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产品型号	品牌	数据表	库存	价格(含增值税)	数量	底架	安装类型	包装/外壳	表面安装	越来越多的功能	引脚数	外壳材料	供应商器件包装	材料	房屋材料	形状	终端数量													厂商																													操作温度	包装	系列	尺寸/尺寸	容差	JESD-609代码	无铅代码	零件状态	终止次数	终端	ECCN 代码	温度系数	连接器类型	类型	电阻	定位的数量	端子表面处理	最高工作温度	最小工作温度	组成	颜色	功率(瓦特)	HTS代码	电容量	紧固类型	子类别	额定电流	螺距	技术	电压 - 供电	端子位置	方向	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	入口保护	端子间距	Reach合规守则	基本部件号	外壳完成	外壳尺寸-插入	JESD-30代码	输出的数量	资历状况	房屋颜色	输出类型	工作电源电压	失败率	电源	温度等级	界面	镀层	内存大小	附着方法	连接器样式	速度	内存大小	外壳尺寸，MIL	配件类型	核心处理器	周边设备	程序内存大小	连接方式	建筑学	数据总线宽度	输入数量	产品类别	包括	最高频率	波长	逻辑块数(LABs)	速度等级	转换自(适配器端)	闪光大小	外壳尺寸-插入（从转换）	接近检测
10AS027H2F34I2SG	ALTERA	数据表	502 In Stock	1: ¥16,376.768795 10: ¥15,838.267690 25: ¥15,728.170502 50: ¥15,618.838630 查看所有的价格 -	最小起订量: 1 最小包装量: 1	FBGA-1152	YES		1152	384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	270000 LE	1	SMD/SMT	33750 LAB	964971	Intel	Intel / Altera		Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS027H2F34I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.43									-40°C ~ 100°C (TJ)	Tray	Arria 10 SX				活跃															8542.39.00.01			SOC - Systems on a Chip			CMOS		BOTTOM		BALL		未说明		1 mm	compliant				S-PBGA-B1152	384	不合格					0.9 V	INDUSTRIAL					1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		384		3.65 mm	现场可编程门阵列			SoC FPGA				FPGA - 270K Logic Elements		270000	2 Core	--			SoC FPGA	35 mm	35 mm
5ASXMB3E4F31C5N	ALTERA	数据表	3 In Stock	-	最小起订量: 1 最小包装量: 1	896-BBGA, FCBGA	YES	896-FBGA (31x31)	896	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.13 V	5.28									Compliant	MCU - 208, FPGA - 250	BGA, BGA896,30X30,40	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	1.1 V	未说明	1.07 V	85 °C	有	5ASXMB3E4F31C5N		BGA	0°C ~ 85°C (TJ)	Tray	Arria V SX			e1		活跃									Tin/Silver/Copper (Sn/Ag/Cu)					8542.39.00.01								BOTTOM		BALL		未说明		1 mm	compliant	5ASXMB3			S-PBGA-B896	540							商业扩展					800MHz	64KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		540	13207 CLBS	2.7 mm	现场可编程门阵列												FPGA - 350K Logic Elements	13207	350000		--							31 mm	31 mm
5ASXMB5E4F31C4N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BBGA, FCBGA	YES	896-FBGA (31x31)	896	生命周期结束	INTEL CORP	1.13 V	5.28									MCU - 208, FPGA - 250	BGA, BGA896,30X30,40	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	1.1 V	未说明	1.07 V	85 °C	有	5ASXMB5E4F31C4N	BGA		SQUARE	Intel Corporation	0°C ~ 85°C (TJ)	Tray	Arria V SX			e1		活跃									Tin/Silver/Copper (Sn/Ag/Cu)													BOTTOM		BALL		未说明		1 mm	compliant	5ASXMB5			S-PBGA-B896	540							商业扩展					925MHz	64KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		540	17434 CLBS	2.7 mm	现场可编程门阵列												FPGA - 462K Logic Elements	17434	462000		--							31 mm	31 mm
5CSEMA5U23I7N	ALTERA	数据表	2711 In Stock	1: ¥2,091.882011 10: ¥1,973.473595 100: ¥1,861.767546 500: ¥1,756.384475 查看所有的价格 -	最小起订量: 1 最小包装量: 1	表面贴装	672-FBGA	YES	672-UBGA (23x23)	672	Intel Corporation	活跃	INTEL CORP	1.13 V	5.2								200 V	Compliant	MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32	1.1 V	未说明	1.07 V	有	5CSEMA5U23I7N		FBGA	SQUARE	-40°C ~ 100°C (TJ)	Tape & Reel (TR)	Cyclone® V SE		1 %			活跃										125 °C	-55 °C			8542.39.00.01	10 pF		现场可编程门阵列			CMOS		BOTTOM		BALL		未说明		0.8 mm	compliant	5CSEMA5			S-PBGA-B672	145	不合格					1.1,1.2/3.3,2.5 V						800MHz	64KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145		1.85 mm	现场可编程门阵列												FPGA - 85K Logic Elements		85000		--							1.016 mm	508 µm		609.6 µm
5CSEBA5U19A7N	ALTERA	数据表	2670 In Stock	1: ¥2,171.344984 10: ¥2,048.438663 100: ¥1,932.489301 500: ¥1,823.103116 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-FBGA	YES	484	484-UBGA (19x19)	484	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	2.03								MCU - 151, FPGA - 66	Compliant	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32	-40 °C	1.1 V	未说明	1.07 V	125 °C	有		5CSEBA5U19A7N	-40°C ~ 125°C (TJ)	Tray	Automotive, AEC-Q100, Cyclone® V SE					活跃										125 °C	-40 °C			8542.39.00.01			现场可编程门阵列			CMOS		BOTTOM		BALL		未说明		0.8 mm	compliant	5CSEBA5			S-PBGA-B484	66	不合格			1.13 V		1.1,1.2/3.3,2.5 V	AUTOMOTIVE			556.3 kB			700MHz	64KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		66		1.9 mm	现场可编程门阵列		85000			800 MHz		32075	7				FPGA - 85K Logic Elements		85000		--							19 mm	19 mm
