类别是'category.模拟开关和多路复用器ICs' (10000)

  • 所有品牌

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

工厂交货时间

Mounting type

表面安装

材料

质量

形状

终端数量

第一种连接器安装类型

电缆材料

Additional

Allowable deviation of characteristics

Cable type

Case

Case diameter

Colour

Date Of Intro

Electrical mounting

Features of semiconductor devices

Gross weight

Heatsink shape

Heatsinks features

Kind of package

Leads

Magnet diameter

Material finishing

Max. forward impulse current

Max. forward voltage

Max. off-state voltage

Maximum bundle diameter

Maximum power

Mechanical mounting

Mounting method

Noal voltage

Operating ambient temperature

Operating frequency range

Plate thickness

Resonant frequency

Teral type

Thermal resistance @200 LFM

Transport packaging size/quantity

Tripping temperature

Type of bridge rectifier

Type of heatsink

Working load

Operating temperature

包装

系列

JESD-609代码

无铅代码

零件状态

ECCN 代码

Connector type

类型

定位的数量

端子表面处理

颜色

附加功能

HTS代码

端子位置

终端形式

屏蔽/屏蔽

峰值回流焊温度(摄氏度)

功能数量

入口保护

端子间距

深度

Reach合规守则

时间@峰值回流温度-最大值(s)

输出量

引脚数量

JESD-30代码

资历状况

电源电压-最大值(Vsup)

线规

温度等级

电源电压-最小值(Vsup)

通道数量

模拟 IC - 其他类型

极化

阻抗

Cable length

使用方法

Fuse type

座位高度-最大

供应电流-最大值(Isup)

负电源电压(Vsup)

Operating temperature range

第一个连接器性别

第一个连接器加载的位置数

第一种连接器类型

第一个连接器的位置数

装配配置

增益

第二个连接器类型

第一个连接器外壳尺寸 - 插入

Frequency range

筛选水平

断态隔离-标称

最大负电源电压(Vsup)

Antenna type

通态电阻匹配标称

电压驻波比

Load current

开关量

开启时间-最大值

关机时间-最大值

正常位置

Sound pressure level (SPL)

Conductor diameter

信号电流-最大值

第二个连接器加载的位置数

最小负电源电压(Vsup)

饱和电流

正极输入电压-最大值

最大负输入电压

Thermal resistance

高度

长度

宽度

74HCT1G66GW-Q100
74HCT1G66GW-Q100
Nexperia 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

polyamide PA66, white

5

活跃

0.62

NEXPERIA

142 Ω

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP5,.08

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

5 V

48*31.5*27/10000

thread (d) - M5; thread length (L) - 25 mm

e3

polyamide screw DIN84 series

TIN

8542.39.00.01

DUAL

鸥翼

260

1

0.65 mm

compliant

30

独立输出

R-PDSO-G5

5.5 V

4.5 V

1

SPST

1.1 mm

0.02 mA

AEC-Q100

50 dB

MAKE-BEFORE-BREAK

36 ns

53 ns

NO

1

2 mm

1.25 mm

DG412DY-T1-E3
DG412DY-T1-E3
Vishay Intertechnologies 数据表

34 In Stock

-

最小起订量: 1

最小包装量: 1

8 Weeks

YES

16

-40 °C

85 °C

35 Ω

VISHAY INTERTECHNOLOGY INC

活跃

SOP

SOP16,.25

RECTANGULAR

小概要

15 V

PLASTIC/EPOXY

e3

Matte Tin (Sn)

