category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	安装类型	包装/外壳	表面安装	越来越多的功能	外壳材料	供应商器件包装	终端数量					Core														厂商																																				操作温度	包装	系列	尺寸/尺寸	容差	零件状态	湿度敏感性等级(MSL)	终止次数	终端	温度系数	连接器类型	类型	电阻	定位的数量	组成	颜色	应用	功率(瓦特)	HTS代码	电容量	紧固类型	子类别	额定电流	技术	电压 - 供电	端子位置	方向	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	入口保护	端子间距	Reach合规守则	频率	频率稳定性	输出量	外壳完成	引脚数量	外壳尺寸-插入	JESD-30代码	功能	基本谐振器	最大电流源	输出的数量	资历状况	工作电源电压	失败率	引线间距	电源	温度等级	电流 - 电源（禁用）（最大值）	速度	内存大小	外壳尺寸，MIL	引线样式	核心处理器	周边设备	程序内存大小	扩频带宽	连接方式	建筑学	输入数量	可编程逻辑类型	产品类别	速度等级
10AS032E1F29I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	4-SMD, No Lead	YES	780-FBGA (29x29)	780	CTS-Frequency Controls	Non-Compliant	29 X 29 MM, ROHS COMPLIANT, FBGA-780	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	有	10AS032E1F29I1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66			Tape & Reel (TR)	533	活跃	360		-20°C ~ 70°C	Tray	533	0.197 L x 0.126 W (5.00mm x 3.20mm)		Discontinued at Digi-Key						TCXO							8542.39.00.01						3V	BOTTOM		BALL				1 mm	compliant	24 MHz	±2ppm	HCMOS				S-PBGA-B780	Standby (Power Down)	Crystal	10mA							INDUSTRIAL	10µA	1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		3.35 mm	现场可编程门阵列					-	FPGA - 320K Logic Elements				--			0.065 (1.65mm)	29 mm	29 mm			-
10AS057K1F35I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	PEI-Genesis	-40 °C	0.9 V	0.87 V	100 °C	有	10AS057K1F35I1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66				Bulk	活跃	396	35 X 35 MM, ROHS COMPLIANT, FBGA-1152		网格排列	PLASTIC/EPOXY	-40°C ~ 100°C (TJ)	Tray	*			Discontinued at Digi-Key													8542.39.00.01							BOTTOM		BALL				1 mm	compliant							S-PBGA-B1152										INDUSTRIAL		1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		3.5 mm	现场可编程门阵列						FPGA - 570K Logic Elements				--				35 mm	35 mm
1SX280LU3F50I2VG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Glenair			零售包装	活跃	704							-40°C ~ 100°C (TJ)	Tray	*			活跃																																														1.5GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	DMA, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									FPGA - 2800K Logic Elements				--
1SX250LN3F43E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	PEI-Genesis			Bulk	活跃	688							0°C ~ 100°C (TJ)	Tray	*			活跃																																														1.5GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	DMA, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									FPGA - 2500K Logic Elements				--
10AS066K4F35I3SGES	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FBGA (35x35)	1152	Knowles Syfer	0.87 V	100 °C	10AS066K4F35I3SGES	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66				Tape & Reel (TR)	活跃	396	BGA,		网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	-40°C ~ 100°C (TJ)	Tray	*			Discontinued at Digi-Key													8542.39.00.01							BOTTOM		BALL				1 mm	compliant							S-PBGA-B1152										INDUSTRIAL		1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		3.5 mm	现场可编程门阵列						FPGA - 660K Logic Elements				--				35 mm	35 mm
10AS066K2F35I1HG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FBGA (35x35)	PEI-Genesis	10AS066K2F35I1HG	活跃	INTEL CORP	5.67						Bulk	活跃	396	有		This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	+ 100 C	- 40 C	24	SMD/SMT	82500 LAB	967072	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	有	-40°C ~ 100°C (TJ)	Tray	*			活跃																SOC - Systems on a Chip											unknown													950 mV						1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				SoC FPGA					FPGA - 660K Logic Elements			2 Core	--		SoC FPGA
