category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	安装类型	包装/外壳	表面安装	引脚数	供应商器件包装	材料	终端数量	护套（绝缘）材料																						厂商																												操作温度	包装	系列	JESD-609代码	零件状态	湿度敏感性等级(MSL)	终端	连接器类型	类型	定位的数量	端子表面处理	最高工作温度	最小工作温度	组成	颜色	应用	行数	附加功能	HTS代码	子类别	螺距	技术	电压 - 供电	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	基本部件号	输出量	引脚数量	触点表面处理	JESD-30代码	功能	输出的数量	资历状况	电源	温度等级	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	座位高度-最大	可编程逻辑类型	端子类型	逻辑元件/单元数	线圈电压	第一个连接器	第二个连接器	总 RAM 位数	LABs数量/ CLBs数量	筛选水平	速度等级	主要属性	寄存器数量
MPFS095T-1FCVG784T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	PEI-Genesis		Bulk	活跃	MCU - 136, FPGA - 276							-40°C ~ 125°C (TJ)		*																																					-	857.6KB	RISC-V	DMA, PCI, PWM		CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA															FPGA - 93K Logic Modules									128KB
XCZU7EG-3FFVC1156E	AMD	数据表	929 In Stock	1: ¥42,661.722758 10: ¥41,258.919498 25: ¥40,972.114696 50: ¥40,687.303564 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD								0.9000 V	0.873 V	0.927 V	360	Tray	XCZU7	活跃	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																					600MHz, 667MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA													3		Zynq®UltraScale+™ FPGA, 504K+ Logic Cells									-
XCZU3CG-L2SFVA625E	AMD	数据表	785 In Stock	1: ¥4,744.917800 10: ¥4,476.337545 100: ¥4,222.959945 500: ¥3,983.924485 查看所有的价格 -	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD	KA2-2143	180	Tray	活跃								ABB	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																																					533MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA															Zynq®UltraScale+™ FPGA, 154K+ Logic Cells									-
XCZU11EG-3FFVC1156E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD			230C180B	CSA, UL	Amperite	180	0.9000 V	0.873 V	0.927 V	360	Tray	XCZU11	活跃					0 to 100 °C		Zynq® UltraScale+™ MPSoC EG				0.110 in Flat Blade																																	600MHz, 667MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						230 VAC, 230 VDC							3		Zynq®UltraScale+™ FPGA, 653K+ Logic Cells									-	关闭延迟		1NC
M2S010-1TQG144I	Microchip	数据表	2685 In Stock	1: ¥341.278014 10: ¥321.960388 100: ¥303.736219 500: ¥286.543597 查看所有的价格 -	最小起订量: 1 最小包装量: 1	144-LQFP	144-TQFP (20x20)	Steel	微芯片技术				30.18 mm	25.4 mm	Straight	CGB399	cUL, UL	Round	Crouse-Hinds Industrial Produc	Bushing Grip with Strain Relief	无	1.2000 V	84	Tray	M2S010	活跃	-	166 MHz	12084 LE	SMD/SMT	-	64 kB				-40 to 100 °C		SmartFusion®2											Metallic																										166MHz	64KB	ARM® Cortex®-M3	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA													1		FPGA - 10K Logic Modules				1 Core				256KB
XCZU3EG-1SFVA625E	AMD	数据表	46 In Stock	-	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD	活跃								VH7281GS+8122G	Johnson Controls	154,350	FCBGA	0.8500 V	0.808 V	180	0.892 V	180	Tray	XCZU3	0 to 100 °C		Zynq® UltraScale+™ MPSoC EG																												625									500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA											扩展工业		1		Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	141,120								-
XCZU2CG-L1SFVA625I	AMD	数据表	2576 In Stock	1: ¥2,598.603171 10: ¥2,451.512424 100: ¥2,312.747570 500: ¥2,181.837334 查看所有的价格 -	最小起订量: 1 最小包装量: 1	625-BFBGA, FCBGA	625-FCBGA (21x21)	AMD	Cutler Hammer, Div of Eaton Corp	0.72, 0.85 V	0.698, 0.808 V	0.742, 0.892 V	180	Tray	XCZU2	活跃								DH363FGKV	-40 to 100 °C		Zynq® UltraScale+™ MPSoC CG																													625								500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA													1L		Zynq®UltraScale+™ FPGA, 103K+ Logic Cells									-
XCZU11EG-2FFVC1760I	AMD	数据表	622 In Stock	1: ¥52,337.374891 10: ¥50,616.416725 25: ¥50,264.564770 50: ¥49,915.158663 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD				Miscellaneous	0.8500 V	512	Tray	XCZU11	活跃					-40 to 100 °C		Zynq® UltraScale+™ MPSoC EG																																					533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA													2		Zynq®UltraScale+™ FPGA, 653K+ Logic Cells									-