DUAL

鸥翼

260

4

1.27 mm

compliant

30

独立输出

R-PDSO-G16

不合格

INDUSTRIAL

1

SPST

1.75 mm

-15 V

68 dB

BREAK-BEFORE-MAKE

220 ns

160 ns

NO

1

9.9 mm

3.9 mm

74HC4052D
74HC4052D
Philips Semiconductors 数据表

5000 In Stock

-

最小起订量: 1

最小包装量: 1

YES

aluminium

16

Transferred

black

飞利浦半导体

10.94 g

grilled

225 Ω

anodized

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

小概要

5 V

for back plate

1.5mm

4.3°C/W

extruded

e4

镍钯金

8542.39.00.01

DUAL

鸥翼

260

1

1.27 mm

unknown

R-PDSO-G16

不合格

10 V

INDUSTRIAL

2 V

4

差分复用器

BREAK-BEFORE-MAKE

325 ns

0.025 A

1

max. 15°C/W

10mm

35mm

35mm

74HC4052D
74HC4052D
NXP Semiconductors 数据表

2500 In Stock

-

最小起订量: 1

最小包装量: 1

YES

16

Transferred

NXP SEMICONDUCTORS

SOIC

3.90 MM, 1.47 MM THICKNESS, MS-012AC, SOT-109-3, PLASTIC, SO-16

195 Ω

125 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

小概要

5 V

e4

EAR99

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

DUAL

鸥翼

260

1

1.27 mm

unknown

30

16

R-PDSO-G16

不合格

10 V

AUTOMOTIVE

2 V

4

差分复用器

1.75 mm

-4.5 V

50 dB

-5 V

6 Ω

BREAK-BEFORE-MAKE

69 ns

57 ns

0.025 A

-1 V

1

9.9 mm

3.9 mm

74LVC1G66GV
74LVC1G66GV
Philips Semiconductors 数据表

150000 In Stock

-

最小起订量: 1

最小包装量: 1

YES

5

Transferred

飞利浦半导体

150 Ω

125 °C

-40 °C

PLASTIC/EPOXY

TSOP

TSOP5/6,.11,37

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

3.3 V

e3

哑光锡

8542.39.00.01

DUAL

鸥翼

260

1

0.95 mm

unknown

R-PDSO-G5

不合格

AUTOMOTIVE

SPST

MAKE-BEFORE-BREAK

NO

1

DG301ACA
DG301ACA
Harris Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

nylon 66, UL94 V-2, light stabilized

10

Free Hanging (In-Line)

Polyvinyl Chloride (PVC)

HARRIS SEMICONDUCTOR

1492.00

, CAN10,.23

(E) - 295 mm

50 Ω

70 °C

METAL

CAN10,.23

ROUND

CYLINDRICAL

15 V

110*60*15/25

Obsolete

(max) - 80 kg

Box

BC

e0

活跃

Nylon cable tie non-releasable

锡铅

Black

8542.39.00.01

BOTTOM

WIRE

Unshielded

1

IP67 - Dust Tight, Waterproof

unknown

O-MBCY-W10

不合格

Round

COMMERCIAL

1

单刀双掷

工业环境

1 mA

-15 V

-10…+80 °C

内螺纹插座

All

Plug

4

Standard

电线引线

M8

62 dB

BREAK-BEFORE-MAKE

300 ns

3.28' (1.00m)

9 mm

DG301ACA
DG301ACA
General Electric Solid State 数据表

N/A

-

最小起订量: 1

最小包装量: 1

90 g

RG174

GENERAL ELECTRIC SOLID STATE

96.10

Transferred

magnet

1575-1602 MHz

接线板

,

36*36*34/104

-40...+85 °C

Bulk

活跃

SMA-M

Lever

3

Orange

8542.39.00.01

37 mm

unknown

circular

50 Ohm

5000 mm

29 dBi

Active GPS/Glonass external antenna

≤1.5

16 mm

48 mm

74HC1G66GW
74HC1G66GW
NXP Semiconductors 数据表

6000 In Stock

-

最小起订量: 1

最小包装量: 1

YES

aluminium

5

for back plate

5 V

aluminium

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

700 g

grilled

RECTANGULAR

raw

TSSOP6,.08

TSSOP

PLASTIC/EPOXY

-40 °C

125 °C

142 Ω

1.25 MM, PLASTIC, SOT-353, MO-203, SC-88A, TSSOP-5

TSSOT

NXP SEMICONDUCTORS

Transferred

11.5mm

extruded

e3

Tin (Sn)

