类别是'category.电信接口IC' (8324)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 模拟 IC - 其他类型 | 操作模式 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 供应电流-最大值(Isup) | 通信IC类型 | 过滤器 | 负电源电压 | 电池供电 | PSRR-Min | 混合动力车 | 电池供电 | 马克斯噪音 | 突破比率 | 长度 | 宽度 | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | TEA1083A | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | DIP | 0.300 INCH, PLASTIC, DIP-16 | 75 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 3.6 V | Obsolete | NXP SEMICONDUCTORS | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | compliant | 16 | R-PDIP-T16 | 不合格 | 商业扩展 | 0.004 mA | 4.7 mm | 电信电路 | 21.6 mm | 7.62 mm | |||||||||||||||||||||||||||||
![]() | MDBT40-P256RV3 | Raytec Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PEF24624E | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.8 V | Obsolete | INFINEON TECHNOLOGIES AG | 19 X 19 MM, PLASTIC, LBGA-324 | 85 °C | 8542.39.00.01 | BOTTOM | BALL | 1 | unknown | S-PBGA-B324 | INDUSTRIAL | 电信电路 | ||||||||||||||||||||||||||||||||||||||
![]() | PEF24624E | Lantiq | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.8 V | Obsolete | LANTIQ | BGA, | 85 °C | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | S-PBGA-B324 | INDUSTRIAL | 电信电路 | ||||||||||||||||||||||||||||||||||||||
![]() | R8075J | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | QCCJ, LDCC28,.5SQ | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC28,.5SQ | SQUARE | CHIP CARRIER | 5 V | 无 | Transferred | 康讯系统 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | compliant | S-PQCC-J28 | 不合格 | COMMERCIAL | |||||||||||||||||||||||||||||||||||
![]() | ATA5746-PXPW | Atmel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | Obsolete | ATMEL CORP | QFN | HVQCCN, LCC24,.2SQ,25 | 105 °C | -40 °C | UNSPECIFIED | HVQCCN | LCC24,.2SQ,25 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | 有 | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.65 mm | compliant | 24 | S-XQCC-N24 | 不合格 | INDUSTRIAL | 0.01 mA | 1 mm | 电信电路 | 5 mm | 5 mm | ||||||||||||||||||||||||||||
![]() | MH88634K | Zarlink Semiconductor Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 21 | SIP, SIP21,.13 | 70 °C | PLASTIC/EPOXY | SIP | SIP21,.13 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | ZARLINK SEMICONDUCTOR INC | e0 | 锡铅 | 8542.39.00.01 | SINGLE | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PSIP-T21 | 不合格 | COMMERCIAL | 0.013 mA | 15.9 mm | SLIC | -5 V | ||||||||||||||||||||||||||||||
![]() | EF2A51A125E10B-T10 | Thin Film Technology Corp (TFT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 2 | 85 °C | -40 °C | PLASTIC/EPOXY | VSON | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | Obsolete | THIN FILM TECHNOLOGY CORP | SOIC | VSON, | e4 | 镍镀金 | 8542.39.00.01 | DUAL | 无铅 | 1 | unknown | 2 | R-PDSO-N2 | 不合格 | INDUSTRIAL | 0.35 mm | 线路均衡器 | 1.52 mm | 0.76 mm | |||||||||||||||||||||||||||||||
![]() | PCD3322CT | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | -25 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 3 V | Obsolete | NXP SEMICONDUCTORS | SOP, | 70 °C | SELECTABLE MAKE/BREAK RATIO 1:2 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | R-PDSO-G20 | 不合格 | OTHER | 0.4 mA | 2.65 mm | 电话拨号电路 | 1:1.5 | 12.8 mm | 7.5 mm | ||||||||||||||||||||||||||||||
