类别是'category.片上系统(SoC)' (7695)

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M2S025TS-VFG256
M2S025TS-VFG256
Microchip Technology 数据表

2398 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LBGA

256-FPBGA (17x17)

ARM Cortex M3

微芯片技术

119

138

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

27696 LE

2308 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S050T-1VFG400
M2S050T-1VFG400
Microchip Technology 数据表

2287 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

166 MHz

-

-

64 kB

56340 LE

4695 LAB

90

1.2000 V

207

Tray

M2S050

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

0 to 85 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 50K Logic Modules

1 Core

256KB

M2S010TS-VFG400I
M2S010TS-VFG400I
Microchip Technology 数据表

36 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

12084 LE

1007 LAB

90

195

Tray

M2S010

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 10K Logic Modules

1 Core

256KB

M2S060TS-1FGG484
M2S060TS-1FGG484
Microchip Technology 数据表

2252 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

64 kB

56520 LE

4710 LAB

60

SmartFusion2

395

FLASH

Tray

M2S060

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

85 °C

0 °C

166 MHz

3.45 V

1.14 V

256 kB

166MHz

1.3 MB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

56520

FPGA - 60K Logic Modules

85 °C

1 Core

256KB

2.44 mm

M2S025TS-VF400
M2S025TS-VF400
Microchip Technology 数据表

2406 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

400-LFBGA

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

90

207

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

27696 LE

2308 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S025T-FGG484I
M2S025T-FGG484I
Microchip Technology 数据表

2659 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

27696 LE

2308 LAB

60

1.14 V

微芯片技术

1.26 V

267

Tray

M2S025

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

M2S025T-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.78

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

STD

FPGA - 25K Logic Modules

27696

1 Core

256KB

23 mm

23 mm

M2S010TS-FGG484I
M2S010TS-FGG484I
Microchip Technology 数据表

2473 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

60

233

微芯片技术

Tray

M2S010

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

M2S010TS-FGG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

1007 LAB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

233

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

23 mm

23 mm

M2S025T-VFG256I
M2S025T-VFG256I
Microchip Technology 数据表

19 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LBGA

YES

256-FPBGA (17x17)

256

ARM Cortex M3

138

微芯片技术

Tray

M2S025

活跃

LFBGA, BGA256,16X16,32

GRID ARRAY, LOW PROFILE, FINE PITCH

5.78

1.26 V

MICROSEMI CORP

活跃

SQUARE

LFBGA

M2S025T-VFG256I

1.14 V

1.2 V

BGA256,16X16,32

PLASTIC/EPOXY

3

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

27696 LE

2308 LAB

119

1.2000 V

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

40

S-PBGA-B256

138

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

STD

FPGA - 25K Logic Modules

27696

1 Core

256KB

14 mm

14 mm

M2S025TS-VFG400
M2S025TS-VFG400
Microchip Technology 数据表

2337 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

400-LFBGA

YES

400-VFBGA (17x17)

400

ARM Cortex M3

207

Tray

微芯片技术

M2S025

活跃

M2S025TS-VFG400

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.82

85 °C

1.14 V

40

1.2 V

BGA400,20X20,32

PLASTIC/EPOXY

3

GRID ARRAY, LOW PROFILE, FINE PITCH

LFBGA, BGA400,20X20,32

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

27696 LE

2308 LAB

90

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

207

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

现场可编程门阵列

FPGA - 25K Logic Modules

27696

1 Core

256KB

17 mm

17 mm

M2S090T-1FG484M
M2S090T-1FG484M
Microchip Technology 数据表

576 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

86316 LE

7193 LAB

60

267

微芯片技术

Tray

M2S090

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-55 °C

1.2 V

30

1.14 V

125 °C

M2S090T-1FG484M

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

-55°C ~ 125°C (TJ)

Tray

SmartFusion2

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

MILITARY

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

M2S050TS-FG484I
M2S050TS-FG484I
Microchip Technology 数据表

2106 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

YES

484-FPBGA (23x23)

484

ARM Cortex M3

微芯片技术

M2S050

活跃

FBGA-484

网格排列

3

PLASTIC/EPOXY

1.2 V

30

1.14 V

M2S050TS-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

56340 LE

4695 LAB

60

267

Tray

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

2.44 mm

现场可编程门阵列

FPGA - 50K Logic Modules

1 Core

256KB

23 mm

23 mm

M2S150TS-1FCSG536
M2S150TS-1FCSG536
Microchip Technology 数据表

555 In Stock

-

最小起订量: 1

最小包装量: 1

536-LFBGA, CSPBGA

YES

536-CSPBGA (16x16)

536

ARM Cortex M3

293

Tray

微芯片技术

M2S150

活跃

5.82

1.26 V

MICROSEMI CORP

活跃

SQUARE

BGA

M2S150TS-1FCSG536

85 °C

1.14 V

40

1.2 V

PLASTIC/EPOXY

3

网格排列

FBGA-536

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

146124 LE

12177 LAB

90

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

compliant

S-PBGA-B536

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

现场可编程门阵列

FPGA - 150K Logic Modules

1 Core

512KB

M2S050T-1VF400I
M2S050T-1VF400I
Microchip Technology 数据表

2062 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

ARM Cortex M3

56340 LE

4695 LAB

90

1.2000 V

微芯片技术

1.14 V

1.26 V

207

Tray

M2S050

活跃

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

M2S050T-1VF400I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.3

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

-40 to 100 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

1

FPGA - 50K Logic Modules

48672

1 Core

256KB

17 mm

17 mm

M2S025TS-FG484
M2S025TS-FG484
Microchip Technology 数据表

2241 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

484-BGA

484-FPBGA (23x23)

