类别是'category.片上系统(SoC)' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 包装/外壳 | 供应商器件包装 | 材料 | 质量 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 终止次数 | 温度系数 | 类型 | 电阻 | 组成 | 颜色 | 应用 | 功率(瓦特) | 电压 - 供电 | 基本部件号 | 输出量 | 失败率 | 通道数量 | 界面 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 电流源 | 建筑学 | 数据总线宽度 | 输入 | 数据率(最大) | 主要属性 | 延迟时间 | 闪光大小 | 电容-输入 | 特征 | 信号调理 | 设备核心 | 高度 | 座位高度(最大) | 长度 | 宽度 | |||||||||||
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![]() | XCZU17EG-3FFVE1924E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1924-BBGA, FCBGA | 1924-FCBGA (45x45) | AMD | 668 | Tray | XCZU17 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1MLIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2MSIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-1MSIVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | Metal, Steel | AMD | Tray | 活跃 | 770 | -40°C ~ 100°C (TJ) | Versal™ AI Core | Grey | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1702-2LLENSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1EG-2SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | Non-Compliant | - | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | CAN/Serial I2C/SPI/U | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2MSENSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete (Last Updated: 2 years ago) | 1369-BFBGA | 1369-BGA (35x35) | 5.800001 g | AMD | OBSOLETE (Last Updated: 2 years ago) | Compliant | 424 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | 8.382 mm | 22.86 mm | 21.082 mm | |||||||||||||||||||||||||||||||||||||
![]() | XCZU42DR-L2FFVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1CG-2UBVA494E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 494-WFBGA, FCBGA | 494-FCBGA (14x14) | AMD | 82 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.333GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-1LSINSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8-TSSOP | AMD | 500 | Tray | 活跃 | -40°C ~ 85°C | Tape & Reel (TR) | -- | Obsolete | Buffer, ReDriver | I²C - Hotswap | 2.7 V ~ 5.5 V | PCA9510 | 2-Wire Bus | 1 | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 6mA | MPU, FPGA | 2-Wire Bus | 400kHz | Versal™ AI Core FPGA, 1M Logic Cells | -- | - | 1.9pF | -- | ||||||||||||||||||||||||||||||
![]() | XCVM1802-1MLIVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | 活跃 | -40°C ~ 100°C (TJ) | * | 活跃 | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-2MLENSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 316 | Tray | 活跃 | 0°C ~ 100°C (TJ) | * | 活跃 | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-2LLEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Axial, Radial Bend | Panasert | AMD | 608 | Tray | 活跃 | -55°C ~ 155°C | Tape & Reel (TR) | CF | 0.091 Dia x 0.236 L (2.30mm x 6.00mm) | ±5% | 活跃 | 2 | 0/ -400ppm/°C | 100 Ohms | 碳膜 | 0.25W, 1/4W | -- | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | Flame Retardant Coating, Safety | -- | ||||||||||||||||||||||||||||||||
![]() | XCVM1302-1LLIVFVC1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Axial, Radial Bend | Panasert | AMD | 532 | Tray | 活跃 | -55°C ~ 155°C | Tape & Reel (TR) | CF | 0.091 Dia x 0.236 L (2.30mm x 6.00mm) | ±5% | 活跃 | 2 | 0/ -400ppm/°C | 16 Ohms | 碳膜 | 0.25W, 1/4W | -- | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | Flame Retardant Coating, Safety | -- | ||||||||||||||||||||||||||||||||
![]() | LS1046AMN3T1A-N2 | Teledyne LeCroy | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Axial, Radial Bend | Axial | -55°C ~ 155°C | Tape & Reel (TR) | RNF | 0.093 Dia x 0.250 L (2.35mm x 6.35mm) | ±1% | 活跃 | 2 | ±100ppm/°C | 43.2 kOhms | Metal Film | 0.25W, 1/4W | -- | Flame Retardant Coating, Safety | -- | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2MSIVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU42DR-1FFVE1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | RISC | 1.8/2.5/3.3 V | CAN/Serial I2C/SPI/UART/USB | 有 | FPGA/Microcontroller | 366 | AMD | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | ARM Cortex-A53/ARM Cortex-R5F | ||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-2LSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1CG-L2UBVA494E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 494-WFBGA, FCBGA | 494-FCBGA (14x14) | AMD | 82 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.333GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1MLINBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 424 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1LSIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 402 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-1MSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1MSEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-1MSIVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1MSENBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 424 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - |
XCZU17EG-3FFVE1924E
AMD
分类:Embedded - System On Chip (SoC)
XCVM1802-1MLIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
XCVC1902-2MSIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
XCVC1902-1MSIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
XCVC1702-2LLENSVG1369
AMD
分类:Embedded - System On Chip (SoC)
XCZU1EG-2SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
XCVM1402-2MSENSVF1369
AMD
分类:Embedded - System On Chip (SoC)
XCZU42DR-L2FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)
XCZU1CG-2UBVA494E
AMD
分类:Embedded - System On Chip (SoC)
XCVE1752-1LSINSVG1369
AMD
分类:Embedded - System On Chip (SoC)
XCVM1802-1MLIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
XCVM1302-2MLENSVF1369
AMD
分类:Embedded - System On Chip (SoC)
XCVE1752-2LLEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
XCVM1302-1LLIVFVC1596
AMD
分类:Embedded - System On Chip (SoC)
LS1046AMN3T1A-N2
Teledyne LeCroy
分类:Embedded - System On Chip (SoC)
XCVC1902-2MSIVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
XCZU42DR-1FFVE1156E
AMD
分类:Embedded - System On Chip (SoC)
XCVM1802-2LSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
XCZU1CG-L2UBVA494E
AMD
分类:Embedded - System On Chip (SoC)
XCVM1402-1MLINBVB1024
AMD
分类:Embedded - System On Chip (SoC)
XCVM1302-1LSIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
XCVC1802-1MSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
XCVM1402-1MSEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
XCVC1802-1MSIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
XCVM1402-1MSENBVB1024
AMD
分类:Embedded - System On Chip (SoC)
