类别是'category.电信接口IC' (8324)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 材料 | 终端数量 | 第一种连接器安装类型 | 电缆材料 | Air permeability | Application area | Cable | Cable length mm | Cable type | Capacitance tolerance | Capacitors series | Case - inch | Case - mm | Colour | Date Of Intro | Diameter after shrinking | Function - Audible | Function - Lighting | Gain dB | Gross weight | Gross Weight | Heatsink shape | Height mm | Impedance Ω | Inner diameter | Installation height | Kind of capacitor | Length (inch) | Length mm | Material finishing | Maximum power | Maximum Power | Metal thickness | Mounting hole size | Mounting method | Operating frequency MHz | Operating Frequency Range | Operating temperature °C | Plate thickness | Purpose | Range of action km | Shrinkage temperature | Shrinking diameter | Thickness after shrinking | Thickness mm | Thread pitch | Transport package size/quantity | Transport packaging size/quantity | Transport Packaging size/quantity | Type of capacitor | Type of heatsink | Width mm | Operating temperature | 操作温度 | 包装 | 系列 | 容差 | JESD-609代码 | 无铅代码 | 零件状态 | ECCN 代码 | Connector type | 连接器类型 | 类型 | 电阻 | 定位的数量 | 端子表面处理 | 颜色 | HTS代码 | 电容量 | 电压 - 供电 | 端子位置 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度(摄氏度) | 功能数量 | 入口保护 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | 终端样式 | JESD-30代码 | 资历状况 | 电介质 | 线规 | 温度等级 | 极化 | 阻抗 | Number of ports | Cable length | 电缆长度 | 操作模式 | 电源电流-最大值 | 使用方法 | 数据率 | 座位高度-最大 | 带宽 | Operating temperature range | 工作温度范围 | 第一个连接器性别 | 第一个连接器加载的位置数 | 第一种连接器类型 | 第一个连接器的位置数 | 装配配置 | 增益 | 第二个连接器类型 | 第一个连接器外壳尺寸 - 插入 | Frequency range | 筛选水平 | 通信IC类型 | 收发器数量 | Antenna type | 天线类型 | Shrinkage ratio | 电压驻波比 | 第二个连接器加载的位置数 | Outer diameter | 过滤器 | 压缩法 | 灯型 | 饱和电流 | 负电源电压 | 堆栈数 | 浅色系 | Operating voltage | Port type | 增益公差-最大 | 线性编码 | 高度 | 长度 | 宽度 | ||||||||||||||||||||||
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![]() | MGA-43040-TR1G | Avago Technologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | AVAGO TECHNOLOGIES INC | HVBCC, | UNSPECIFIED | HVBCC | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | Obsolete | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.5 mm | unknown | S-XBCC-B28 | 0.91 mm | 电信电路 | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM20715A1KUBXG | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | Galvanized steel | 42 | M3 | 4.22 +0.08 mm | 0.42 | 活跃 | d1 = 4.20 mm | t = 0.98 mm | 1.0 mm | INFINEON TECHNOLOGIES AG | WLBGA-42 | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.22 V | 0.5 | 28.5*21*19/2000 | BOTTOM | BALL | 1 | 0.4 mm | compliant | R-PBGA-B42 | OTHER | 0.6 mm | 电信电路 | d = 6.35 ±0.25 mm | L = 1.5 ±0.25 mm | 3.019 mm | 2.509 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ESP32-WROVER-E | Espressif Inc | 数据表 | 2 In Stock |
- | 最小起订量: 1 最小包装量: 1 | YES | housing - stainless steel; gasket - silicone rubber | 38 | at least 1 L/min at 70 mbar pressure | electric, lighting, photoelectric, security, automotive and other equipment | KGM | 0805 | 2012 | IP67 | 2.80 | 有 | MLCC | 接触制造商 | ESPRESSIF SYSTEMS (SHANGHAI) PTE LTD | PACKAGE-38 | Ф5.2 mm | 85 °C | -40 °C | UNSPECIFIED | DMA | RECTANGULAR | 微电子组件 | 3.3 V | for pressure equalization in sealed enclosures and protection against condensation formation | SMD | 35*30*21/150 | ceramic | -55...125°C | ±1% | 5A992.C | M5X0.8 pressure equalization valve, metal | to hydrostatic pressure - at least 100 mbar for 30 min | 8542.39.00.01 | 2.2nF | DUAL | 无铅 | 250 | 1 | 1.27 mm | compliant | R-XDMA-N38 | C0G (NP0) | INDUSTRIAL | 150000 Mbps | 3.45 mm | -40…+125 °C | 电信电路 | 3 | 50V | 31.4 mm | 18 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT9041BP | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 5 V | 无 | Obsolete | MICROSEMI CORP | LCC | PLASTIC, MS-018AB, LCC-28 | e0 | 无 | 锡铅 | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | unknown | 28 | S-PQCC-J28 | 不合格 | INDUSTRIAL | 4.57 mm | 电信电路 | 11.505 mm | 11.505 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CMX867D2 | Mx Com Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | MX COM INC | SOIC | , | PLASTIC/EPOXY | RECTANGULAR | 小概要 | Obsolete | 8542.39.00.01 | DUAL | 鸥翼 | unknown | 24 | R-PDSO-G24 | 不合格 | MODEM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CMX867D2 | CML Microcircuits Plc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | 有 | Obsolete | 14.28 | CML MICROCIRCUITS LTD | SOIC | SOP, SOP24,.4 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP24,.4 | RECTANGULAR | 小概要 | 3 V | 62*27.5*28/500 | e3 | 有 | Matte Tin (Sn) | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 40 | 24 | R-PDSO-G24 | 不合格 | INDUSTRIAL | 0.011 mA | 1 Mbps | 2.67 mm | MODEM | 15.365 mm | 7.425 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | KSZ8081MNXCA | Micrel Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | Plastic / metal | 32 | 有 | Transferred | 5.50 | MICREL INC | QFN-32 | 70 °C | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 46.5*28.8*27.6/500 | e4 | 镍钯金 | Orange | QUAD | 无铅 | 260 | 1 | 0.5 mm | compliant | 40 | S-XQCC-N32 | 不合格 | COMMERCIAL | 100000 Mbps | 1 mm | 以太网收发器 | 1 | 2 | 19.7 mm | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RFSA3043TR7 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | ±0.1pF | KGM | 0201 | 0603 | RF MICRO DEVICES INC | 0.01 g | HVQCCN, | MLCC | 105 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | SMD | Transferred | ceramic | -55...125°C | 8542.39.00.01 | 4.7pF | QUAD | 无铅 | 1 | 0.5 mm | unknown | S-XQCC-N16 | C0G (NP0) | INDUSTRIAL | 0.9 mm | 电信电路 | 25V | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCP2542FDT-E/MFVAO | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 活跃 | MICROCHIP TECHNOLOGY INC | HVSON, | 125 °C | -40 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.12,25 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | e3 | EAR99 | 哑光锡 | 8542.32.00.51 | DUAL | 无铅 | 1 | 0.65 mm | compliant | S-PDSO-N8 | AUTOMOTIVE | 140 mA | 8000 Mbps | 1 mm | AEC-Q100 | CAN FD TRANSCEIVER | 1 | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1044VT | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | NXP SEMICONDUCTORS | 8542.39.00.01 | unknown | 电路接口 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TGA2586-FL | TriQuint Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 10 | Transferred | TRIQUINT SEMICONDUCTOR INC | DFP, | PLASTIC/EPOXY | DFP | RECTANGULAR | FLATPACK | 有 | 有 | DUAL | FLAT | 未说明 | 1 | compliant | 未说明 | R-PDFP-F10 | 4.2418 mm | 射频和基带电路 | 24.003 mm | 15.78 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SKY58081-11 | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | 活跃 | 2020-07-27 | SKYWORKS SOLUTIONS INC | 110 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | LCC56,.23X.3,17 | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.4 V | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.44 mm | unknown | R-PQCC-N56 | 3200 mA | 0.7 mm | 射频和基带电路 | 7.6 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1042TK/3 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 5 V | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SQUARE | SOLCC8,.12,25 | HVSON | PLASTIC/EPOXY | -40 °C | 150 °C | HVSON, SOLCC8,.12,25 | SON | NXP SEMICONDUCTORS | 活跃 | 有 | e4 | 有 | 镍钯金银 | 8542.39.00.01 | DUAL | 无铅 | 260 | 1 | 0.65 mm | compliant | 30 | 8 | S-PDSO-N8 | 不合格 | AUTOMOTIVE | 70 mA | 5000000 Mbps | 1 mm | AEC-Q100 | CAN FD TRANSCEIVER | 1 | 1 | 3 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1048TK | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 14 | 有 | 不推荐 | NXP SEMICONDUCTORS | SON | VSON-14 | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | 8542.39.00.01 | DUAL | 无铅 | 260 | 1 | 0.65 mm | compliant | 30 | 14 | R-PDSO-N14 | 不合格 | 1 mm | 电路接口 | 1 | 4.5 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1028TK/3V3/10 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | NXP SEMICONDUCTORS | SON | HVSON, | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 活跃 | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.65 mm | unknown | 8 | S-PDSO-N8 | 1 mm | MIL-STD-1553 DATA BUS TRANSCEIVER | 3 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1028TK/5V0/20 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | NXP SEMICONDUCTORS | SON | HVSON, | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | 活跃 | 8542.39.00.01 | DUAL | 无铅 | 260 | 1 | 0.65 mm | unknown | 30 | 8 | S-PDSO-N8 | 1 mm | MIL-STD-1553 DATA BUS TRANSCEIVER | 1 | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1052IT/5 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | aluminium | 16 | for back plate | black | Transferred | 700 g | grilled | NXP SEMICONDUCTORS | anodized | 7.50 MM, PLASTIC, SOT162-1, MS-013, SOP-16 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | 小概要 | 5 V | 1.8mm | extruded | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | R-PDSO-G16 | 不合格 | AUTOMOTIVE | 0.07 mA | 1000 Mbps | 2.65 mm | AEC-Q100 | 电路接口 | 1 | universal | 14mm | 10.3 mm | 7.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TP3067N | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 20 | 无 | Transferred | NATIONAL SEMICONDUCTOR CORP | PLASTIC, DIP-20 | 70 °C | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | not_compliant | 40 | R-PDIP-T20 | 不合格 | COMMERCIAL | SYNCHRONOUS/ASYNCHRONOUS | 10 mA | 5.08 mm | PCM 编解码器 | YES | A-LAW | 1 | -5 V | 0.15 dB | 不提供 | 26.075 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HC1-55564/883 | Intersil Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 14 | RG174 | 无 | Obsolete | 51.50 | INTERSIL CORP | 60 W | DIP | CERAMIC, DIP-14 | 125 °C | magnetic | 850-1900/900-1800 MHz | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | 5 V | 接线板 | 48*32*27/200 | Bulk | e0 | 活跃 | SMA-M | Lever | 2 | 锡铅 | Orange | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | 14 | R-GDIP-T14 | 不合格 | MILITARY | vertical | 50 Ohm | 2500 mm | SYNCHRONOUS | 5.08 mm | -45....+75 °C | 3.5 dBi | MIL-STD-883 | CVSD CODEC | External GSM antenna | NO | CVSD | 85 mm | Ф30 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HC1-55564-2 | Intersil Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 14 | Free Hanging (In-Line) | Polyvinyl Chloride (PVC) | - | 125 °C | -55 °C | 7.00 | CERAMIC, GLASS-SEALED | 17 W | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | 5 V | CERAMIC, DIP-14 | DIP | INTERSIL CORP | Obsolete | 无 | 50 Ohm | 42*28*18.5/200 | Box | BC | e0 | 活跃 | Right angle SMA-M | 锡铅 | Black | 8542.39.00.01 | DUAL | THROUGH-HOLE | Unshielded | 1 | IP67 - Dust Tight, Waterproof | 2.54 mm | not_compliant | 14 | R-GDIP-T14 | 不合格 | Round | MILITARY | vertical | - mm | SYNCHRONOUS | 工业环境 | 5.08 mm | 100 MHz | 内螺纹插座 | All | Plug | 4 | Standard | 2.14 dBi | 电线引线 | M8 | 2400-2500 MHz | CVSD CODEC | Compact rod Wi-Fi antenna | ≤1.5 | NO | CVSD | 50 mm | 1.64' (500.00mm) | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HC1-55564-9 | Intersil Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 14 | Free Hanging (In-Line) | Polyvinyl Chloride (PVC) | 5e | 无 | 420.00 | 45.0 | Obsolete | 10 | 254.0 | INTERSIL CORP | DIP | CERAMIC, DIP-14 | 85 °C | -40 °C | CERAMIC, GLASS-SEALED | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | 5 V | 51.5*32*43/30 | Box | BC | e0 | 活跃 | 锡铅 | Black | 8542.39.00.01 | DUAL | THROUGH-HOLE | Unshielded | 1 | IP67 - Dust Tight, Waterproof | 2.54 mm | not_compliant | 14 | R-GDIP-T14 | 不合格 | Round | INDUSTRIAL | 12 | SYNCHRONOUS | 1.5 mA | 工业环境 | 公引脚 | All | Receptacle | 4 | Standard | 电线引线 | M8 | CVSD CODEC | YES | CVSD | RJ45 | 1U | 3.28' (1.00m) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HC1-55564-2 | Harris Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 14 | 4000 | 110 | 无 | Non-Audible | Steady | 25 | 180.00 | Obsolete | 75 | 140 | HARRIS SEMICONDUCTOR | DIP-14 | 125 °C | VHF(172-240)UHF(470-860) | -45+85 | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP14,.3 | RECTANGULAR | IN-LINE | 5 V | 50 | 0.6 | 51*41*36/50 | 225 | -25°C ~ 60°C | Bulk | JT 支架灯 | e0 | 活跃 | TV Male | 整机 | 锡铅 | 8542.39.00.01 | 24VAC/DC | DUAL | THROUGH-HOLE | 1 | NEMA 12 | 2.54 mm | unknown | 电线引线 | R-GDIP-T14 | 不合格 | MILITARY | linear | SYNCHRONOUS | 1.5 mA | CVSD CODEC | YES | CVSD | LED | 1 | Red | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | KSZ8794CNXCC | Micrel Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | Polyolefin | 64 | 2.0 mm | MICREL INC | 2670.00 | 8 X 8 MM, ROHS COMPLIANT, QFN-64 | 70 °C | UNSPECIFIED | HQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | 1.2 V | +80...+120 °C | 2.0 mm | 0.45 mm | 45*45*50/2 | Transferred | Non-combustible heat shrink tube | black | QUAD | 无铅 | 1 | 0.4 mm | unknown | S-XQCC-N64 | COMMERCIAL | -55...+125 °C | 以太网收发器 | 2:1 | 600 V | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1051T | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 有 | 活跃 | NXP SEMICONDUCTORS | SOIC | SOP-8 | 1 | PLASTIC/EPOXY | SOP | SOP8,.24 | RECTANGULAR | 小概要 | 5 V | e4 | 有 | EAR99 | 镍钯金银 | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | 不合格 | 110 mA | 5000 Mbps | 1.75 mm | AEC-Q100 | 可收发器 | 1 | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RTL8363SC-VB-CG | Realtek Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2020-08-25 | , | 活跃 | REALTEK SEMICONDUCTOR CORP | 8542.39.00.01 | unknown |
MGA-43040-TR1G
Avago Technologies
分类:Interface - Telecom
BCM20715A1KUBXG
Infineon Technologies AG
分类:Interface - Telecom
ESP32-WROVER-E
Espressif Inc
分类:Interface - Telecom
27.917602
MT9041BP
Microsemi Corporation
分类:Interface - Telecom
CMX867D2
Mx Com Inc
分类:Interface - Telecom
CMX867D2
CML Microcircuits Plc
分类:Interface - Telecom
KSZ8081MNXCA
Micrel Inc
分类:Interface - Telecom
RFSA3043TR7
RF Micro Devices Inc
分类:Interface - Telecom
MCP2542FDT-E/MFVAO
Microchip Technology Inc
分类:Interface - Telecom
TJA1044VT
NXP Semiconductors
分类:Interface - Telecom
TGA2586-FL
TriQuint Semiconductor
分类:Interface - Telecom
SKY58081-11
Skyworks Solutions Inc
分类:Interface - Telecom
TJA1042TK/3
NXP Semiconductors
分类:Interface - Telecom
TJA1048TK
NXP Semiconductors
分类:Interface - Telecom
TJA1028TK/3V3/10
NXP Semiconductors
分类:Interface - Telecom
TJA1028TK/5V0/20
NXP Semiconductors
分类:Interface - Telecom
TJA1052IT/5
NXP Semiconductors
分类:Interface - Telecom
TP3067N
National Semiconductor Corporation
分类:Interface - Telecom
HC1-55564/883
Intersil Corporation
分类:Interface - Telecom
HC1-55564-2
Intersil Corporation
分类:Interface - Telecom
HC1-55564-9
Intersil Corporation
分类:Interface - Telecom
HC1-55564-2
Harris Semiconductor
分类:Interface - Telecom
KSZ8794CNXCC
Micrel Inc
分类:Interface - Telecom
TJA1051T
NXP Semiconductors
分类:Interface - Telecom
RTL8363SC-VB-CG
Realtek Semiconductor
分类:Interface - Telecom