8542.39.00.01

DUAL

鸥翼

260

1

0.65 mm

compliant

30

5

R-PDSO-G5

不合格

10 V

AUTOMOTIVE

2 V

1

SPST

1.1 mm

50 dB

MAKE-BEFORE-BREAK

30 ns

45 ns

NO

universal

1

67.5mm

0.15m

260mm

74LVC1G3157GW
74LVC1G3157GW
Philips Semiconductors 数据表

340 In Stock

-

最小起订量: 1

最小包装量: 1

for soldering

YES

aluminium

5

presence of a socket (F) Ф4 mm at the end of the plug

Transferred

aluminium

飞利浦半导体

700 g

grilled

for use with ELS3 screw-in solder pin

M3 screw,

raw

19 A

3.3 V

30 (AC/ DC) Vmin

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

RECTANGULAR

TSSOP5/6,.08

TSSOP

PLASTIC/EPOXY

-40 °C

125 °C

45 Ω

8mm

48*31.5*27/5000

extruded

e0

plug (M) Ф4 mm, insulator color - blue

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

鸥翼

1

0.635 mm

44.5 mm

unknown

R-PDSO-G5

不合格

AUTOMOTIVE

2

SINGLE-ENDED MULTIPLEXER

0.04 mA

BREAK-BEFORE-MAKE

Ф3.5 mm

0.05 A

SOT429,

31mm

94mm

50mm

74HC4052N
74HC4052N
NXP Semiconductors 数据表

2 In Stock

-

最小起订量: 1

最小包装量: 1

NO

1.07

16

maximum - 15 A

4.2 mm

Obsolete

NXP SEMICONDUCTORS

DIP

0.300 INCH, PLASTIC, SOT-38-9, DIP-16

250 AC Vmin

195 Ω

maximum - 200 (short-term exposure) °C

125 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5 V

36*28*22/3000

167 °C

maximum - 138 °C

e4

镍钯金

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

case - 11.5 mm

unknown

16

R-PDIP-T16

不合格

10 V

AUTOMOTIVE

2 V

4

差分复用器

thermal fuse

4.32 mm

-4.5 V

50 dB

-5 V

6 Ω

BREAK-BEFORE-MAKE

69 ns

57 ns

0.025 A

-1 V

19.05 mm

7.62 mm

74HCT4051PW
74HCT4051PW
NXP Semiconductors 数据表

5000 In Stock

-

最小起订量: 1

最小包装量: 1

YES

16

15 %

Transferred

NXP SEMICONDUCTORS

9.03

TSSOP

14.5 mm

4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16

1 W

180 Ω

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

5 V

500 Hz

48*30*29/2000

e4

Electrodynamic head (speaker) of the HD-2040 series

Nickel/Palladium/Gold (Ni/Pd/Au)

ALSO OPERATES ON VCC-VEE 2 V TO 10 V SUPPLY

8542.39.00.01

DUAL

鸥翼

260

1

0.65 mm

40 mm

unknown

30

16

R-PDSO-G16

不合格

5.5 V

AUTOMOTIVE

4.5 V

8

SINGLE-ENDED MULTIPLEXER

8 Ohm

1.1 mm

0.32 mA

500-5000 Hz

50 dB

9 Ω

BREAK-BEFORE-MAKE

83 ns

68 ns

85 dB

0.025 A

1

5.8 mm

5 mm

4.4 mm

74HCT4051PW
74HCT4051PW
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

Transferred

飞利浦半导体

270 Ω

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8542.39.00.01

DUAL

鸥翼

260

1

0.635 mm

unknown

R-PDSO-G16

不合格

AUTOMOTIVE

8

SINGLE-ENDED MULTIPLEXER

0.32 mA

BREAK-BEFORE-MAKE

0.025 A

FSA3157P6X
FSA3157P6X
Rochester Electronics LLC 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

6

活跃

ROCHESTER ELECTRONICS INC

19.60

SOIC

TSSOP,

30 Ω

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.3 V

43*34*24/500

e3

哑光锡

2:1 MULTIPLEXER/DEMULTIPLEXER BUS SWITCH

DUAL

鸥翼

260

1

0.65 mm

unknown

30

6

R-PDSO-G6

5.5 V

INDUSTRIAL

1.65 V

1

单刀双掷

1.1 mm

57 dB

0.5 Ω

13 ns

7 ns

1

2 mm

1.25 mm

74HC4052DB
74HC4052DB
Philips Semiconductors 数据表

430 In Stock

-

最小起订量: 1

最小包装量: 1

YES

brush - copper-graphite; conductor - copper

working surface - concave

16

48 mm, side connection

PWS-E flat

screw

glass passivated

Transferred

225 g

飞利浦半导体

bulk

M6 screws

1kA

1.7V

1.2kV

SSOP, SSOP16,.3

screw

270 Ω

125 °C

-40 °C

PLASTIC/EPOXY

SSOP

SSOP16,.3

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

5 V

module - slim

without terminalmin

48*32*27/2000

three-phase

e0

brush for collector motor

Tin/Lead (Sn85Pb15)

8542.39.00.01

DUAL

鸥翼

1

0.635 mm

19.1 mm

not_compliant

R-PDSO-G16

不合格

10 V

AUTOMOTIVE

2 V

4

差分复用器

0.32 mA

127A

BREAK-BEFORE-MAKE

0.025 A

7.9 mm

7.7 mm

74HC4052DB
74HC4052DB
Nexperia 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

