NXP Semiconductors TDA18250BHN/C1
- 收藏
- 对比
TDA18250BHN/C1
1786-TDA18250BHN/C1
接口 - 电信
--
大陆
立即发货

IC SPECIALTY TELECOM CIRCUIT, Telecom IC:Other
--最小包装量--
TDA18250BHN/C1详情
NXP Semiconductors TDA18250BHN/C1重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
表面安装
YES
Contact plating
gold-plated
Number of pins
3
终端数量
32
Part Life Cycle Code
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
Package Description
5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, ROHS COMPLIANT, HVQFN-32
Package Body Material
PLASTIC/EPOXY
Package Code
QCCN
Package Shape
SQUARE
Package Style
CHIP CARRIER
Supply Voltage-Nom
3.3 V
Type of connector
pin strips
Connector
socket
Kind of connector
female
Spatial orientation
straight
Contacts pitch
2.54mm
Electrical mounting
THT
Connector pinout layout
1x3
Gross weight
0.11 g
Operating temperature
-40...163°C
HTS代码
8542.39.00.01
端子位置
QUAD
终端形式
无铅
功能数量
1
Reach合规守则
unknown
Current rating
1.5A
JESD-30代码
S-PQCC-N32
通信IC类型
电信电路
Rated voltage
60V
个人资料
beryllium copper
Plating thickness
0.254µm
Flammability rating
UL94V-0
TDA18250BHN/C1拓展信息
NXP USA Inc.
NXP USA Inc.
NXP USA Inc.
NXP USA Inc.
NXP USA Inc.
NXP USA Inc.
NXP USA Inc.
NXP
NXP
NXP







哦! 它是空的。