![]() | TXC-04226 | Transwitch Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | Obsolete | TRANSWITCH CORP | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PEB2041P | Siemens | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XWM9705EFT/V | Cirrus Logic | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | -25 °C | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 3.3 V | Obsolete | CIRRUS LOGIC INC | TFQFP, | 85 °C | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.5 mm | compliant | S-PQFP-G48 | OTHER | SYNCHRONOUS | 1.2 mm | PCM 编解码器 | YES | 7 mm | 7 mm | ||||||||||||||||||||||||||||||||
![]() | TMS3705DDRG4 | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2016-10-20 | Obsolete | TEXAS INSTRUMENTS INC | , | 8542.39.00.01 | unknown | 电信电路 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM2121 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 200 | BGA | BGA, | 1 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.8 V | 无 | Obsolete | BROADCOM CORP | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 200 | S-PBGA-B200 | 不合格 | 电信电路 | ||||||||||||||||||||||||||||||||||||
![]() | SI3019-F-KTR | Silicon Laboratories Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | PLASTIC/EPOXY | TSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.3 V | 无 | Obsolete | SILICON LABORATORIES INC | 70 °C | 8542.39.00.01 | DUAL | 鸥翼 | 0.635 mm | unknown | R-PDSO-G20 | 不合格 | COMMERCIAL | 10 mA | |||||||||||||||||||||||||||||||||||||
![]() | FX-500-LAC-GNJ-A3-B4 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 6 | PACKAGE-6 | 1 | 70 °C | PLASTIC/EPOXY | SOJ | RECTANGULAR | 小概要 | 3.3 V | 有 | Transferred | MICROSEMI CORP | e4 | 镍金 | 8542.39.00.01 | DUAL | J BEND | 260 | 1 | 2.54 mm | compliant | 30 | R-PDSO-J6 | COMMERCIAL | 4.69 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 13.97 mm | 8.89 mm | |||||||||||||||||||||||||||||
![]() | FX-500-LAC-GNJ-A3-B4 | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | PACKAGE-6 | 70 °C | CERAMIC, METAL-SEALED COFIRED | SOJ | SOJ8(UNSPEC) | RECTANGULAR | 小概要 | 3.3 V | 有 | Obsolete | MICROCHIP TECHNOLOGY INC | 8542.39.00.01 | DUAL | J BEND | 1 | 2.54 mm | compliant | R-CDSO-J6 | 3.6 V | 3 V | 锁相环频率合成器 | 4.69 mm | 40 mA | 13.97 mm | 8.89 mm | |||||||||||||||||||||||||||||||
![]() | FX-500-LAC-GNJ-A3-B4 | Vectron International | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 6 | PACKAGE-6 | 1 | 70 °C | PLASTIC/EPOXY | SOJ | RECTANGULAR | 小概要 | 3.3 V | 有 | Transferred | VECTRON INTERNATIONAL | e4 | 有 | 镍金 | 8542.39.00.01 | DUAL | J BEND | 260 | 1 | 2.54 mm | compliant | 30 | R-PDSO-J6 | COMMERCIAL | 4.69 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 13.97 mm | 8.89 mm | ||||||||||||||||||||||||||||
![]() | PBL3762/2J | Ericsson | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 22 | Obsolete | 爱立信电源模块 | DIP | DIP, DIP22,.4 | 85 °C | -40 °C | CERAMIC, GLASS-SEALED | DIP | DIP22,.4 | RECTANGULAR | IN-LINE | 5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 22 | R-GDIP-T22 | 不合格 | INDUSTRIAL | 5.5 mA | 5.08 mm | SLIC | -5 V | RESISTIVE | 48 dB | 2-4 CONVERSION | -24 TO -58 V | 8.9 dBrnC | 27.84 mm | 10.16 mm | ||||||||||||||||||||
