类别是'category.片上系统(SoC)' (7695)

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M2S050-FGG484I
M2S050-FGG484I
Microchip 数据表

2424 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

484-FPBGA (23x23)

微芯片技术

64 kB

267

Tray

M2S050

活跃

SMARTFUSION2

100C

Industrial

FPBGA

-40C to 100C

267

56340

65nm

1.26(V)

1.2(V)

1.14(V)

-40C

56340

表面贴装

This product may require additional documentation to export from the United States.

-

166 MHz

56340 LE

0.489749 oz

60

SMD/SMT

4695 LAB

Microchip

Microchip Technology / Atmel

Details

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

SOC - Systems on a Chip

484

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

SoC FPGA

STD

FPGA - 50K Logic Modules

1 Core

256KB

SoC FPGA

M2S060-1FCSG325
M2S060-1FCSG325
Microchip 数据表

2351 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

Tray

M2S060

活跃

-

166 MHz

56520 LE

-

64 kB

Miscellaneous

1.2000 V

Compliant

200

0 to 85 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 60K Logic Modules

1 Core

256KB

XCZU4EG-3SFVC784E
XCZU4EG-3SFVC784E
AMD 数据表

968 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

139743

Schneider

0.9000 V

0.873 V

0.927 V

252

Tray

XCZU4

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

Threaded

XCZU7CG-2FBVB900I
XCZU7CG-2FBVB900I
AMD 数据表

945 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

0.892 V

204

Tray

XCZU7

活跃

Turck

0.8500 V

0.808 V

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

M2S010-VFG256I
M2S010-VFG256I
Microchip 数据表

155 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-256

YES

256-FPBGA (14x14)

256

微芯片技术

LFBGA, BGA256,16X16,32

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

40

1.14 V

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.76

UX07628

UL

Turck

TPE

Cat 5e

2.5, 3.3 V

1.14 V

1.26 V

-

166 MHz

12084 LE

138 I/O

+ 100 C

- 40 C

119

SMD/SMT

1007 LAB

Microchip Technology / Atmel

Details

-

64 kB

Tray

M2S010

活跃

-40 to 100 °C

Tray

SmartFusion2

e1

RJ45

Tin/Silver/Copper (Sn/Ag/Cu)

Teal

LG-MIN, WD-MIN

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

不合格

1.2 V

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

SoC FPGA

STD

FPGA - 10K Logic Modules

12084

1 Core

256KB

SoC FPGA

39 Feet

14 mm

XCZU11EG-L2FFVF1517E
XCZU11EG-L2FFVF1517E
AMD 数据表

604 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

464

0.892 V

表面贴装

464

Tray

XCZU11

活跃

4000-70403-0100220

UR

Murrelektronik

653,100

FCBGA

0.8500 V

0.808 V

0 to 110 °C

Zynq® UltraScale+™ MPSoC EG

Black

1517

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

2L

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

597,120

-

XCZU3CG-L1SFVC784I
XCZU3CG-L1SFVC784I
AMD 数据表

812 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

DH365NDKV

Cutler Hammer, Div of Eaton Corp

0.8500 V

0.808 V

0.892 V

252

Tray

XCZU3

活跃

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1L

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

M2S050-FGG484
M2S050-FGG484
Microchip 数据表

2692 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-484

484-FPBGA (23x23)

Polyester

微芯片技术

56340 LE

267 I/O

64 kB

+ 85 C

0 C

60

SMD/SMT

4695 LAB

Microchip Technology / Atmel

Details

-

64 kB

Tray

M2S050

活跃

125819

Brady

1.2000 V

1.14 V

1.26 V

This product may require additional documentation to export from the United States.

-

1.314 Mbit

166 MHz

0 to 85 °C

Tray

SmartFusion2

Warning Signs

SOC - Systems on a Chip

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

SoC FPGA

STD

Vinyl Chloride May Cause Cancer Authorized Personnel Only

FPGA - 50K Logic Modules

1 Core

White

256KB

English

SoC FPGA

XCZU19EG-1FFVD1760E
XCZU19EG-1FFVD1760E
AMD 数据表

554 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

DIN Rail

308

Tray

XCZU19

活跃

3EU30

CE, CSA, UL

Altech

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

30 A

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Motor

MCU, FPGA

Screw

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

A2F200M3F-FGG484
A2F200M3F-FGG484
Microchip 数据表

155 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

1.575 V

MCU - 41, FPGA - 94

Tray

A2F200

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

1.5 V

40

1.425 V

85 °C

80 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

1.36

E57LBL30T110

10 mm

Cutler Hammer, Div of Eaton Co

1.5000 V

1.425 V

200000

0 to 85 °C

SmartFusion®

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

Shielded

250

1 mm

compliant

S-PBGA-B484

94

不合格

NC NPN

1.5,1.8,2.5,3.3 V

OTHER

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

现场可编程门阵列

STD

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

200000

256KB

Cable Connection

DC

30 mm

23 mm

23 mm

M2S010T-VFG256I
M2S010T-VFG256I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

256-LBGA

YES

256-FPBGA (17x17)