10AS057N3F40I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Axial	YES	Axial	1517	570000 LE	1.2 GHz	2 x 32 kB	This product may require additional documentation to export from the United States.	Stackpole Electronics Inc	有	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS057N3F40I2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45				Bulk	活跃	588	-		2 x 32 kB	Details	Arria 10 SoC	Intel / Altera	Intel	965378	71250 LAB	SMD/SMT	21	-55°C ~ 155°C	Tray	RNF	0.108 Dia x 0.344 L (2.75mm x 8.75mm)	±1%	活跃		2		±100ppm/°C			487 kOhms		Metal Film			0.5W, 1/2W	8542.39.00.01			SOC - Systems on a Chip		CMOS		BOTTOM		BALL		未说明		1 mm	compliant							S-PBGA-B1517				588	不合格		-		0.9 V	INDUSTRIAL		1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	588	3.5 mm	现场可编程门阵列	SoC FPGA					FPGA - 570K Logic Elements		570000	2 Core	--	Flame Retardant Coating, Safety	SoC FPGA	-	40 mm	40 mm
1SX280LH2F55I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	4-SMD, No Lead	SiTime	活跃	1160	-		4 x 32 kB	Details	Stratix	Intel / Altera	Intel	960576	350000 LAB	SMD/SMT	10	- 40 C	+ 100 C	2800000 LE	1 GHz	4 x 32 kB	This product may require additional documentation to export from the United States.	有						Tape & Reel (TR)	-40°C ~ 85°C	Tray	SiT8208	0.276 L x 0.197 W (7.00mm x 5.00mm)		活跃						XO (Standard)										SOC - Systems on a Chip			2.5V									74.175824 MHz	±10ppm	LVCMOS, LVTTL					Standby (Power Down)	MEMS	33mA			0.85 V					70µA	1.5GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	DMA, WDT	-	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				SoC FPGA			24 Transceiver	-	FPGA - 2800K Logic Elements			4 Core	--		SoC FPGA	0.039 (1.00mm)					-
10AS057K2F40E2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FCBGA (40x40)	1517	Arria 10 SoC	Details	2 x 32 kB	Glenair	-	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	0.9 V	未说明	0.87 V	100 °C	有	10AS057K2F40E2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45				零售包装	活跃	696	有		This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	570000 LE	21	SMD/SMT	71250 LAB	965015	Intel	Intel / Altera	0°C ~ 100°C (TJ)	Tray	*			活跃													8542.39.00.01			SOC - Systems on a Chip		CMOS		BOTTOM		BALL		未说明		1 mm	compliant							S-PBGA-B1517				696	不合格				0.9 V	OTHER		1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	696	3.5 mm	现场可编程门阵列	SoC FPGA					FPGA - 570K Logic Elements		570000	2 Core	--		SoC FPGA		40 mm	40 mm
10AS066H3F34I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	Glenair	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS066H3F34I2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45				零售包装	活跃	492	有		This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	24	SMD/SMT	82500 LAB	965023	Intel	-40°C ~ 100°C (TJ)	Tray	*			活跃													8542.39.00.01			SOC - Systems on a Chip		CMOS		BOTTOM		BALL		未说明		1 mm	compliant							S-PBGA-B1152				492	不合格				0.9 V	INDUSTRIAL		1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	492	3.65 mm	现场可编程门阵列	SoC FPGA					FPGA - 660K Logic Elements		660000	2 Core	--		SoC FPGA		35 mm	35 mm
10AS048H4F34I3SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1152	EDAC Inc.		Bulk	活跃	492	5.47		0.93 V	INTEL CORP	活跃	Intel Corporation	SQUARE	BGA	10AS048H4F34I3SG	有	100 °C	0.87 V	未说明	0.9 V	-40 °C	BGA1152,34X34,40	PLASTIC/EPOXY	网格排列	BGA, BGA1152,34X34,40					-40°C ~ 100°C (TJ)	Tray	*			活跃													8542.39.00.01			现场可编程门阵列		CMOS		BOTTOM		BALL		未说明		1 mm	compliant							S-PBGA-B1152				492	不合格				0.9 V	INDUSTRIAL		1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	492	3.65 mm	现场可编程门阵列						FPGA - 480K Logic Elements		480000		--				35 mm	35 mm
10AS032H3F35E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-1152	YES	1152	320000 LE	1.2 GHz	2 x 32 kB	This product may require additional documentation to export from the United States.	EDAC Inc.	有	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS032H3F35E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45	网格排列	BGA, BGA1152,34X34,40					Bulk	活跃	384	-		2 x 32 kB	Details	Arria 10 SoC	Intel / Altera	Intel	965061	40000 LAB	SMD/SMT	1	0°C ~ 100°C (TJ)	Tray	*			活跃													8542.39.00.01			SOC - Systems on a Chip		CMOS		BOTTOM		BALL		未说明		1 mm	compliant							S-PBGA-B1152				384	不合格				0.9 V	OTHER		1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	384	3.5 mm	现场可编程门阵列	SoC FPGA					FPGA - 320K Logic Elements		320000	2 Core	--		SoC FPGA		35 mm	35 mm