XCZU9CG-1FFVC900E	AMD	数据表	587 In Stock	1: ¥19,930.984154 10: ¥19,275.613303 25: ¥19,141.621945 50: ¥19,008.562012 查看所有的价格 -	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD		204	Tray	XCZU9	活跃										0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																																																			500MHz, 1.2GHz	256KB			Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA													1				Zynq®UltraScale+™ FPGA, 599K+ Logic Cells				-
M2S005S-1VFG256T2	Microchip	数据表	28 In Stock	1: ¥412.582613 10: ¥389.228881 100: ¥367.197055 500: ¥346.412320 查看所有的价格 -	最小起订量: 1 最小包装量: 1	256-LBGA	256-FPBGA (17x17)	微芯片技术				161	Tray	M2S005	活跃	,	40	有	M2S005S-1VFG256T2	Microsemi Corporation	活跃	MICROSEMI CORP	5.8								-40°C ~ 125°C (TJ)		Automotive, AEC-Q100, SmartFusion®2			e1	有										Tin/Silver/Copper (Sn/Ag/Cu)																	250			compliant																	166MHz	64KB			ARM® Cortex®-M3	-		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					现场可编程门阵列								1				FPGA - 5K Logic Modules				128KB
A2F500M3G-1PQG208	Microchip	数据表	2305 In Stock	1: ¥934.987249 10: ¥882.063439 100: ¥832.135322 500: ¥785.033325 查看所有的价格 -	最小起订量: 1 最小包装量: 1	208-BFQFP	208-PQFP (28x28)	微芯片技术		MCU - 22, FPGA - 66	Tray	A2F500	活跃										0°C ~ 85°C (TJ)		SmartFusion®																																																			100MHz	64KB			ARM® Cortex®-M3	DMA, POR, WDT		Ethernet, I²C, SPI, UART/USART	MCU, FPGA													1				ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops				512KB
XCZU4CG-L2SFVC784E	AMD	数据表	146 In Stock	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD		252	Tray	XCZU4	活跃										0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																																																			500MHz, 1.2GHz	256KB			Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA													2L				Zynq®UltraScale+™ FPGA, 192K+ Logic Cells				-
XCZU46DR-L2FSVH1760I	AMD	数据表	571 In Stock	1: ¥296,337.849638 10: ¥286,593.665027 25: ¥284,601.454845 50: ¥282,623.093194 查看所有的价格 -	最小起订量: 1 最小包装量: 1	表面贴装	6-WDFN	6-DFN (2x2)	ams欧司朗								Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;	Obsolete	574			-30°C ~ 70°C		-											Ambient																2.7V ~ 3.6V															SMBus									533MHz, 1.333GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA											640nm						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-				无
XCZU7EV-L2FFVC1156E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Free Hanging (In-Line)	1156-BBGA, FCBGA	-	铝合金	1156-FCBGA (35x35)	ITT Cannon, LLC		50V	Bulk	Metal	CA310	活跃	Silver	360							-55°C ~ 125°C		MIL-DTL-5015, CA							Crimp			Plug, Male Pins			10					橄榄色				Threaded		22A					N (Normal)	-		IP65 - Dust Tight, Water Resistant				橄榄色镉	18-19														533MHz, 600MHz, 1.3GHz	256KB	-		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA																	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				-							Shrink Boot Adapter									-
XCZU48DR-L1FSVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	PEI-Genesis	366											Bulk	活跃	-40°C ~ 100°C (TJ)		*																																																			500MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA																	Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU46DR-2FSVH1760E	AMD	数据表	542 In Stock	1: ¥219,453.038825 10: ¥212,236.981454 25: ¥210,761.649905 50: ¥209,296.573890 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD		--	574	Tray	活跃										0°C ~ 100°C (TJ)		--					活跃																																														533MHz, 1.333GHz	256KB		--	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA																	Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU5EG-3FBVB900E	AMD	数据表	759 In Stock	1: ¥31,952.076928 10: ¥30,901.428361 25: ¥30,686.622008 50: ¥30,473.308846 查看所有的价格 -	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD		204	Tray	XCZU5	活跃										0°C ~ 100°C (TJ)		*					活跃																																														600MHz, 1.5GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA													3				Zynq®UltraScale+™ FPGA, 256K+ Logic Cells				-