256

微芯片技术

活跃

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

40

1.14 V

M2S010T-VFG256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.77

GE - General Electric

1.2000 V

Non-Compliant

138

Tray

M2S010

-40 to 100 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B256

138

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

STD

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

XCZU5CG-L2FBVB900E
XCZU5CG-L2FBVB900E
AMD 数据表

639 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU5

活跃

VH7441CS+3801D

Johnson Controls

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

M2S090TS-FGG676I
M2S090TS-FGG676I
Microchip 数据表

2078 In Stock

-

最小起订量: 1

最小包装量: 1

676-BGA

676-FBGA (27x27)

Plastic

微芯片技术

109252

Brady

1.2000 V

425

Tray

M2S090

活跃

-

166 MHz

86316 LE

SMD/SMT

-

64 kB

-40 to 100 °C

SmartFusion®2

Pipe & Valve Marking

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

STD

热水回水

FPGA - 90K Logic Modules

1 Core

Green

512KB

White

English

M2S090-FGG676
M2S090-FGG676
Microchip 数据表

2889 In Stock

-

最小起订量: 1

最小包装量: 1

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

活跃

FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.2 V

40

1.14 V

85 °C

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.78

-

166 MHz

86316 LE

-

64 kB

VH7441GT+3008E

Johnson Controls

1.2000 V

425

Tray

M2S090

0 to 85 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

现场可编程门阵列

STD

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

XCZU17EG-2FFVB1517E
XCZU17EG-2FFVB1517E
AMD 数据表

777 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

644

Tray

XCZU17

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

XCVE1752-1LLIVSVA1596
XCVE1752-1LLIVSVA1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

500

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

A2F060M3E-FG256
A2F060M3E-FG256
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

20

1.425 V

85 °C

A2F060M3E-FG256

LBGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.88

LBGA,

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B256

OTHER

1536 CLBS, 60000 GATES

1.7 mm

现场可编程门阵列

1536

60000

17 mm

17 mm

A2F060M3E-FG256I
A2F060M3E-FG256I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

256

1 MM PITCH, FBGA-256

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA256,16X16,40

1.5 V

20

1.425 V

A2F060M3E-FG256I

80 MHz

LBGA

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

8.76

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B256

66

不合格

1.5,1.8,2.5,3.3 V

66

1536 CLBS, 60000 GATES

1.7 mm

现场可编程门阵列

1536

1536

60000

17 mm

17 mm

M2S025-VFG256I
M2S025-VFG256I
Microchip 数据表

2959 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LBGA

256-FPBGA (17x17)

微芯片技术

SMD/SMT

2308 LAB

Microchip

Microchip Technology / Atmel

-

64 kB

Tray

M2S025

活跃

1.2000 V

1.14 V

1.26 V

8542390000

Non-Compliant

-

166 MHz

27696 LE

138 I/O

+ 100 C

0.241494 oz

- 40 C

119

-40 to 100 °C

Tray

SmartFusion2

SOC - Systems on a Chip

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

SoC FPGA

STD

FPGA - 25K Logic Modules

1 Core

256KB

SoC FPGA

A2F200M3F-1CSG288I
A2F200M3F-1CSG288I
Microchip 数据表

40 In Stock

-

最小起订量: 1

最小包装量: 1

288-TFBGA, CSPBGA

288-CSP (11x11)

微芯片技术

1.575 V

MCU - 31, FPGA - 78

Tray

A2F200

活跃

1.5000 V

1.425 V

200000

-40 to 100 °C

SmartFusion®

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

1

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

M2S025-FCSG325I
M2S025-FCSG325I
Microchip 数据表

345 In Stock

-

最小起订量: 1

最小包装量: 1

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

180

Tray

M2S025

活跃

-

166 MHz

27696 LE

+ 100 C

- 40 C

SMD/SMT

-

64 kB

-40°C ~ 100°C (TJ)

SmartFusion®2

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S060TS-1FGG484T2
M2S060TS-1FGG484T2
Microchip 数据表

2755 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

微芯片技术

267

Tray

M2S060

活跃

-40°C ~ 125°C (TJ)

Automotive, AEC-Q100, SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 60K Logic Modules

256KB

M2S025TS-1FGG484T2
M2S025TS-1FGG484T2
Microchip 数据表

2100 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

微芯片技术

1.2000 V

267

Tray

M2S025

活跃

0 to 85 °C

Automotive, AEC-Q100, SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 25K Logic Modules

256KB

A2F060M3E-1TQG144
A2F060M3E-1TQG144
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

144

A2F060M3E-1TQG144

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.575 V

5.81

LFQFP,

FLATPACK, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.5 V

1.425 V

85 °C

8542.39.00.01

CMOS

QUAD

鸥翼

0.5 mm

compliant

S-PQFP-G144

OTHER

1536 CLBS, 60000 GATES

1.6 mm

现场可编程门阵列

1536

60000

20 mm

20 mm

A2F060M3E-TQG144
A2F060M3E-TQG144
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

144

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

8.63

1.575 V

MICROSEMI CORP

Obsolete

Microsemi Corporation

SQUARE

LFQFP

80 MHz

A2F060M3E-TQG144

85 °C

1.425 V

30

1.5 V

e3

PURE MATTE TIN (394)

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

250

0.5 mm

compliant

S-PQFP-G144

33

不合格

1.5,1.8,2.5,3.3 V

OTHER

33

1536 CLBS, 60000 GATES

1.6 mm

现场可编程门阵列

1536

1536

60000

20 mm

20 mm