类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | Core | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 阀门数量 | 速度等级 | 主要属性 | 逻辑块数量 | 最大结点温度(Tj) | 逻辑单元数 | 核数量 | 等效门数 | 闪光大小 | 高度 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||
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![]() | M2S025TS-VFG256 | Microchip Technology | 数据表 | 2398 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | 256-FPBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 119 | 138 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-1VFG400 | Microchip Technology | 数据表 | 2287 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 90 | 1.2000 V | 207 | Tray | M2S050 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010TS-VFG400I | Microchip Technology | 数据表 | 36 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-400 | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 12084 LE | 有 | 1007 LAB | 90 | 195 | Tray | M2S010 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-1FGG484 | Microchip Technology | 数据表 | 2252 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 64 kB | 56520 LE | 有 | 4710 LAB | 60 | SmartFusion2 | 395 | FLASH | Tray | M2S060 | 活跃 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 85 °C | 0 °C | 166 MHz | 3.45 V | 1.14 V | 256 kB | 166MHz | 1.3 MB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 56520 | FPGA - 60K Logic Modules | 85 °C | 1 Core | 256KB | 2.44 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-VF400 | Microchip Technology | 数据表 | 2406 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 90 | 207 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025T-FGG484I | Microchip Technology | 数据表 | 2659 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 27696 LE | 有 | 2308 LAB | 60 | 1.14 V | 微芯片技术 | 1.26 V | 267 | Tray | M2S025 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 有 | M2S025T-FGG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.78 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | STD | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||
![]() | M2S010TS-FGG484I | Microchip Technology | 数据表 | 2473 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 60 | 233 | 微芯片技术 | Tray | M2S010 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 有 | M2S010TS-FGG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||
![]() | M2S025T-VFG256I | Microchip Technology | 数据表 | 19 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | ARM Cortex M3 | 138 | 微芯片技术 | Tray | M2S025 | 活跃 | LFBGA, BGA256,16X16,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | 5.78 | 1.26 V | MICROSEMI CORP | 活跃 | SQUARE | LFBGA | M2S025T-VFG256I | 有 | 1.14 V | 1.2 V | BGA256,16X16,32 | PLASTIC/EPOXY | 3 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 119 | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | 40 | S-PBGA-B256 | 138 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | STD | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||
![]() | M2S025TS-VFG400 | Microchip Technology | 数据表 | 2337 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 207 | Tray | 微芯片技术 | M2S025 | 活跃 | 有 | M2S025TS-VFG400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.82 | 85 °C | 1.14 V | 40 | 1.2 V | BGA400,20X20,32 | PLASTIC/EPOXY | 3 | GRID ARRAY, LOW PROFILE, FINE PITCH | LFBGA, BGA400,20X20,32 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 90 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||
![]() | M2S090T-1FG484M | Microchip Technology | 数据表 | 576 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 86316 LE | 有 | 7193 LAB | 60 | 267 | 微芯片技术 | Tray | M2S090 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | -55 °C | 1.2 V | 30 | 1.14 V | 125 °C | 无 | M2S090T-1FG484M | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||
![]() | M2S050TS-FG484I | Microchip Technology | 数据表 | 2106 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 微芯片技术 | M2S050 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | 1.2 V | 30 | 1.14 V | 无 | M2S050TS-FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.88 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 60 | 267 | Tray | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | 无 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | 现场可编程门阵列 | FPGA - 50K Logic Modules | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||
![]() | M2S150TS-1FCSG536 | Microchip Technology | 数据表 | 555 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | ARM Cortex M3 | 293 | Tray | 微芯片技术 | M2S150 | 活跃 | 5.82 | 1.26 V | MICROSEMI CORP | 活跃 | SQUARE | BGA | M2S150TS-1FCSG536 | 有 | 85 °C | 1.14 V | 40 | 1.2 V | PLASTIC/EPOXY | 3 | 网格排列 | FBGA-536 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 90 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | 有 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | compliant | S-PBGA-B536 | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-1VF400I | Microchip Technology | 数据表 | 2062 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 56340 LE | 有 | 4695 LAB | 90 | 1.2000 V | 微芯片技术 | 1.14 V | 1.26 V | 207 | Tray | M2S050 | 活跃 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 无 | M2S050T-1VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | -40 to 100 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | 现场可编程门阵列 | 1 | FPGA - 50K Logic Modules | 48672 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||
