category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	供应商器件包装										厂商													操作温度	包装	系列	零件状态	子类别	工作电源电压	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	产品类别	收发器数量	主要属性
XCVM1802-2LSEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思	726	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ Prime				450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ Prime FPGA, 1.9M Logic Cells		-
XCVM1402-1LLIVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思	726	Tray	活跃	+ 110 C	- 40 C	1	Xilinx	Xilinx	-40°C ~ 100°C (TJ)		Versal™ Prime		SOC - Systems on a Chip	700 mV	400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	System-On-Modules - SOM		Versal™ Prime FPGA, 1.2M Logic Cells		-	SoC FPGA
XCVM1402-2MLIVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思	748	Tray	活跃	+ 110 C	- 40 C	1	Xilinx	Xilinx	-40°C ~ 100°C (TJ)		Versal™ Prime		SOC - Systems on a Chip	800 mV	600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	System-On-Modules - SOM		Versal™ Prime FPGA, 1.2M Logic Cells		-	SoC FPGA
XCZU15EG-1FFVB1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	Tray	XCZU15	活跃	328	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG				500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 747K+ Logic Cells		-
XCZU5EV-L1FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD	Tray	XCZU5	活跃	204	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EV				500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 256K+ Logic Cells		-
AGFA006R24C3E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	Tray	活跃	576	0°C ~ 100°C (TJ)		Agilex F				1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			FPGA - 573K Logic Elements		-
XCVC1802-2MLEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思	770	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ AI Core				600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			Versal™ AI Core FPGA, 1.5M Logic Cells		-
XCVM1302-1LSIVSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx		Xilinx			+ 110 C	- 40 C					SOC - Systems on a Chip	700 mV								System-On-Modules - SOM					SoC FPGA
XCVC1502-2MSIVSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx		Xilinx			+ 110 C	- 40 C					SOC - Systems on a Chip	800 mV								System-On-Modules - SOM					SoC FPGA
XCVM1302-2MSEVSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx		Xilinx			+ 110 C	0 C					SOC - Systems on a Chip	800 mV								System-On-Modules - SOM					SoC FPGA
XCVM1302-2LLEVSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		Xilinx	Xilinx		1	0 C	+ 110 C						SOC - Systems on a Chip	700 mV								System-On-Modules - SOM					SoC FPGA
XCVC1502-1LLIVBVA1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		Xilinx	Xilinx		1	- 40 C	+ 110 C						SOC - Systems on a Chip	700 mV								System-On-Modules - SOM					SoC FPGA
AGFB022R25A3I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	624	Tray	活跃	-40°C ~ 100°C (TJ)		Agilex F				1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			FPGA - 2.2M Logic Elements		-
XCZU47DR-2FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思	561	Tray	活跃	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC				533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 930K+ Logic Cells		-
AGFA014R24C3E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃	Tray	744	0°C ~ 100°C (TJ)		Agilex F				1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			FPGA - 1.4M Logic Elements		-
XCZU15EG-1FFVC900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD	Tray	XCZU15	活跃	204	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG				500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 747K+ Logic Cells		-
MPFS160T-FCVG784T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	微芯片技术	MCU - 136, FPGA - 312	Tray	活跃	-40°C ~ 125°C (TJ)		-				-	1.4125MB	RISC-V	DMA, PCI, PWM		CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA			FPGA - 161K Logic Modules		128KB
A2F200M3F-FGG256	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	256-LBGA	256-FPBGA (17x17)	微芯片技术	Tray	A2F200	活跃	MCU - 25, FPGA - 66	0°C ~ 85°C (TJ)		SmartFusion®				80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA			ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops		256KB
MPFS250TS-FCV784M	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	微芯片技术	MCU - 136, FPGA - 372	Tray	活跃			PolarFire™				-	2.2MB	RISC-V	DMA, PCI, PWM		CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA			FPGA - 254K Logic Modules		128kB
1SX280LH3F55E3VG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-2912	This product may require additional documentation to export from the United States.	4 x 32 kB	1 GHz	2800000 LE	+ 100 C	0 C	10		SMD/SMT	350000 LAB	956211	Intel	Intel / Altera	Stratix	Details	4 x 32 kB	-		1160	有	0°C ~ 100°C (TJ)	Tray	Stratix® 10 SX	活跃	SOC - Systems on a Chip	0.85 V	1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	DMA, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	SoC FPGA	24 Transceiver	FPGA - 2800K Logic Elements	4 Core	--	SoC FPGA
1SX280LH3F55I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-2912	This product may require additional documentation to export from the United States.	4 x 32 kB	1 GHz	2800000 LE	+ 100 C	- 40 C	10		SMD/SMT	350000 LAB	956214	Intel	Intel / Altera	Stratix	Details	4 x 32 kB	-		1160	有	-40°C ~ 100°C (TJ)	Tray	Stratix® 10 SX	活跃	SOC - Systems on a Chip	0.85 V	1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	DMA, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	SoC FPGA	24 Transceiver	FPGA - 2800K Logic Elements	4 Core	--	SoC FPGA
MPFS160T-FCSG536T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA	536-BGA (16x16)	微芯片技术	MCU - 136, FPGA - 168	Tray	活跃	-40°C ~ 125°C (TJ)		-				-	1.4125MB	RISC-V	DMA, PCI, PWM		CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA			FPGA - 161K Logic Modules		128KB
XCVC1502-2MLEVSVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD	活跃			Tray			*
XC7Z045-1FFG676C	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BBGA, FCBGA	676-FCBGA (27x27)	AMD	130	Tray	活跃	XC7Z045	0°C ~ 85°C (TJ)		Zynq®-7000				667MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Kintex™-7 FPGA, 350K Logic Cells		-
XCVE1752-1MSENSVG1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD	活跃			Tray			*