XAZU3EG-1SBVA484Q	AMD	数据表	152 In Stock	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	AMD		128	Tray	XAZU3	活跃										-40°C ~ 125°C (TJ)		*					活跃																																														500MHz, 1.2GHz	1.8MB			Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™	DMA, WDT		CANbus, I²C, SPI, UART/USART, USB	MPU, FPGA																	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells				-
LS1046AMN3T1A	Teledyne LeCroy	数据表	N/A	-	最小起订量: 1 最小包装量: 1
XC7Z007S-1CLG225I	AMD	数据表	101 In Stock	-	最小起订量: 1 最小包装量: 1	225-LFBGA, CSPBGA	225-CSPBGA (13x13)	铍铜	--	AMD								54	Tray	XC7Z007	活跃		121°C		插槽安装					活跃						Fingerstock																																					Zinc + Clear Chromate	Slot		667MHz	256KB			Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA																	Artix™-7 FPGA, 23K Logic Cells				-										0.130 (3.30mm)		0.975 (24.77mm)	0.370 (9.40mm)	299.21µin (7.60µm)
XCVM1502-2LSEVSVA2197	AMD	数据表	980 In Stock	1: ¥75,906.666295 10: ¥73,410.702415 25: ¥72,900.399613 50: ¥72,393.644107 查看所有的价格 -	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	活跃											608	Tray			Versal™ Prime																																																			450MHz, 1.08GHz	256KB			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA																	Versal™ Prime FPGA, 1M Logic Cells				-
AGFA006R24C3E3E	Intel	数据表	541 In Stock	1: ¥46,463.827102 10: ¥44,936.003003 25: ¥44,623.637541 50: ¥44,313.443432 查看所有的价格 -	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃											576	Tray	0°C ~ 100°C (TJ)		Agilex F																																																			1.4GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA																	FPGA - 573K Logic Elements				-
MPFS025T-1FCSG325T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Free Hanging (In-Line)	325-TFBGA	-	325-BGA (11x11)	Thermoplastic	Amphenol LTW								-	Bulk	YAA	活跃	MCU - 102, FPGA - 80	-		M12																						Threaded		-							Unshielded	IP68 - Dust Tight, Waterproof									-									Distributor Y-Shaped	-	230.4KB			RISC-V	DMA, PCI, PWM		CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA									-					公引脚	Female Sockets (2)	-	FPGA - 23K Logic Modules				128KB	6	A	M12		A	6 (2)	联接螺母	M12									-
XCVM1502-1LSEVFVC1760	AMD	数据表	999 In Stock	1: ¥56,564.245431 10: ¥54,704.299256 25: ¥54,324.031044 50: ¥53,946.406194 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	Glenair	378											零售包装	活跃	0°C ~ 100°C (TJ)		*																																																			400MHz, 1GHz	256KB			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA																	Versal™ Prime FPGA, 1M Logic Cells				-
XCZU7EG-3FBVB900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD		204	Tray	XCZU7	活跃										0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																																			600MHz, 667MHz, 1.5GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA																	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				-
XCZU47DR-1FSVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	活跃											366	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																																																			500MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA																	Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
MIMX8MQ7DVAJZAB	NXP	数据表	N/A	-	最小起订量: 1 最小包装量: 1	IC Socket Adapters																											SIP Sockets Adapters														2.54mm Pitch																						Serial I2C/PCIe/SPI/														64 Bit					188																							SIP Sockets Adapters
M2S150TS-1FC1152M	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Axial	YES	Axial	1152	1.14 V	Vishay Dale	125 °C	无	M2S150TS-1FC1152M	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.84									Tape & Reel (TR)	RNC55	活跃	574	FBGA-1152	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-55 °C	1.2 V	30	-65°C ~ 175°C		Military, MIL-PRF-55182/01, RNC55	0.094 Dia x 0.250 L (2.39mm x 6.35mm)	±1%	e0			2		3A001.A.2.C	±25ppm/°C			3.65 kOhms		Tin/Lead (Sn/Pb)		Metal Film		0.125W, 1/8W	8542.39.00.01			现场可编程门阵列			CMOS		BOTTOM		BALL		240		1 mm	not_compliant				S-PBGA-B1152	574	不合格				S (0.001%)	1.2 V	MILITARY					166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		574		2.9 mm	现场可编程门阵列												FPGA - 150K Logic Modules		146124		512KB		Military, Moisture Resistant, Weldable				-	35 mm	35 mm