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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	安装类型	包装/外壳	表面安装	引脚数	供应商器件包装	房屋材料	终端数量	触点材料 - 配套	触点材料 - 柱子	板材																		厂商																																		操作温度	包装	系列	JESD-609代码	湿度敏感性等级(MSL)	终端	端子表面处理	组成	附加功能	HTS代码	子类别	技术	端子位置	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	额定电流	间距 - 配套	引脚数量	JESD-30代码	输出的数量	资历状况	接头数量	触点表面处理 - 柱子	输出类型	工作电源电压	电源	温度等级	界面	速度	内存大小	核心处理器	周边设备	连接方式	建筑学	数据总线宽度	输入数量	产品类别	总 RAM 位数	最高频率	筛选水平	速度等级	端子柱长度	间距--柱子	转换自(适配器端)	转换（适配器端）
XCZU2CG-L1SFVC784I	AMD	数据表	2365 In Stock	1: ¥2,439.440354 10: ¥2,301.358823 100: ¥2,171.093228 500: ¥2,048.201162 查看所有的价格 -	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	0.8500 V	252	Tray	XCZU2	活跃										DH227NRKV	Cutler Hammer, Div of Eaton Corp	-40 to 100 °C		Zynq® UltraScale+™ MPSoC CG																														500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									1L					Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			-
XCZU11EG-1FFVF1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	0.8500 V	464	Tray	XCZU11	活跃										139394	Schneider	-40 to 100 °C		Zynq® UltraScale+™ MPSoC EG																														500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									1					Zynq®UltraScale+™ FPGA, 653K+ Logic Cells			-		Inverted Flare
XAZU2EG-1SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD	活跃										31004	Greenlee	128	Tray	XAZU2	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																														500MHz, 1.2GHz	1.2MB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, I²C, SPI, UART/USART, USB	MPU, FPGA														Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			-
XAZU3EG-1SFVA625I	AMD	数据表	769 In Stock	1: ¥4,905.283846 10: ¥4,627.626271 100: ¥4,365.685161 500: ¥4,118.570903 查看所有的价格 -	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD								E57LBL30A2SP	10 mm	Cutler Hammer, Div of Eaton Co	0.8500 V	0.808 V	0.892 V	128	Tray	XAZU3	活跃			-40 to 100 °C		Zynq® UltraScale+™ MPSoC EG													Shielded						625						NC					500MHz, 1.2GHz	1.8MB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, I²C, SPI, UART/USART, USB	MPU, FPGA									1					Zynq®UltraScale+™ FPGA, 154K+ Logic Cells			-		3 Pin Micro Pigtail					AC			30 mm
XCZU11EG-3FFVB1517E	AMD	数据表	642 In Stock	1: ¥61,650.244616 10: ¥59,623.060555 25: ¥59,208.600358 50: ¥58,797.021203 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	ILME	488	Tray	XCZU11	活跃										TCHI-24	CE, cURus	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG						Non-Metallic																	None (Housing Only)							600MHz, 667MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					104mm x 27mm									Zynq®UltraScale+™ FPGA, 653K+ Logic Cells			-						-40-90 °C
XCZU4EV-1SFVC784I	AMD	数据表	987 In Stock	1: ¥12,324.458278 10: ¥11,919.205299 25: ¥11,836.350842 50: ¥11,754.072333 查看所有的价格 -	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD					31008805000	Pfannenberg	0.892 V	0.808 V	0.8500 V	252	Tray	XCZU4	活跃						-40 to 100 °C		Zynq® UltraScale+™ MPSoC EV																														500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									1					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells			-
XCZU17EG-2FFVE1924I	AMD	数据表	890 In Stock	1: ¥58,288.105249 10: ¥56,371.475096 25: ¥55,979.617771 50: ¥55,590.484384 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1924-BBGA, FCBGA	1924-FCBGA (45x45)	AMD					313902	PILZ	0.85 V	0.808 V	0.892 V	668	Tray	XCZU17	活跃						-40 to 100 °C		Zynq® UltraScale+™ MPSoC EG																			1924											533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									2					Zynq®UltraScale+™ FPGA, 926K+ Logic Cells			-
XCZU5CG-2FBVB900E	AMD	数据表	845 In Stock	1: ¥18,338.081047 10: ¥17,735.088055 25: ¥17,611.805419 50: ¥17,489.379756 查看所有的价格 -	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD		PDG53K0800E2NM	CE, CSA, UL	Cutler Hammer, Div of Eaton Corp	Panel	204	Tray	XCZU5	活跃									0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																	800 A													533MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA														Zynq®UltraScale+™ FPGA, 256K+ Logic Cells			-