PWS-E flat

不推荐

2017-02-01

screw

NEXPERIA

225 g

SSOP,

M6 screws

1.6kA

1.6kV

195 Ω

screw

125 °C

-40 °C

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

5 V

module - slim

single-phase

e4

镍钯金

8542.39.00.01

DUAL

鸥翼

260

2

0.65 mm

compliant

30

R-PDSO-G16

10 V

AUTOMOTIVE

2 V

4

SP4T

2 mm

50 dB

6 Ω

122A

BREAK-BEFORE-MAKE

69 ns

57 ns

1

6.2 mm

5.3 mm

74HCT4066PW
74HCT4066PW
Nexperia 数据表

380 In Stock

-

最小起订量: 1

最小包装量: 1

YES

14

活跃

1991-01-01

NEXPERIA

142 Ω

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

4.5 V

e4

镍钯金

8542.39.00.01

DUAL

鸥翼

260

4

0.65 mm

compliant

30

R-PDSO-G14

5.5 V

AUTOMOTIVE

4.5 V

1

SPST

1.1 mm

50 dB

5 Ω

36 ns

53 ns

1

5 mm

4.4 mm

74HC4351N
74HC4351N
Philips Semiconductors 数据表

126 In Stock

-

最小起订量: 1

最小包装量: 1

NO

20

Transferred

飞利浦半导体

DIP, DIP20,.3

225 Ω

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP20,.3

RECTANGULAR

IN-LINE

e4

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-PDIP-T20

不合格

INDUSTRIAL

8

SINGLE-ENDED MULTIPLEXER

0.16 mA

BREAK-BEFORE-MAKE

300 ns

0.025 A

DG441DY
DG441DY
Vishay Intertechnologies 数据表

23 In Stock

-

最小起订量: 1

最小包装量: 1

YES

16

Obsolete

VISHAY INTERTECHNOLOGY INC

SOIC-16

85 Ω

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

小概要

15 V

DUAL

鸥翼

240

4

1.27 mm

unknown

30

独立输出

R-PDSO-G16

不合格

INDUSTRIAL

1

SPST

1.75 mm

-15 V

60 dB

4 Ω

BREAK-BEFORE-MAKE

250 ns

120 ns

NC

9.9 mm

3.9 mm

DG441DY
DG441DY
Temic Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

TEMIC SEMICONDUCTORS

85 Ω

85 °C

-40 °C

PLASTIC/EPOXY

RECTANGULAR

小概要

15 V

Transferred

DUAL

鸥翼

4

unknown

R-PDSO-G16

不合格

INDUSTRIAL

1

SPST

0.1 mA

-15 V

60 dB

250 ns

120 ns

ADG508FBNZ
ADG508FBNZ
Rochester Electronics LLC 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

16

接触制造商

ROCHESTER ELECTRONICS LLC

DIP

ROHS COMPLIANT, PLASTIC, MS-001AB, DIP-16

390 Ω

85 °C

-40 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

15 V

e3

哑光锡

主动过压保护

8542.39.00.01

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

16

R-PDIP-T16

16.5 V

INDUSTRIAL

13.5 V

8

SINGLE-ENDED MULTIPLEXER

5.33 mm

-15 V

93 dB

-16.5 V

8.1 Ω

300 ns

150 ns

-13.5 V

20.07 mm

7.62 mm

DG186AP/883
DG186AP/883
Temic Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

14

TEMIC SEMICONDUCTORS

10 Ω

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

RECTANGULAR

IN-LINE

15 V

Transferred

DUAL

THROUGH-HOLE

1

unknown

R-CDIP-T14

不合格

MILITARY

1

单刀双掷

3.2 mA

-15 V

55 dB

400 ns

200 ns

DG186AP/883
DG186AP/883
Rochester Electronics LLC 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

14

ROCHESTER ELECTRONICS LLC

DIP,

10 Ω

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

RECTANGULAR

IN-LINE

15 V

Obsolete

8542.39.00.01

DUAL

THROUGH-HOLE

1

unknown

R-CDIP-T14

MILITARY

1

单刀双掷

-15 V

MIL-STD-883

400 ns

200 ns

MC1495D
MC1495D
onsemi 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

14

Obsolete

ON SEMICONDUCTOR

SOIC

PLASTIC, SO-14

3 MHz

70 °C

PLASTIC/EPOXY

SOP

SOP14,.25

RECTANGULAR

小概要

32 V

e0

EAR99

锡铅

8542.39.00.01

DUAL

鸥翼

1

1.27 mm

not_compliant

14

R-PDSO-G14

不合格

COMMERCIAL

相机开发工具

1.75 mm

7 mA

-15 V

10 V

-10 V

8.65 mm

3.9 mm

74HC4051PW
74HC4051PW
Philips Semiconductors 数据表

47 In Stock

-

最小起订量: 1

最小包装量: 1

YES

16

Transferred

飞利浦半导体

270 Ω

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8542.39.00.01

DUAL

鸥翼

260

1

0.635 mm

unknown

R-PDSO-G16

不合格

AUTOMOTIVE

8

SINGLE-ENDED MULTIPLEXER

0.32 mA

BREAK-BEFORE-MAKE

0.025 A

74HC4066PW
74HC4066PW
Philips Semiconductors 数据表

1010 In Stock

-

最小起订量: 1

最小包装量: 1

YES

14

Transferred

飞利浦半导体

142 Ω

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP14,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

e4

镍钯金

8542.39.00.01

DUAL

鸥翼

260

4

0.635 mm

unknown

独立输出

R-PDSO-G14

不合格

INDUSTRIAL

SPST

MAKE-BEFORE-BREAK

NO

1