类别是'category.电信接口IC' (8324)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 通道数量 | 模拟 IC - 其他类型 | 操作模式 | 可调阈值 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 筛选水平 | 通信IC类型 | 收发器数量 | 过滤器 | 压缩法 | 负电源电压 | 增益公差-最大 | 线性编码 | 长度 | 宽度 | |||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | TJA1100HN | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 36 | NXP SEMICONDUCTORS | HVQFN-36 | 1 | 125 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | LCC36,.24SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.8 V | 有 | 不推荐 | 3.3V NOMINAL SUPPLY ALSO AVAILABLE | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 0.5 mm | compliant | 30 | S-PQCC-N36 | AUTOMOTIVE | 27 mA | 100000 Mbps | 1 mm | AEC-Q100 | 以太网收发器 | 1 | 6 mm | 6 mm | ||||||||||||||||||||||||
![]() | PCA82C250/N4 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | 125 °C | -40 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | Obsolete | NXP SEMICONDUCTORS | DIP | DIP, | e3/e4 | TIN/NICKEL PALLADIUM GOLD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 8 | R-PDIP-T8 | 不合格 | AUTOMOTIVE | 4.2 mm | 电路接口 | 9.5 mm | 7.62 mm | |||||||||||||||||||||||||||||
![]() | SA636BS | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | Obsolete | NXP SEMICONDUCTORS | QFN | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT917-1, HVQFN-20 | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | VQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, VERY THIN PROFILE | 3 V | 有 | 8542.39.00.01 | QUAD | 无铅 | 未说明 | 1 | 0.5 mm | compliant | 未说明 | 20 | S-PQCC-N20 | 不合格 | INDUSTRIAL | 1 mm | 电信电路 | 4 mm | 4 mm | ||||||||||||||||||||||||||
![]() | TJA1043TK | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 14 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | RECTANGULAR | DILCC14,.12x0.18,25 | HVSON | PLASTIC/EPOXY | 有 | 活跃 | NXP SEMICONDUCTORS | HVSON, DILCC14,.12x0.18,25 | 5 V | EAR99 | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.65 mm | compliant | R-PDSO-N14 | 109 mA | 5000 Mbps | 1 mm | AEC-Q100 | 电路接口 | 1 | 4.5 mm | 3 mm | ||||||||||||||||||||||||||||||
![]() | AMMP-6429-TR1G | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | BROADCOM LTD | , | 8542.39.00.01 | compliant | 射频和基带电路 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1029TK | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 12 V | HVSON, | NXP SEMICONDUCTORS | 活跃 | 有 | 1 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | EAR99 | 8542.39.00.01 | DUAL | 无铅 | 未说明 | 1 | 0.65 mm | compliant | 未说明 | S-PDSO-N8 | 1 mm | AEC-Q100 | 电路接口 | 3 mm | 3 mm | |||||||||||||||||||||||||||||||
![]() | TJA1049TK/3 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 5 V | 活跃 | NXP SEMICONDUCTORS | HVSON, | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | EAR99 | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.65 mm | unknown | S-PDSO-N8 | 1 mm | AEC-Q100 | 电路接口 | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||
![]() | TP3070V-XG | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | NATIONAL SEMICONDUCTOR CORP | PLASTIC, LCC-28 | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | 5 V | 无 | Transferred | e0 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | QUAD | J BEND | 220 | 1 | 1.27 mm | not_compliant | 30 | S-PQCC-J28 | 不合格 | INDUSTRIAL | SYNCHRONOUS | 0.013 mA | 4.57 mm | 可编程解码器 | YES | A/MU-LAW | -5 V | 0.15 dB | 不提供 | 11.43 mm | 11.43 mm | |||||||||||||||||||
![]() | SI32280-A-ZM2R | Silicon Laboratories Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2019-10-25 | Transferred | SILICON LABORATORIES INC | , | 8542.39.00.01 | unknown | 数码单反 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | QN9021/DY | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 4 Weeks | Obsolete | NXP SEMICONDUCTORS | SOT617-13 | 3 | 有 | 5A992 | 8542.31.00.01 | 260 | compliant | 未说明 | 电信电路 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | MWCT1001AVLH | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 4 Weeks | YES | 64 | NXP SEMICONDUCTORS | LQFP-64 | 3 | 105 °C | -40 °C | PLASTIC/EPOXY | LQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, LOW PROFILE | 3.3 V | +2.73V | 有 | 不推荐 | e3 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | compliant | 40 | S-PQFP-G64 | 3.6 V | 2.7 V | 54 | 电源管理电路 | YES | 1.6 mm | AEC-Q100 | 10 mm | 10 mm | ||||||||||||||||||||