M2S025-VF400	Microchip	数据表	2007 In Stock	1: ¥830.912887 10: ¥783.880080 100: ¥739.509511 500: ¥697.650484 查看所有的价格 -	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	微芯片技术	30	1.14 V	85 °C	无	M2S025-VF400	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.87								1.2000 V	1.14 V	1.26 V	207	Tray	M2S025	活跃	-	166 MHz	27696 LE	-	64 kB	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	0 to 85 °C		SmartFusion®2	e0				Tin/Lead (Sn/Pb)			8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL		240	0.8 mm	not_compliant				S-PBGA-B400	160	不合格				1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		160	1.51 mm	现场可编程门阵列						STD					FPGA - 25K Logic Modules	23988	1 Core	256KB							17 mm	17 mm
M2S060TS-1FCSG325	Microchip	数据表	2584 In Stock	1: ¥1,431.555744 10: ¥1,350.524290 100: ¥1,274.079514 500: ¥1,201.961804 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	325-FCBGA (11x11)	微芯片技术	-	166 MHz	56520 LE	-	64 kB									1.2 V	1.14 V	1.26 V	Compliant	200	Tray	M2S060	活跃	0 to 85 °C		SmartFusion®2																														166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									1					FPGA - 60K Logic Modules		1 Core	256KB
XCVE1752-1LLIVSVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD	活跃										500	Tray	-40°C ~ 100°C (TJ)		Versal™ AI Core																														400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA														Versal™ AI Core FPGA, 1M Logic Cells			-
AGFB019R25A2E2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃										480	Tray	0°C ~ 100°C (TJ)		Agilex F																														1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA														FPGA - 1.9M Logic Elements			-
10AS027E4F29E3LG	ALTERA	数据表	890 In Stock	1: ¥9,935.972333 10: ¥9,609.257578 25: ¥9,542.460353 50: ¥9,476.127459 查看所有的价格 -	最小起订量: 1 最小包装量: 1	FBGA-780	YES	780	1.2 GHz	270000 LE	1	SMD/SMT	33750 LAB	964940	Intel / Altera	Arria 10 SoC	Details		2 x 32 kB	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	0.9 V	未说明	0.87 V	100 °C	有	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.43									PDG21M0150TFFJ	CE, CSA, UL	Cutler Hammer, Div of Eaton Corp	Panel	360	有	This product may require additional documentation to export from the United States.	2 x 32 kB	0°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃						8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL		未说明	1 mm	compliant	150 A		S-PBGA-B780	360	不合格					0.9 V	OTHER		1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		360	3.35 mm	现场可编程门阵列		SoC FPGA								FPGA - 270K Logic Elements	270000	2 Core	--		SoC FPGA						29 mm	29 mm
M2S010TS-FG484	Microchip	数据表	31 In Stock	1: ¥725.351589 10: ¥684.293954 100: ¥645.560330 500: ¥609.019179 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	484-BGA	YES	484-FPBGA (23x23)	484	30	微芯片技术	1.14 V	85 °C	无	M2S010TS-FG484	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.86							Non-Compliant	233	Tray	M2S010	活跃	-	166 MHz	12084 LE	-	64 kB	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	0°C ~ 85°C (TJ)		*	e0	活跃			Tin/Lead (Sn/Pb)			8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL		240	1 mm	not_compliant				S-PBGA-B484	233	不合格				1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		233	2.44 mm	现场可编程门阵列											FPGA - 10K Logic Modules	12084	1 Core	256KB							23 mm	23 mm
M2S090-FCSG325I	Microchip	数据表	2229 In Stock	1: ¥2,579.387259 10: ¥2,433.384206 100: ¥2,295.645477 500: ¥2,165.703276 查看所有的价格 -	最小起订量: 1 最小包装量: 1	通孔	325-TFBGA, FCBGA	YES	20	325-FCBGA (11x13.5)	--	325	--	Brass	FR4 Epoxy Glass	微芯片技术	TFBGA	M2S090-FCSG325I	有	-	166 MHz	86316 LE	SMD/SMT	-	64 kB		--	--	180	Tray	M2S090	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	5.74	1.26 V	MICROSEMI CORP	活跃	Microsemi Corporation	RECTANGULAR	--		Correct-A-Chip® 352000	e1	活跃	--	Solder	Tin/Silver/Copper (Sn/Ag/Cu)		LG-MIN, WD-MIN	8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL		250	0.5 mm	compliant	1A	0.050 (1.27mm)		R-PBGA-B325	180	不合格	Tin-Lead			1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		180	1.16 mm	现场可编程门阵列							0.125 (3.18mm)	0.100 (2.54mm)	PLCC	DIP, 0.3 (7.62mm) Row Spacing	FPGA - 90K Logic Modules	86316	1 Core	512KB		--					13.5 mm	11 mm	--	--	--
