类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | 核心处理器 | 周边设备 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | EEPROM 大小 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 产品类别 | 长度 | 宽度 | ||||||||||||||||||||||||||||||||||||||
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![]() | AGFB022R24C2E1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA022R31C3E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 720 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-VFG784 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-FBGA | 784-VFBGA (23x23) | 微芯片技术 | 395 | Tray | 活跃 | 56500 LE | + 85 C | 0 C | SMD/SMT | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB022R25A1I1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 624 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX065HH3F35E2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 392 | 活跃 | Tray | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB022R24C3E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA008R24C2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 576 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1EG-1SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 活跃 | - | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1702-2MSENSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | Tray | 活跃 | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2LSEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 活跃 | 692 | Tray | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EG-2FBVB900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 活跃 | 204 | Tray | XCZU5 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX065HH1F35I1VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | Tray | 392 | 活跃 | -40°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R25A2I2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 624 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4146LQS-S273 | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | 4900 | Infineon | Infineon Technologies | Details | 34 | Tray | A/D 16x10b, 12x12b SAR; D/A 2x7b | 活跃 | 有 | -40°C ~ 105°C (TA) | Tray | Automotive, AEC-Q100, PSOC® 4 CY8C4100 | SOC - Systems on a Chip | External, Internal | 48MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 64KB (64K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147LQE-S273T | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | CY8C4147 | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 2500 | Infineon | Infineon Technologies | Details | 34 | Tape & Reel (TR) | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147AZE-S275T | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP | 64-TQFP (10x10) | Infineon Technologies | CY8C4147 | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 1500 | Infineon | Infineon Technologies | Details | 54 | Tape & Reel (TR) | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT | FLASH | 32-Bit | 128KB (128K x 8) | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4126LQA-S453T | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | CY8C4126 | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 2500 | Infineon | Infineon Technologies | Details | 34 | Tape & Reel (TR) | -40°C ~ 85°C (TA) | Reel | PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | Internal | 24MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT | FLASH | 32-Bit | 64KB (64K x 8) | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4126LQE-S453 | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | Infineon | Infineon Technologies | 活跃 | Details | 34 | Tray | A/D 16x10b, 20x12b SAR | 有 | 4900 | -40°C ~ 125°C (TA) | Tray | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | Internal | 24MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT | FLASH | 32-Bit | 64KB (64K x 8) | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4126LQA-S453 | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | 4900 | Infineon | Infineon Technologies | Details | 34 | Tray | A/D 16x10b, 20x12b SAR | 活跃 | 有 | -40°C ~ 85°C (TA) | Tray | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | Internal | 24MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT | FLASH | 32-Bit | 64KB (64K x 8) | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147LQS-S273 | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | CY8C4147 | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 4900 | Infineon | Infineon Technologies | Details | 34 | Tray | -40°C ~ 105°C (TA) | Tray | Automotive, AEC-Q100, PSOC® 4 CY8C4100 | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H2F34E2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 964970 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS027H2F34E2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.43 | 384 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||
![]() | AGFA014R24C2E4F | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1702-2MLEVSVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | AMD | 500 | Tray | 活跃 | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB006R16A2E4F | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 384 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB022R24C2E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - |
AGFB022R24C2E1V
Intel
分类:Embedded - System On Chip (SoC)
AGFA022R31C3E4X
Intel
分类:Embedded - System On Chip (SoC)
M2S060TS-VFG784
Microchip
分类:Embedded - System On Chip (SoC)
AGFB022R25A1I1V
Intel
分类:Embedded - System On Chip (SoC)
1SX065HH3F35E2VG
Intel
分类:Embedded - System On Chip (SoC)
AGFB022R24C3E3V
Intel
分类:Embedded - System On Chip (SoC)
AGFA008R24C2E3V
Intel
分类:Embedded - System On Chip (SoC)
XCZU1EG-1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
XCVC1702-2MSENSVG1369
AMD
分类:Embedded - System On Chip (SoC)
XCVC1902-2LSEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
XCZU5EG-2FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
1SX065HH1F35I1VG
Intel
分类:Embedded - System On Chip (SoC)
AGFB027R25A2I2V
Intel
分类:Embedded - System On Chip (SoC)
CY8C4146LQS-S273
Infineon
分类:Embedded - System On Chip (SoC)
CY8C4147LQE-S273T
Infineon
分类:Embedded - System On Chip (SoC)
CY8C4147AZE-S275T
Infineon
分类:Embedded - System On Chip (SoC)
CY8C4126LQA-S453T
Infineon
分类:Embedded - System On Chip (SoC)
CY8C4126LQE-S453
Infineon
分类:Embedded - System On Chip (SoC)
CY8C4126LQA-S453
Infineon
分类:Embedded - System On Chip (SoC)
CY8C4147LQS-S273
Infineon
分类:Embedded - System On Chip (SoC)
10AS027H2F34E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
AGFA014R24C2E4F
Intel
分类:Embedded - System On Chip (SoC)
XCVC1702-2MLEVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
AGFB006R16A2E4F
Intel
分类:Embedded - System On Chip (SoC)
AGFB022R24C2E4X
Intel
分类:Embedded - System On Chip (SoC)