XCZU19EG-L2FFVB1517E	AMD	数据表	965 In Stock	1: ¥54,345.789034 10: ¥52,558.790168 25: ¥52,193.436112 50: ¥51,830.621764 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD				0254-51	Greenlee	644	Tray	XCZU19	活跃					0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																					533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA															Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells									-
XCZU17EG-2FFVD1760E	AMD	数据表	635 In Stock	1: ¥57,421.667389 10: ¥55,533.527457 25: ¥55,147.494991 50: ¥54,764.145972 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD								TE-6100-11	Johnson Controls	无显示	308	Tray	XCZU17	活跃	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG													Indoor															1 kOhm Nickel RTD				Temperature					533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA															Zynq®UltraScale+™ FPGA, 926K+ Logic Cells									-
M2S010T-VFG256	Microchip	数据表	144 In Stock	1: ¥301.961047 10: ¥284.868911 100: ¥268.744258 500: ¥253.532321 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	256-LBGA	256	256-FPBGA (17x17)	微芯片技术		Momentary	10250T112-2	CE, CSA, UL	Cutler Hammer, Div of Eaton Co	1.2000 V	1.14 V	1.26 V	Compliant	138	Tray	M2S010	活跃	-	166 MHz	12084 LE	+ 85 C	0 C	SMD/SMT	-	64 kB					0 to 85 °C		SmartFusion®2									85 °C	0 °C																								1.2 V			166MHz	50 kB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				Screw									STD		FPGA - 10K Logic Modules				1 Core				256KB			2NO	IP65
XCZU7CG-L1FFVC1156I	AMD	数据表	640 In Stock	1: ¥25,476.812494 10: ¥24,639.083650 25: ¥24,467.808984 50: ¥24,297.724912 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	不锈钢	AMD	XCZU7	活跃							26 mm	16 mm	Straight	EXS05MLC1	UL	Round	Thomas & Betts	Double Compression Gland	无	360	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG											Metallic																										500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA															Zynq®UltraScale+™ FPGA, 504K+ Logic Cells									-			IP68
M2S060T-FCSG325	Microchip	数据表	2672 In Stock	1: ¥1,160.877706 10: ¥1,095.167645 100: ¥1,033.177029 500: ¥974.695305 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	Nylon	325	1.14 V	85 °C	有	TFBGA	SQUARE	微芯片技术	活跃	MICROSEMI CORP	1.26 V	5.82	-	166 MHz	56520 LE	-	64 kB				TY23M-4	Thomas & Betts	1.2000 V	1.14 V	1.26 V	Non-Compliant	200	Tray	M2S060	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	0 to 85 °C		SmartFusion®2	e1							Tin/Silver/Copper (Sn/Ag/Cu)			Yellow			LG-MIN, WD-MIN	8542.39.00.01	现场可编程门阵列		CMOS		BOTTOM	BALL	250	0.5 mm	compliant	40					S-PBGA-B325		200	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	现场可编程门阵列									STD		FPGA - 60K Logic Modules			56520	1 Core					256KB					11 mm	11 mm		0.093
XCZU3EG-L2SFVC784E	AMD	数据表	762 In Stock	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	Miscellaneous	0.8500 V	0.808 V	0.892 V	252	Tray	XCZU3	活跃								3107-108-40404	0 to 110 °C		Zynq® UltraScale+™ MPSoC EG																																					533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA													2L		Zynq®UltraScale+™ FPGA, 154K+ Logic Cells									-
XCZU3CG-1SBVA484E	AMD	数据表	2052 In Stock	1: ¥3,170.642444 10: ¥2,991.172118 100: ¥2,821.860485 500: ¥2,662.132535 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	AMD							82	Tray	XCZU3	活跃		0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																																					500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA															Zynq®UltraScale+™ FPGA, 154K+ Logic Cells									-
AGFB012R24B3E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		768	Tray	活跃							0°C ~ 100°C (TJ)		Agilex F																																					1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA															FPGA - 1.2M Logic Elements									-
XCVM1302-2MLENBVB1024	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD							Non-Compliant	316	Tray	活跃		0°C ~ 100°C (TJ)		Versal™ Prime																																					600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA															Versal™ Prime FPGA, 70k Logic Cells									-
