类别是'category.存储器' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 端口的数量 | 电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 建筑学 | 数据总线宽度 | 组织结构 | 输出特性 | 无卤素 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 产品类别 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 访问时间(最大) | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 页面尺寸 | I2C控制字节 | 产品类别 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | 25LC080CT-I/MNY | Microchip Technology | 数据表 | 10000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e4 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.5mm | 40 | 25LC080C | 8 | 5V | SPI, Serial | 8Kb 1K x 8 | 5mA | 10MHz | 100 ns | EEPROM | SPI | 8 | 5ms | 8 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 3mm | 2mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CAT93C46RVP2IGT3 | ON Semiconductor | 数据表 | 3000 In Stock | - | 最小起订量: 1 最小包装量: 1 | CONSULT SALES OFFICE (Last Updated: 1 week ago) | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e4 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 1 | 3V | CAT93C46 | 8 | 5V | Serial | 1Kb 128 x 8 64 x 16 | 1mA | 4MHz | 250 ns | EEPROM | SPI | 64X16 | 无卤素 | 1 kb | 0.00001A | MICROWIRE | 1000000 Write/Erase Cycles | 100 | SOFTWARE | 750μm | 2.1mm | 3.1mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC58BVG1S3HBAI6 | Kioxia America, Inc. | 数据表 | 2688 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 67-VFBGA | YES | Non-Volatile | -40°C~85°C TA | Tray | Benand™ | 活跃 | 3 (168 Hours) | 67 | 2.7V~3.6V | BOTTOM | 1 | 3.3V | 0.8mm | R-PBGA-B67 | 3.6V | 2.7V | 2Gb 256M x 8 | ASYNCHRONOUS | FLASH | Parallel | 256MX8 | 8 | 25ns | 2147483648 bit | 3.3V | 1mm | 8mm | 6.5mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY14B104NA-ZS25XIT | Cypress Semiconductor Corp | 数据表 | 260 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Gold, Tin | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e4 | 活跃 | 3 (168 Hours) | 44 | 3A991.B.2.A | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.41 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 0.8mm | 30 | CY14B104 | 44 | 不合格 | 3V | 3.6V | 2.7V | 4Mb 256K x 16 | 70mA | ASYNCHRONOUS | NVSRAM | Parallel | 16b | 256KX16 | 16 | 25ns | 4 Mb | 0.005A | 25 ns | 16b | 1.194mm | 18.415mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC58CVG0S3HRAIG | Kioxia America, Inc. | 数据表 | 7300 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8-WDFN Exposed Pad | 8-WSON (6x8) | Non-Volatile | -40°C~85°C TA | Tray | 最后一次购买 | 3 (168 Hours) | 2.7V~3.6V | 1Gb 128M x 8 | 104MHz | 155μs | FLASH | SPI - Quad I/O | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25AA080BT-I/SN | Microchip Technology | 数据表 | 7809 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOIC | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2007 | 活跃 | 1 (Unlimited) | 85°C | -40°C | 1.8V~5.5V | 10MHz | 25AA080B | SPI, Serial | 5.5V | 1.8V | 8Kb 1K x 8 | 6mA | 10MHz | 160 ns | EEPROM | SPI | 5ms | 8 kb | 10MHz | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1380S-167BZC | Cypress Semiconductor Corp | 数据表 | 53 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 165-LBGA | YES | 165 | Volatile | 0°C~70°C TA | Tray | 2004 | Obsolete | 3 (168 Hours) | 165 | 流水线结构 | 8542.32.00.41 | 3.135V~3.6V | BOTTOM | 1 | 3.3V | 1mm | unknown | CY7C1380 | 3.6V | 3.135V | 18Mb 512K x 36 | 167MHz | 3.4ns | SRAM | Parallel | 512KX36 | 36 | 18874368 bit | 1.4mm | 15mm | 13mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