![]() | M2S025TS-FG484 | Microchip Technology | 数据表 | 2241 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 60 | 267 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-1VF256I | Microchip Technology | 数据表 | 19 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | ARM Cortex M3 | 119 | 138 | 微芯片技术 | Tray | M2S010 | 活跃 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 30 | 1.14 V | 无 | M2S010-1VF256I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||
![]() | M2S025TS-1VF256I | Microchip Technology | 数据表 | 2747 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | ARM Cortex M3 | 微芯片技术 | Tray | M2S025 | 活跃 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | 1.2 V | 30 | 1.14 V | 无 | M2S025TS-1VF256I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.88 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 119 | 138 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | 无 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.56 mm | 现场可编程门阵列 | FPGA - 25K Logic Modules | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||
![]() | M2S010-VF256 | Microchip Technology | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | ARM Cortex M3 | Tray | 微芯片技术 | M2S010 | 活跃 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S010-VF256 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 119 | 138 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | |||||||||||||||||||||||||||||||
![]() | M2S025-1VFG400I | Microchip Technology | 数据表 | 2108 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | - | 64 kB | 27696 LE | 有 | 2308 LAB | 90 | 207 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150T-FCVG484I | Microchip Technology | 数据表 | 2110 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA | 484-FBGA (19x19) | ARM Cortex M3 | 微芯片技术 | 有 | 12177 LAB | 84 | 273 | Tray | M2S150 | 活跃 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 146124 LE | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060T-1FGG676I | Microchip Technology | 数据表 | 2154 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | ARM Cortex M3 | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 微芯片技术 | 387 | Tray | M2S060 | 活跃 | MICROSEMI CORP | 1.26 V | 5.8 | 活跃 | SQUARE | BGA | M2S060T-1FGG676I | 有 | 1.14 V | 40 | 1.2 V | BGA676,26X26,40 | PLASTIC/EPOXY | 3 | 网格排列 | FBGA-676 | SmartFusion2 | 40 | 4710 LAB | 有 | 56520 LE | 64 kB | - | - | 166 MHz | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 387 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | 现场可编程门阵列 | 1 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | ||||||||||||||||||||||||||||||
![]() | M2S090T-1FG484I | Microchip Technology | 数据表 | 2451 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 有 | 7193 LAB | 60 | 1.2000 V | 微芯片技术 | 267 | Tray | M2S090 | 活跃 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 无 | M2S090T-1FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | -40 to 100 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | 1 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||
![]() | M2S025TS-VF256 | Microchip Technology | 数据表 | 19 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | 256-FPBGA (14x14) | ARM Cortex M3 | 微芯片技术 | 119 | 138 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010TS-1VFG400 | Microchip Technology | 数据表 | 36 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | VFPBGA-400 | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 166 MHz | SMD/SMT | Details | This product may require additional documentation to export from the United States. | 195 | Tray | M2S010 | 活跃 | 90 | 1007 LAB | 有 | 12084 LE | 64 kB | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-VF400I | Microchip Technology | 数据表 | 2179 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-400 | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 27696 LE | 有 | 2308 LAB | 90 | 207 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-FG484 | Microchip Technology | 数据表 | 2427 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 64 kB | 2000 LE | 161 I/O | 0 C | + 85 C | 有 | - | 微芯片技术 | 60 | SmartFusion | Tray | A2F200 | 活跃 | BGA, BGA484,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,26X26,40 | 1.5 V | 30 | 1.425 V | 85 °C | 无 | A2F200M3F-FG484 | 80 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 5.24 | N | SMD/SMT | 80 MHz | - | - | 0°C ~ 85°C (TJ) | Tray | A2F200 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 94 | 不合格 | 1.5,1.8,2.5,3.3 V | OTHER | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 94 | 4608 CLBS, 200000 GATES | 2.44 mm | 现场可编程门阵列 | 200000 | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | 256KB | 23 mm | 23 mm |
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