10AS032E2F27E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-672	YES	672	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	Glenair	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	0.9 V	未说明	0.87 V	100 °C	有	10AS032E2F27E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45					零售包装	活跃	240	有		This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	320000 LE	1	SMD/SMT	40000 LAB	965289	Intel	0°C ~ 100°C (TJ)	Tray	*			活跃													8542.39.00.01			SOC - Systems on a Chip		CMOS		BOTTOM		BALL		未说明		1 mm	compliant							S-PBGA-B672				240	不合格				0.9 V	OTHER		1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	240	3.25 mm	现场可编程门阵列	SoC FPGA					FPGA - 320K Logic Elements		320000	2 Core	--		SoC FPGA		27 mm	27 mm
10AS032E4F29I3LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Panel Mount, Through Hole	FBGA-780	YES	Flange	不锈钢	780	SMD/SMT	40000 LAB	964847	Intel	Intel / Altera	Glenair	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS032E4F29I3LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45		零售包装	Metal	活跃	Copper Alloy		Gold	360	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	320000 LE	1	-65°C ~ 175°C	Tray	806			活跃			Solder		Plug, Male Pins					Silver			8542.39.00.01		Threaded	SOC - Systems on a Chip		CMOS		BOTTOM	F	BALL		未说明		1 mm	compliant				Passivated		26-20A	S-PBGA-B780				360	不合格				0.9 V	INDUSTRIAL		1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	360	3.35 mm	现场可编程门阵列	SoC FPGA					FPGA - 320K Logic Elements		320000	2 Core	--		SoC FPGA	29 mm	29 mm
10AS057K4F35I3SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FCBGA (35x35)	KYOCERA AVX		Bulk	活跃	396						-40°C ~ 100°C (TJ)	Tray	*			活跃																																														1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									FPGA - 570K Logic Elements				--
10AS027E2F27E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	面板安装	FBGA-672	YES	Flange	铝合金	672	270000 LE	1	SMD/SMT	33750 LAB	964965	ITT Cannon, LLC	Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	0.9 V	未说明	0.87 V	100 °C	有	10AS027E2F27E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.43		-	Bulk	Metal	KJB0T		活跃	Gold	240	Non-Compliant	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	-65°C ~ 175°C	Tray	KJB			活跃			Crimp		Receptacle, Female Sockets			22		橄榄色			8542.39.00.01		Threaded	SOC - Systems on a Chip	-	CMOS		BOTTOM	C	BALL	-	未说明	抗环境干扰	1 mm	compliant				橄榄色镉		13-35	S-PBGA-B672				240	不合格				0.9 V	OTHER		1.5GHz	256KB	-		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	240	3.25 mm	现场可编程门阵列	SoC FPGA					FPGA - 270K Logic Elements		270000	2 Core	--	-	SoC FPGA	27 mm	27 mm	50.0µin (1.27µm)
10AS027E2F29E1HG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	4-SMD, No Lead	780-FBGA (29x29)	EPSON	活跃	INTEL CORP	5.64					Tape & Reel (TR)	SG-8101	活跃	360		有	2 x 32 kB	1.2 GHz	270000 LE	+ 100 C	0 C	36	SMD/SMT	33750 LAB	965044	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	有	10AS027E2F29E1HG	-40°C ~ 85°C	Tray	SG-8101	0.197 L x 0.126 W (5.00mm x 3.20mm)		活跃						XO (Standard)										SOC - Systems on a Chip			1.8V ~ 3.3V								unknown	36.7 MHz	±15ppm	CMOS					Standby (Power Down)	Crystal	6.8mA (Typ)			950 mV					1.1µA	1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				SoC FPGA			12 Transceiver	-	FPGA - 270K Logic Elements			2 Core	--		SoC FPGA	0.051 (1.30mm)					-