![]() | BG95-M5 | Quectel Wireless Solutions Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 102 | -35 °C | UNSPECIFIED | XMA | RECTANGULAR | 微电子组件 | 3.8 V | 接触制造商 | QUECTEL WIRELESS SOLUTIONS CO LTD | XMA, | 75 °C | SEATED HGT-NOM; Data Rate(kbps) :For LTE Cat M1-588(DL), Cat NB2-127(DL), 158.5(UL) | 8542.39.00.01 | UNSPECIFIED | 无铅 | 1 | unknown | R-XXMA-N102 | 商业扩展 | 1119 Mbps | 2.2 mm | 电信电路 | 23.6 mm | 19.9 mm | |||||||||||||||||||||||||||||||||
![]() | CG31-80 SB | Micro Dimensional Products Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SC11309CN | Sierra Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | 70 °C | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | SIERRA SEMICONDUCTOR | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | 不合格 | COMMERCIAL | 12 mA | 线路均衡器 | ||||||||||||||||||||||||||||||||||
![]() | RF6569SB | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | -40 °C | UNSPECIFIED | HLGA | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 3.6 V | Transferred | RF MICRO DEVICES INC | HLGA, | 85 °C | 5A991.G | 8517.70.00.00 | BOTTOM | BUTT | 1 | unknown | S-XBGA-B28 | INDUSTRIAL | 1.25 mm | 电信电路 | 5.5 mm | 5 mm | ||||||||||||||||||||||||||||||||||
![]() | TR8001 | Murata Connectivity | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | QCCN, | 85 °C | -40 °C | UNSPECIFIED | QCCN | RECTANGULAR | CHIP CARRIER | 3 V | Transferred | RF MONOLITHICS INC | QFN | 8542.39.00.01 | QUAD | 无铅 | 1 | 1 mm | unknown | 20 | R-XQCC-N20 | 不合格 | INDUSTRIAL | 2 mm | 电信电路 | 10.7 mm | 6.8 mm | |||||||||||||||||||||||||||||||
![]() | NCV7343D21R2G | onsemi | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 4 Weeks | 活跃 | 751A-03 | 2 | e3 | 有 | Matte Tin (Sn) - annealed | 电路接口 |
TEA1083A
NXP Semiconductors
分类:Interface - Telecom
MDBT40-P256RV3
Raytec Corporation
分类:Interface - Telecom
PEF24624E
Infineon Technologies AG
分类:Interface - Telecom
PEF24624E
Lantiq
分类:Interface - Telecom
R8075J
Conexant Systems Inc
分类:Interface - Telecom
ATA5746-PXPW
Atmel Corporation
分类:Interface - Telecom
MH88634K
Zarlink Semiconductor Inc
分类:Interface - Telecom
EF2A51A125E10B-T10
Thin Film Technology Corp (TFT)
分类:Interface - Telecom
PCD3322CT
NXP Semiconductors
分类:Interface - Telecom
TXC-04226
Transwitch Corporation
分类:Interface - Telecom
PEB2041P
Siemens
分类:Interface - Telecom
XWM9705EFT/V
Cirrus Logic
分类:Interface - Telecom
TMS3705DDRG4
Texas Instruments
分类:Interface - Telecom
BCM2121
Broadcom Limited
分类:Interface - Telecom
SI3019-F-KTR
Silicon Laboratories Inc
分类:Interface - Telecom
FX-500-LAC-GNJ-A3-B4
Microsemi Corporation
分类:Interface - Telecom
FX-500-LAC-GNJ-A3-B4
Microchip Technology Inc
分类:Interface - Telecom
FX-500-LAC-GNJ-A3-B4
Vectron International
分类:Interface - Telecom
PBL3762/2J
Ericsson
分类:Interface - Telecom
BG95-M5
Quectel Wireless Solutions Co Ltd
分类:Interface - Telecom
CG31-80 SB
Micro Dimensional Products Inc
分类:Interface - Telecom
SC11309CN
Sierra Semiconductor
分类:Interface - Telecom
RF6569SB
RF Micro Devices Inc
分类:Interface - Telecom
TR8001
Murata Connectivity
分类:Interface - Telecom
NCV7343D21R2G
onsemi
分类:Interface - Telecom