ARM Cortex M3

微芯片技术

60

267

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

27696 LE

2308 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S010-1VF256I
M2S010-1VF256I
Microchip Technology 数据表

19 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-256

YES

256-FPBGA (14x14)

256

ARM Cortex M3

119

138

微芯片技术

Tray

M2S010

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

M2S010-1VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

12084 LE

1007 LAB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

M2S025TS-1VF256I
M2S025TS-1VF256I
Microchip Technology 数据表

2747 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LFBGA

YES

256-FPBGA (14x14)

256

ARM Cortex M3

微芯片技术

Tray

M2S025

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

30

1.14 V

M2S025TS-1VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.88

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

27696 LE

2308 LAB

119

138

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1.56 mm

现场可编程门阵列

FPGA - 25K Logic Modules

1 Core

256KB

14 mm

14 mm

M2S010-VF256
M2S010-VF256
Microchip Technology 数据表

49 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LFBGA

YES

256-FPBGA (14x14)

256

ARM Cortex M3

Tray

微芯片技术

M2S010

活跃

VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

30

1.14 V

85 °C

M2S010-VF256

LFBGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.81

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

12084 LE

1007 LAB

119

138

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

M2S025-1VFG400I
M2S025-1VFG400I
Microchip Technology 数据表

2108 In Stock

-

最小起订量: 1

最小包装量: 1

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

-

64 kB

27696 LE

2308 LAB

90

207

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

Details

SMD/SMT

166 MHz

-

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 25K Logic Modules

1 Core

256KB

M2S150T-FCVG484I
M2S150T-FCVG484I
Microchip Technology 数据表

2110 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA

484-FBGA (19x19)

ARM Cortex M3

微芯片技术

12177 LAB

84

273

Tray

M2S150

活跃

This product may require additional documentation to export from the United States.

Details

166 MHz

-

-

64 kB

146124 LE

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 150K Logic Modules

1 Core

512KB

M2S060T-1FGG676I
M2S060T-1FGG676I
Microchip Technology 数据表

2154 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

676-BGA

YES

676-FBGA (27x27)

676

ARM Cortex M3

Details

This product may require additional documentation to export from the United States.

1.2000 V

微芯片技术

387

Tray

M2S060

活跃

MICROSEMI CORP

1.26 V

5.8

活跃

SQUARE

BGA

M2S060T-1FGG676I

1.14 V

40

1.2 V

BGA676,26X26,40

PLASTIC/EPOXY

3

网格排列

FBGA-676

SmartFusion2

40

4710 LAB

56520 LE

64 kB

-

-

166 MHz

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

387

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

387

2.44 mm

现场可编程门阵列

1

FPGA - 60K Logic Modules

56520

1 Core

256KB

27 mm

27 mm

M2S090T-1FG484I
M2S090T-1FG484I
Microchip Technology 数据表

2451 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

7193 LAB

60

1.2000 V

微芯片技术

267

Tray

M2S090

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

1.14 V

M2S090T-1FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.83

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

86316 LE

-40 to 100 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

1

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

M2S025TS-VF256
M2S025TS-VF256
Microchip Technology 数据表

19 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

256-LFBGA

256-FPBGA (14x14)

ARM Cortex M3

微芯片技术

119

138

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

N

166 MHz

-

-

64 kB

27696 LE

2308 LAB

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

M2S010TS-1VFG400
M2S010TS-1VFG400
Microchip Technology 数据表

36 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

166 MHz

SMD/SMT

Details

This product may require additional documentation to export from the United States.

195

Tray

M2S010

活跃

90

1007 LAB

12084 LE

64 kB

-

-

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 10K Logic Modules

1 Core

256KB

M2S025TS-VF400I
M2S025TS-VF400I
Microchip Technology 数据表

2179 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

VFPBGA-400

400-VFBGA (17x17)

ARM Cortex M3

微芯片技术

27696 LE

2308 LAB

90

207

Tray

M2S025

活跃

This product may require additional documentation to export from the United States.

N

SMD/SMT

166 MHz

-

-

64 kB

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 25K Logic Modules

1 Core

256KB

A2F200M3F-FG484
A2F200M3F-FG484
Microchip Technology 数据表

2427 In Stock

-

最小起订量: 1

最小包装量: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

ARM Cortex M3

64 kB

2000 LE

161 I/O

0 C

+ 85 C

-

微芯片技术

60

SmartFusion

Tray

A2F200

活跃

BGA, BGA484,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA484,26X26,40

1.5 V

30

1.425 V

85 °C

A2F200M3F-FG484

80 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

N

SMD/SMT

80 MHz

-

-

0°C ~ 85°C (TJ)

Tray

A2F200

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

94

不合格

1.5,1.8,2.5,3.3 V

OTHER

2 mA

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

256 kB

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

94

4608 CLBS, 200000 GATES

2.44 mm

现场可编程门阵列

200000

STD

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

4608

1 Core

200000

256KB

23 mm

23 mm