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类别是'category.片上系统（SoC）' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 触点镀层 | 包装/外壳 | 供应商器件包装 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | 温度系数 | 类型 | 电阻 | 性别 | 子类别 | 额定功率 | 电阻器类型 | 引脚数量 | 工作电源电压 | 速度 | 内存大小 | 电缆长度 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 数据总线宽度 | 产品类别 | 运行时间 | 筛选水平 | 速度等级 | 电阻公差 | 主要属性 | 寄存器数量 | 触点排列 | 闪光大小 | 产品类别 | 产品长度 | 产品宽度 | 设备核心 | |||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | XCVC1502-2MSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | 活跃 | Non-Latching | 0.5 Vdc | Palladium Ruthenium/Gold | 60/62.5 W/VA | 178 Ohm | 表面贴装 | Tray | -40 to 85 °C | * | 信号继电器 | 1 ms | SPST-NO | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-1MLINSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Gold | 1369-BFBGA | 1369-BGA (35x35) | AMD | 活跃 | Crimp | 26 AWG | 磷青铜 | 316 | Tray | -55 to 150 °C | Versal™ Prime | Receptacle | 600MHz, 1.3GHz | - | 0.45 m | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||
| M2S005-1TQ144I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 144-LQFP | 144-TQFP (20x20) | 微芯片技术 | Tray | Obsolete | 84 | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-2MSEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | Tray | 活跃 | 726 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-1LLIVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | Tray | 活跃 | 500 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU5EV-L2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU5 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU1CG-L1UBVA494I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 494-WFBGA, FCBGA | 494-FCBGA (14x14) | AMD | Tray | 82 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| SOM-2533AN0C-S0A1 | Advantech Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Module | 8 | 0°C ~ 60°C | Box | SMARC | 活跃 | 3.4GHz | 4GB | Intel® N50 | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | MPU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AMA3B1KK-KQR-B0 | Ambiq Micro, Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 64-WFQFN Exposed Pad | 64-QFN (8x8) | 37 | -40°C ~ 85°C (TA) | Tape & Reel (TR);Cut Tape (CT);Digi-Reel® | Apollo3 Blue | 活跃 | 96MHz | 384KB | ARM® Cortex®-M4F | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | I2C, SPI, UART/USART | MCU | 1MB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA023R24C3E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA006R24C2I1VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 576 | -40°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA008R24C2E1VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 576 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFD019R31C2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGIB019R18A2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1805-BBGA Exposed Pad | 1805-BGA (42.5x42.5) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGIA035R39A2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 3.54M Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z100-1FF900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | RISC | 1.5, 2, 2.5 V | FBGA | 2 | CAN/I2C/SPI/UART | 130 | Tray | XC7Z100 | 活跃 | Straight | Solder | 法兰安装 | -40 to 100 °C | Zynq®-7000 | Plug | 900 | 1, 1.8 V | 667MHz | 256 KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 444K Logic Cells | - | 86.1 mm | ARM Cortex A9 | ||||||||||||||||||||||||||||||||||||||
| XA7Z010-1CLG400I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | AMD | RISC | 1.8, 3.3 V | CSBGA | 1 | CAN/GPIO/SPI/UART | 表面贴装 | 130 | Tray | 活跃 | -40 to 100 °C | Automotive, AEC-Q100, Zynq®-7000 XA | 400 | 1 V | 667MHz | 256 KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Artix™-7 FPGA, 28K Logic Cells | - | ARM Cortex A9 | |||||||||||||||||||||||||||||||||||||||||||
| AGIA040R39A1I2VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 4.047M Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z035-1FFG900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 0.95 V | 362 | 1.05 V | 表面贴装 | 130 | Tray | XC7Z035 | 活跃 | Industrial grade | 275,000 | FCBGA | 1.0000 V | -40 to 100 °C | Zynq®-7000 | 900 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | ||||||||||||||||||||||||||||||||||||||||
| AGFA023R31C3E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB023R31C2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| R8A77970LA01BA#GB | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Tray | 活跃 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGIC035R39A2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 3.54M Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM2902-1LSEVFVF1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Xilinx | + 100 C | 0 C | 1 | Xilinx | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-2LLEVFVC1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD 赛灵思 | 1 | Xilinx | Xilinx | 532 | Tray | 活跃 | + 110 C | 0 C | 0°C ~ 100°C (TJ) | Versal™ Prime | 50 ppm/°C | 162 kOhm | SOC - Systems on a Chip | 0.25 W | 高可靠性 | 700 mV | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | 1 | Versal™ Prime FPGA, 70k Logic Cells | - | SoC FPGA | 3.2 | 1.6 |
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XCVC1502-2MSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
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XCVM1302-1MLINSVF1369
AMD
分类:Embedded - System On Chip (SoC)
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M2S005-1TQ144I
Microchip
分类:Embedded - System On Chip (SoC)
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XCVM1802-2MSEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1902-1LLIVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU5EV-L2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU1CG-L1UBVA494I
AMD
分类:Embedded - System On Chip (SoC)
-
SOM-2533AN0C-S0A1
Advantech Corp
分类:Embedded - System On Chip (SoC)
-
AMA3B1KK-KQR-B0
Ambiq Micro, Inc.
分类:Embedded - System On Chip (SoC)
-
AGFA023R24C3E3V
Intel
分类:Embedded - System On Chip (SoC)
-
AGFA006R24C2I1VB
Intel
分类:Embedded - System On Chip (SoC)
-
AGFA008R24C2E1VB
Intel
分类:Embedded - System On Chip (SoC)
-
AGFD019R31C2E3V
Intel
分类:Embedded - System On Chip (SoC)
-
AGIB019R18A2I3E
Intel
分类:Embedded - System On Chip (SoC)
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AGIA035R39A2E3E
Intel
分类:Embedded - System On Chip (SoC)
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XC7Z100-1FF900I
AMD
分类:Embedded - System On Chip (SoC)
-
XA7Z010-1CLG400I
AMD
分类:Embedded - System On Chip (SoC)
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AGIA040R39A1I2VB
Intel
分类:Embedded - System On Chip (SoC)
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XC7Z035-1FFG900I
AMD
分类:Embedded - System On Chip (SoC)
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AGFA023R31C3E3V
Intel
分类:Embedded - System On Chip (SoC)
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AGFB023R31C2E3E
Intel
分类:Embedded - System On Chip (SoC)
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R8A77970LA01BA#GB
Renesas Electronics Corporation
分类:Embedded - System On Chip (SoC)
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AGIC035R39A2E3E
Intel
分类:Embedded - System On Chip (SoC)
-
XCVM2902-1LSEVFVF1760
Xilinx
分类:Embedded - System On Chip (SoC)
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XCVM1302-2LLEVFVC1596
Xilinx
分类:Embedded - System On Chip (SoC)