![]() | TISP61089BDR | Power Innovations International, Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | SOP | RECTANGULAR | 小概要 | Transferred | POWER INNOVATIONS LTD | SOP, | 85 °C | -40 °C | PLASTIC/EPOXY | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | R-PDSO-G8 | 不合格 | INDUSTRIAL | 1.75 mm | 浪涌保护电路 | 4.9 mm | 3.905 mm | ||||||||||||||||||||||||||||||||||
![]() | TISP61089BDR | JW Miller | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | Transferred | POWER INNOVATIONS LTD | SOIC | SOP, | 85 °C | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | 不合格 | INDUSTRIAL | 1.75 mm | 浪涌保护电路 | 4.9 mm | 3.905 mm | ||||||||||||||||||||||||||||||||
![]() | PEF4265VV22 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2017-10-28 | Obsolete | INTEL CORP | , | compliant | SLIC | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1057GTK/3 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | HVSON, | 150 °C | -40 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.12,25 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | 有 | 活跃 | NXP SEMICONDUCTORS | 8542.39.00.01 | DUAL | 无铅 | 未说明 | 1 | 0.65 mm | compliant | 未说明 | S-PDSO-N8 | 70 mA | 5000 Mbps | 1 mm | AEC-Q100 | CAN FD TRANSCEIVER | 1 | 3 mm | 3 mm | |||||||||||||||||||||||||||
![]() | WPCS4223C.A2-900369 | Marvell Technology Group Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AK2301A-E1 | Asahi Kasei Microsystems Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | FX102LG | CML Innovative Technologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | D-1633N | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1100HN | Nexperia | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM84898B0KFEBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SIM7600SA-H-PCIE | SIMCom | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM15KA1HH0H285D | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM87400A1KRFBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TXC-02050-CIPL | Transwitch Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 |
TJA1100HN
NXP Semiconductors
分类:Interface - Telecom
PCA82C250/N4
NXP Semiconductors
分类:Interface - Telecom
SA636BS
NXP Semiconductors
分类:Interface - Telecom
TJA1043TK
NXP Semiconductors
分类:Interface - Telecom
AMMP-6429-TR1G
Broadcom Limited
分类:Interface - Telecom
TJA1029TK
NXP Semiconductors
分类:Interface - Telecom
TJA1049TK/3
NXP Semiconductors
分类:Interface - Telecom
TP3070V-XG
National Semiconductor Corporation
分类:Interface - Telecom
SI32280-A-ZM2R
Silicon Laboratories Inc
分类:Interface - Telecom
QN9021/DY
NXP Semiconductors
分类:Interface - Telecom
MWCT1001AVLH
NXP Semiconductors
分类:Interface - Telecom
TISP61089BDR
Power Innovations International, Inc.
分类:Interface - Telecom
TISP61089BDR
JW Miller
分类:Interface - Telecom
PEF4265VV22
Intel Corporation
分类:Interface - Telecom
TJA1057GTK/3
NXP Semiconductors
分类:Interface - Telecom
WPCS4223C.A2-900369
Marvell Technology Group Ltd
分类:Interface - Telecom
AK2301A-E1
Asahi Kasei Microsystems Corporation
分类:Interface - Telecom
FX102LG
CML Innovative Technologies
分类:Interface - Telecom
D-1633N
Intel Corporation
分类:Interface - Telecom
TJA1100HN
Nexperia
分类:Interface - Telecom
BCM84898B0KFEBG
Broadcom Limited
分类:Interface - Telecom
SIM7600SA-H-PCIE
SIMCom
分类:Interface - Telecom
BCM15KA1HH0H285D
Broadcom Limited
分类:Interface - Telecom
BCM87400A1KRFBG
Broadcom Limited
分类:Interface - Telecom
TXC-02050-CIPL
Transwitch Corporation
分类:Interface - Telecom
