC/EPOXY | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 352 | S-PBGA-B352 | 不合格 | INDUSTRIAL | 20 ns | 0 DEDICATED INPUTS, 192 I/O | 1.7 mm | 闪存 PLD | MACROCELL | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV1000E-7BGG560I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 560 | 1.8 V | 30 | 1.71 V | XCV1000E-7BGG560I | 有 | Obsolete | XILINX INC | BGA | BGA-560 | 5.81 | 400 MHz | 3 | PLASTIC/EPOXY | LBGA | BGA560,33X33,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 560 | S-PBGA-B560 | 404 | 不合格 | 1.2/3.6,1.8 V | 404 | 6144 CLBS, 331776 GATES | 1.7 mm | 现场可编程门阵列 | 0.42 ns | 6144 | 27648 | 331776 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV600E-6HQG240I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | XILINX INC | QFP | HLFQFP, HQFP240,1.37SQ,20 | 5.53 | 3 | PLASTIC/EPOXY | HLFQFP | HQFP240,1.37SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | XCV600E-6HQG240I | 有 | 活跃 | e3 | Matte Tin (Sn) | QUAD | 鸥翼 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 158 | 不合格 | 1.2/3.6,1.8 V | 158 | 现场可编程门阵列 | 15552 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV300E-7FGG456I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 456 | 1.89 V | 1.8 V | 30 | Compliant | 1.71 V | XCV300E-7FGG456I | 有 | Obsolete | XILINX INC | BGA | FBGA-456 | 5.8 | 400 MHz | 3 | PLASTIC/EPOXY | BGA | BGA456,22X22,40 | SQUARE | 网格排列 | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 100 °C | -40 °C | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | unknown | 456 | S-PBGA-B456 | 312 | 不合格 | 1.8 V | 1.2/3.6,1.8 V | 16 kB | 312 | 1536 CLBS, 82944 GATES | 2.6 mm | 现场可编程门阵列 | 7 | 0.42 ns | 1536 | 6912 | 82944 | 23 mm | 23 mm | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCS30XL-3BGG256I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | XCS30XL-3BGG256I | 有 | Obsolete | XILINX INC | BGA | BGA, | 5.82 | 3 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 3.6 V | 3.3 V | 30 | 3 V | e1 | 有 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 250 | 1.27 mm | compliant | 256 | S-PBGA-B256 | 不合格 | 576 CLBS, 10000 GATES | 3.5 mm | 现场可编程门阵列 | 576 | 10000 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC3142A-3PP132C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 132 | SQUARE | PGA132,14X14 | PGA | PLASTIC/EPOXY | 4.75 V | XC3142A-3PP132C | 无 | Obsolete | XILINX INC | PGA | PGA, PGA132,14X14 | 8.73 | 270 MHz | 1 | 85 °C | 未说明 | 5 V | 5.25 V | 网格排列 | TYP. GATES = 2000-3000 | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 225 | 2.54 mm | unknown | 132 | S-PPGA-P132 | 96 | 不合格 | 5 V | OTHER | 96 | 144 CLBS, 2000 GATES | 4.191 mm | 现场可编程门阵列 | 2.7 ns | 144 | 144 | 2000 | 37.084 mm | 37.084 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV1000-4BGG560I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 560 | 2.375 V | 30 | 2.5 V | 2.625 V | GRID ARRAY, LOW PROFILE | SQUARE | LBGA | PLASTIC/EPOXY | 3 | 250 MHz | 5.8 | LBGA, | BGA | XILINX INC | Obsolete | 有 | XCV1000-4BGG560I | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 560 | S-PBGA-B560 | 不合格 | 6144 CLBS, 1124022 GATES | 1.7 mm | 现场可编程门阵列 | 0.8 ns | 6144 | 1124022 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC6VSX475T-3FFG1759C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1759 | XC6VSX475T-3FFG1759C | 有 | 活跃 | XILINX INC | 42.50 X 42.50 MM, LEAD FREE, FBGA-1759 | 5.27 | 4 | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.05 V | 1 V | 30 | 0.95 V | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1 mm | not_compliant | S-PBGA-B1759 | OTHER | 37200 CLBS | 3.5 mm | 现场可编程门阵列 | 0.59 ns | 37200 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC3190A-1TQ144C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | FLATPACK, LOW PROFILE, FINE PITCH | 5.25 V | 5 V | 30 | 4.75 V | XC3190A-1TQ144C | 无 | Obsolete | XILINX INC | QFP | PLASTIC, TQFP-144 | 5.8 | 323 MHz | 3 | 85 °C | PLASTIC/EPOXY | LFQFP | QFP144,.87SQ,20 | SQUARE | e0 | 无 | Tin/Lead (Sn85Pb15) | MAX USABLE 6000 LOGIC GATES | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 0.5 mm | not_compliant | 144 | S-PQFP-G144 | 122 | 不合格 | 5 V | OTHER | 122 | 320 CLBS, 5000 GATES | 1.6 mm | 现场可编程门阵列 | 1.75 ns | 320 | 320 | 5000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC4VFX140-11FFG1760I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1760 | 1.2 V | 30 | 1.14 V | XC4VFX140-11FFG1760I | 有 | 活跃 | XILINX INC | BGA | 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760 | 5.24 | 1205 MHz | 4 | PLASTIC/EPOXY | BGA | BGA1760,42X42,40 | SQUARE | 网格排列 | 1.26 V | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 245 | 1 mm | not_compliant | 1760 | S-PBGA-B1760 | 896 | 不合格 | 1.2,1.2/3.3,2.5 V | 896 | 15792 CLBS | 3.5 mm | 现场可编程门阵列 | 15792 | 142128 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC3142A-4PG132B | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 132 | Obsolete | XILINX INC | PGA | PGA, | 5.77 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | 网格排列 | 5 V | Military grade | XC3142A-4PG132B | 3A001.A.2.C | 3000 LOGIC GATES CAN ALSO BE USED | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 132 | S-CPGA-P132 | 不合格 | MILITARY | 144 CLBS, 2000 GATES | 4.318 mm | 现场可编程门阵列 | MIL-STD-883 Class B | 3.3 ns | 144 | 2000 | 37.084 mm | 37.084 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC9536XV-7PCG44I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | LDCC44,.7SQ | SQUARE | CHIP CARRIER | 2.62 V | 2.5 V | 40 | 2.37 V | XC9536XV-7PCG44I | 有 | Obsolete | XILINX INC | LCC | QCCJ, LDCC44,.7SQ | 5.66 | 3 | 34 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | e3 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | J BEND | 245 | 1.27 mm | compliant | 44 | S-PQCC-J44 | 不合格 | 1.8/3.3,2.5 V | INDUSTRIAL | 7.5 ns | 0 DEDICATED INPUTS, 34 I/O | 4.57 mm | 闪存 PLD | MACROCELL | 36 | YES | YES | 16.5862 mm | 16.5862 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC6VSX475T-2FF1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1156 | 网格排列 | 1.05 V | 1 V | 未说明 | 0.95 V | XC6VSX475T-2FF1156I | 无 | 活跃 | XILINX INC | BGA | BGA, BGA1156,34X34,40 | 5.22 | 1286 MHz | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | SQUARE | e0 | 无 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 1156 | S-PBGA-B1156 | 600 | 不合格 | 1,1.2/2.5 V | INDUSTRIAL | 600 | 3.5 mm | 现场可编程门阵列 | 4.29 ns | 476160 | 35 mm | 35 mm |
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