XCZU2CG-2SFVA625E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Panel Mount, Bulkhead	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD	XCZU2	活跃									180	Tray	0°C ~ 100°C (TJ)		USBF电视		活跃																												533MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										2		USB - A, Receptacle	USB - A, Receptacle	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			-
XCZU4CG-1SFVC784E	AMD	数据表	971 In Stock	1: ¥7,796.768018 10: ¥7,540.394605 25: ¥7,487.978750 50: ¥7,435.927263 查看所有的价格 -	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD			252	Tray	XCZU4	活跃								0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																														500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA														Zynq®UltraScale+™ FPGA, 192K+ Logic Cells			-
XCZU5EG-2SFVC784E	AMD	数据表	799 In Stock	1: ¥16,584.877579 10: ¥16,039.533444 25: ¥15,928.037183 50: ¥15,817.315968 查看所有的价格 -	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD			252	Tray	XCZU5	活跃								0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																														533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA														Zynq®UltraScale+™ FPGA, 256K+ Logic Cells			-
XCZU17EG-3FFVB1517E	AMD	数据表	591 In Stock	1: ¥66,848.792531 10: ¥64,650.669760 25: ¥64,201.260930 50: ¥63,754.976098 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD			644	Tray	XCZU17	活跃								0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																														600MHz, 667MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA														Zynq®UltraScale+™ FPGA, 926K+ Logic Cells			-
XCZU4EG-L2SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD			252	Tray	XCZU4	活跃								0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																														533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA														Zynq®UltraScale+™ FPGA, 192K+ Logic Cells			-
XCVM1802-2LSEVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	活跃										ACH550-BCR-032A-6+B058	ABB	Panel, Wall	726	Tray	0°C ~ 100°C (TJ)		Versal™ Prime																														450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								60 Hz						Versal™ Prime FPGA, 1.9M Logic Cells			-	断路器			575 VAC					IP58
M2S010-1VF256	Microchip	数据表	146 In Stock	1: ¥337.113569 10: ¥318.031672 100: ¥300.029878 500: ¥283.047053 查看所有的价格 -	最小起订量: 1 最小包装量: 1	256-LFBGA	YES	256-FPBGA (14x14)	256	1.14 V	微芯片技术	85 °C	无	M2S010-1VF256	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	2.49								138	Tray	M2S010	活跃	-	166 MHz	12084 LE	SMD/SMT	-	64 kB	LFBGA, BGA256,16X16,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	30	0°C ~ 85°C (TJ)		SmartFusion®2	e0				Tin/Lead (Sn/Pb)		LG-MIN, WD-MIN	8542.39.00.01	现场可编程门阵列	CMOS	BOTTOM	BALL		240	0.8 mm	not_compliant				S-PBGA-B256	138	不合格				1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		138	1.56 mm	现场可编程门阵列			400Kbit								FPGA - 10K Logic Modules	12084	1 Core	256KB							14 mm	14 mm
XCZU47DR-1FFVE1156E	AMD	数据表	786 In Stock	1: ¥99,174.965791 10: ¥95,913.893412 25: ¥95,247.163271 50: ¥94,585.067797 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	活跃										366	Tray	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																														500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA														Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-
XCZU43DR-2FFVG1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD								RISC	1.8/2.5/3.3 V	FCBGA	6	有	表面贴装	561	Tray	活跃	Industrial grade			-40 to 100 °C		Zynq® UltraScale+™ RFSoC																			1517							3.3 V			CAN/Serial I2C/SPI/U	533MHz, 1.333GHz	256 KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	64 Bit							Industrial						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-								ARM Cortex-A53/ARM Cortex-R5
XCZU47DR-2FFVE1156E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	活跃										366	Tray	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																														533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA														Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-