10AS016E4F29E3SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	780-BBGA, FCBGA	YES	780-FBGA (29x29)	780	PEI-Genesis	Non-Compliant		BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	0.9 V	未说明	0.87 V	100 °C	有	10AS016E4F29E3SG	BGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	1.96				Bulk	活跃	288	0°C ~ 100°C (TJ)	Tray	*			活跃													8542.39.00.01			现场可编程门阵列		CMOS		BOTTOM		BALL		未说明		1 mm	compliant							S-PBGA-B780				288	不合格				0.9 V	OTHER		1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	288	3.35 mm	现场可编程门阵列						FPGA - 160K Logic Elements		160000		--				29 mm	29 mm
XC7Z030-L2FFG676I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, MLCC	0402 (1005 Metric)	676-FCBGA (27x27)	AMD					Contains lead / RoHS non-compliant	25V	125,000	FCBGA		1.0000 V	0.95 V	250	1.05 V	表面贴装	130	Tray	XC7Z030	活跃	Industrial grade	-55°C ~ 125°C	Tape & Reel (TR)	VJ HIFREQ	0.040 L x 0.020 W (1.02mm x 0.51mm)	±0.5pF		1 (Unlimited)			C0G, NP0							RF, Microwave, High Frequency			0.9pF																		676										-				800MHz	256KB		-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Industrial	2L			Kintex™-7 FPGA, 125K Logic Cells	157,200			-	High Q, Low Loss		-			0.024 (0.61mm)		-
MPFS095TS-1FCSG536I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-536	536-LFBGA	RV64GC, RV64IMAC	微芯片技术			This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	93000 LE	276 I/O	- 40 C	+ 100 C	1	Tray	活跃				-40°C ~ 100°C	Tray	PolarFire®																																											1 V						-	857.6kB			RISC-V	DMA, PCI, PWM	-		CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA									FPGA - 93K Logic Modules			5 Core	128kB
MPFS250TS-1FCVG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-484	484-FCBGA (19x19)	RV64GC, RV64IMAC	微芯片技术			This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	254000 LE	372 I/O	- 40 C	+ 100 C	1	Tray	活跃				-40°C ~ 100°C	Tray	PolarFire™																																											1 V						-	2.2MB			RISC-V	DMA, PCI, PWM	-		CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA									FPGA - 254K Logic Modules			5 Core	128kB
MPFS160TS-FCSG536I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-536	536-LFBGA	RV64GC, RV64IMAC	微芯片技术			This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	161000 LE	312 I/O	0 C	+ 100 C	1	Tray	活跃				-40°C ~ 100°C	Tray	PolarFire™																																											1 V						-	1.4125MB			RISC-V	DMA, PCI, PWM	-		CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA									FPGA - 161K Logic Modules			5 Core	128kB
MPFS160T-1FCVG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCVG-484	484-FCBGA (19x19)	RV64GC, RV64IMAC	微芯片技术			This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	161000 LE	312 I/O	0 C	+ 100 C	1	Tray	活跃				-40°C ~ 100°C	Tray	PolarFire™																																											1 V						-	1.4125MB			RISC-V	DMA, PCI, PWM	-		CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA									FPGA - 161K Logic Modules			5 Core	128kB
MPFS160T-1FCSG536I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCSG-536	536-LFBGA	RV64GC, RV64IMAC	微芯片技术			This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	161000 LE	312 I/O	0 C	+ 100 C	1	Tray	活跃				-40°C ~ 100°C	Tray	PolarFire®																																											1 V						-	1.4125MB			RISC-V	DMA, PCI, PWM	-		CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA									FPGA - 161K Logic Modules			5 Core	128kB
MPFS160T-1FCVG784E	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCVG-784	784-FCBGA (23x23)	RV64GC, RV64IMAC	微芯片技术			This product may require additional documentation to export from the United States.	SMD/SMT	667 MHz, 667 MHz	16 kB, 4 x 32 kB	4 x 32 kB	-	161000 LE	312 I/O	0 C	+ 100 C	1	Tray	活跃				0°C ~ 100°C	Tray	PolarFire™																																											1 V						-	1.4125MB			RISC-V	DMA, PCI, PWM	-		CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA									FPGA - 161K Logic Modules			5 Core	128kB