XCZU2CG-1SFVC784I	AMD	数据表	19 In Stock	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD							252	Tray	XCZU2	活跃		-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																																					500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA															Zynq®UltraScale+™ FPGA, 103K+ Logic Cells									-
M2S060TS-1FG676I	Microchip	数据表	2655 In Stock	1: ¥2,189.095771 10: ¥2,065.184691 100: ¥1,948.287446 500: ¥1,838.007021 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	676-BGA	YES	676-FBGA (27x27)	676	无	M2S060TS-1FG676I	BGA	微芯片技术	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.88					387	Tray	M2S060	活跃	Non-Compliant	-	166 MHz	56520 LE	-	64 kB	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	30	1.14 V	-40°C ~ 100°C (TJ)		SmartFusion®2	e0							Tin/Lead (Sn/Pb)							8542.39.00.01	现场可编程门阵列		CMOS		BOTTOM	BALL	240	1 mm	not_compliant						S-PBGA-B676		387	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	387	2.44 mm	现场可编程门阵列											FPGA - 60K Logic Modules			56520	1 Core					256KB					27 mm	27 mm
XCZU47DR-L1FSVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD		366	Tray	活跃							-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																																					500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA															Zynq®UltraScale+™ FPGA, 930K+ Logic Cells									-
XCZU48DR-2FSVG1517I	AMD	数据表	831 In Stock	1: ¥257,148.102125 10: ¥248,692.555245 25: ¥246,963.808582 50: ¥245,247.079032 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD		561	Tray	活跃							-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																																					533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA															Zynq®UltraScale+™ FPGA, 930K+ Logic Cells									-
XCZU48DR-1FFVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD		366	Tray	活跃							-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																																					500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA															Zynq®UltraScale+™ FPGA, 930K+ Logic Cells									-
M2S060-1VF400	Microchip	数据表	2897 In Stock	1: ¥1,563.724642 10: ¥1,475.211923 100: ¥1,391.709369 500: ¥1,312.933367 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	表面贴装	1517-BBGA, FCBGA	1517-FBGA (40x40)	微芯片技术	活跃	-	166 MHz	56520 LE	-	64 kB						696	Non-Compliant	Tray	M2S060	0°C ~ 85°C (TJ)		Stratix® V GX		活跃																		0.82 V ~ 0.88 V							5SGXMA5										166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					490000				53105664	185000					FPGA - 60K Logic Modules				1 Core					256KB
M2S090T-1FG676	Microchip	数据表	2470 In Stock	1: ¥3,183.844542 10: ¥3,003.626927 100: ¥2,833.610312 500: ¥2,673.217272 查看所有的价格 -	最小起订量: 1 最小包装量: 1	表面贴装	676-BGA	YES	676-FBGA (27x27)	676	1.2 V	30	1.14 V	85 °C	无	微芯片技术	M2S090T-1FG676	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.27					22.86mm, 31.9mm	425	Tray	M2S090	活跃	-	166 MHz	86316 LE	SMD/SMT	-	64 kB	BGA, BGA676,26X26,40	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	0°C ~ 85°C (TJ)	Tube	MICTOR	e0	Obsolete			Plug, Outer Shroud Contacts		266	Tin/Lead (Sn/Pb)					2		8542.39.00.01	现场可编程门阵列	0.025 (0.64mm)	CMOS		BOTTOM	BALL	240	1 mm	not_compliant					Gold	S-PBGA-B676		425	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425	2.44 mm	现场可编程门阵列											FPGA - 90K Logic Modules			86316	1 Core					512KB		Board Guide, Ground Bus (Plane)			27 mm	27 mm	30.0µin (0.76µm)	0.892 (22.66mm)
M2S050-1VFG400	Microchip	数据表	2577 In Stock	1: ¥1,543.071148 10: ¥1,455.727497 100: ¥1,373.327831 500: ¥1,295.592288 查看所有的价格 -	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	--	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	40	1.14 V	85 °C	微芯片技术	有	M2S050-1VFG400	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.76					--	双拉链	207	Tray	M2S050	活跃	-	166 MHz	56340 LE	SMD/SMT	-	64 kB	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	3	--		--	e1	活跃	--			Multimode, Duplex		Tin/Silver/Copper (Sn/Ag/Cu)							8542.39.00.01	现场可编程门阵列		CMOS		BOTTOM	BALL	250	0.8 mm	compliant						S-PBGA-B400		207	不合格		1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列				LC 双工	ST (2)			0.20dB		0.08 (2.0mm)	FPGA - 50K Logic Modules		62.5/125	56340	1 Core	Beige	--	Orange	--	256KB		Riser, Zipcord			17 mm	17 mm	131.2 (40.0m)		OFNR