S25FL064P0XMFA003 | Cypress Semiconductor Corp | 数据表 | 4868 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2016 | Automotive, AEC-Q100, FL-P | 活跃 | 3 (168 Hours) | 16 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 未说明 | 1 | 3V | 1.27mm | 未说明 | R-PDSO-G16 | 3.6V | 2.7V | 64Mb 8M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI - Quad I/O | 64MX1 | 1 | 5μs, 3ms | 67108864 bit | SERIAL | 3V | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IS61LV25616AL-10TLI-TR | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | Volatile | Industrial grade | -40°C~85°C TA | Tape & Reel (TR) | e3 | yes | 活跃 | 3 (168 Hours) | 44 | Matte Tin (Sn) | 3.135V~3.6V | DUAL | 260 | 1 | 3.3V | 0.8mm | 40 | 44 | 3.3V | 3.63V | 4Mb 256K x 16 | 1 | 110mA | SRAM | Parallel | 3-STATE | 16 | 10ns | 18b | 4 Mb | COMMON | Asynchronous | 16b | 2V | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z18CGB-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 42 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | Tray | GS882Z18CGB | NBT Pipeline/Flow Through | Memory & Data Storage | 9 Mbit | 120 mA, 130 mA | 7.5 ns | 512 k x 18 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS88018CGT-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | TQFP-100 | YES | 100 | - 40 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | LQFP, QFP100,.63X.87 | FLATPACK, LOW PROFILE | 3 | 512000 | PLASTIC/EPOXY | QFP100,.63X.87 | -40 °C | 未说明 | 7.5 ns | 85 °C | 有 | GS88018CGT-150I | 150 MHz | 524288 words | 2.5 V | LQFP | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.3 | QFP | 有 | 150 MHz | + 85 C | 3.6 V | Tray | GS88018CGT | e3 | 有 | 3A991.B.2.B | Pipeline/Flow Through | 纯哑光锡 | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | QUAD | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 不合格 | 2.7 V | 2.5/3.3 V | INDUSTRIAL | 2.3 V | 9 Mbit | SYNCHRONOUS | 140 mA, 150 mA | 7.5 ns | 512 k x 18 | 3-STATE | 1.6 mm | 18 | SRAM | 0.045 A | 9437184 bit | PARALLEL | COMMON | 缓存SRAM | 2.3 V | SRAM | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8162Z18DB-150I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-119 | 150 MHz | + 85 C | 3.6 V | - 40 C | 21 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | 有 | Tray | GS8162Z18DB | NBT Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 190 mA, 200 mA | 7.5 ns | 1 M x 18 | SRAM | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS816136DD-150 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 有 | 150 MHz | + 70 C | 3.6 V | 0 C | 36 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | N | SDR | Tray | GS816136DD | Pipeline/Flow Through | Memory & Data Storage | 18 Mbit | 180 mA, 190 mA | 7.5 ns | 512 k x 36 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS842Z36CGB-100I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | BGA-119 | YES | 119 | 83.3@Flow-Through/100@Pipelined MHz | FBGA | SDR | 2.5, 3.3 V | 2.3, 3 V | Synchronous | 128 kWords | 36 Bit | 2.7, 3.6 V | 表面贴装 | 有 | 100 MHz | + 85 C | 3.6 V | - 40 C | 84 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | NBT SRAM | Details | SDR | BGA, BGA119,7X17,50 | 网格排列 | 128000 | BGA | 5.35 | GSI TECHNOLOGY | 活跃 | RECTANGULAR | BGA | 2.5 V | 100 MHz | GS842Z36CGB-100I | 有 | 85 °C | 12 ns | 未说明 | -40 °C | BGA119,7X17,50 | PLASTIC/EPOXY | Industrial grade | -40 to 100 °C | Tray | GS842Z36CGB | 3A991.B.2.B | NBT Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 未说明 | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | 不合格 | 2.7 V | 2.5/3.3 V | INDUSTRIAL | 2.3 V | 4 Mbit | 4 | SYNCHRONOUS | 130 mA, 140 mA | 12 ns | Flow-Through/Pipelined | 128 k x 36 | 3-STATE | 1.99 mm | 36 | 17 Bit | SRAM | 4 Mbit | 0.045 A | 4718592 bit | Industrial | PARALLEL | COMMON | ZBT SRAM | 2.3 V | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS842Z18CB-100I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | BGA-119 | YES | 119 | Parallel | GSI技术 | GSI技术 | NBT SRAM | SDR | BGA, BGA119,7X17,50 | 网格排列 | 256000 | PLASTIC/EPOXY | BGA119,7X17,50 | 12 ns | 70 °C | 无 | GS842Z18CB-100I | 100 MHz | 262144 words | 2.5 V | BGA | RECTANGULAR | 活跃 | GSI TECHNOLOGY | 5.36 | BGA | 有 | 100 MHz | + 85 C | 3.6 V | - 40 C | 84 | 2.3 V | SMD/SMT | Tray | GS842Z18CB | 3A991.B.2.B | NBT Pipeline/Flow Through | FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | 不合格 | 2.7 V | 2.5/3.3 V | COMMERCIAL | 2.3 V | 4 Mbit | SYNCHRONOUS | 130 mA | 12 ns | 256 k x 18 | 3-STATE | 1.99 mm | 18 | SRAM | 0.045 A | 4718592 bit | PARALLEL | COMMON | ZBT SRAM | 2.3 V | SRAM | 22 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS880E32CGT-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 有 | 250 MHz | + 70 C | 3.6 V | 0 C | 72 | 2.3 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SyncBurst | Details | SDR | Tray | GS880E32CGT | DCD | Memory & Data Storage | 9 Mbit | 155 mA, 195 mA | 5.5 ns | 256 k x 32 | SRAM | SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672D18BE-333I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | BGA-165 | YES | 165 | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | QDR-II | LBGA, BGA165,11X15,40 | GRID ARRAY, LOW PROFILE | 4000000 | PLASTIC/EPOXY | BGA165,11X15,40 | -40 °C | 0.45 ns | 85 °C | 无 | GS8672D18BE-333I | 333 MHz | 4194304 words | 1.8 V | LBGA | RECTANGULAR | Obsolete | GSI TECHNOLOGY | 5.43 | BGA | 有 | 333 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | Tray | GS8672D18BE | 3A991.B.2.B | SigmaQuad-II | 管道结构 | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | 不合格 | 1.9 V | 1.5/1.8,1.8 V | INDUSTRIAL | 1.7 V | 72 Mbit | SYNCHRONOUS | 1.21 A | 4 M x 18 | 3-STATE | 1.5 mm | 18 | SRAM | 72 | PARALLEL | SEPARATE | 标准SRAM | 1.7 V | SRAM | 17 mm | 15 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS882Z18CB-250 | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS8672D18BE-400I | GSI Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-165 | 400 MHz | + 85 C | 1.9 V | - 40 C | 15 | 1.7 V | SMD/SMT | Parallel | GSI技术 | GSI技术 | SigmaQuad-II | QDR-II | 有 | Tray | GS8672D18BE | SigmaQuad-II | Memory & Data Storage | 72 Mbit | 1.38 A | 4 M x 18 | SRAM | 72 | SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX25V8035FZUI | Macronix | 数据表 | 23760 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 8-UFDFN Exposed Pad | YES | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2017 | MXSMIO™ | yes | 活跃 | 3 (168 Hours) | 8 | ALSO IT CAN BE CONFIGURED AS 8M X 1 BIT | 2.3V~3.6V | DUAL | 未说明 | 1 | 3V | 0.5mm | 未说明 | R-PDSO-N8 | 3.6V | 2.3V | SPI, Serial | 8Mb 1M x 8 | SYNCHRONOUS | 104MHz | FLASH | SPI | 2MX4 | 4 | 100μs, 4ms | 8388608 bit | 3V | 2 | 0.6mm | 3mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CYD09S18V18-167BBXC | Cypress Semiconductor Corp | 数据表 | 2517 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | Volatile | 0°C~70°C TA | Tray | 2005 | e1 | Obsolete | 5 (48 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | 1.42V~1.58V 1.7V~1.9V | BOTTOM | 260 | 1 | 1.5V | 1mm | unknown | 20 | CYD09S18 | 256 | 不合格 | 1.8V | 1.58V | 9Mb 512K x 18 | 2 | 580mA | 167MHz | 4ns | SRAM | Parallel | 3-STATE | 18 | 19b | 9 Mb | COMMON | Synchronous | 18b | 1.4V | 1.7mm | 17mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
S25FL512SAGMFIR13 | Cypress Semiconductor Corp | 数据表 | 1638 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | Tin | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2007 | FL-S | e3 | 活跃 | 3 (168 Hours) | 16 | 3A991.B.1.A | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3V | 1.27mm | 30 | 不合格 | 3V | 3.6V | 2.7V | Parallel, SPI, Serial | 512Mb 64M x 8 | 75mA | 133MHz | 8 ns | FLASH | SPI - Quad I/O | 64MX8 | 8 | 32b | 512 Mb | 0.0001A | Asynchronous | 3V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 512B | 2.65mm | 10.3mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25C040X-E/ST | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 有 | 125 °C | 40 | -40 °C | TSSOP8,.25 | TSSOP, TSSOP8,.25 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 1 | 512 | PLASTIC/EPOXY | SOIC | 5.38 | MICROCHIP TECHNOLOGY INC | 不推荐 | Microchip Technology Inc | RECTANGULAR | TSSOP | 5 V | 512 words | 3 MHz | 25C040X-E/ST | e3 | 有 | EAR99 | Matte Tin (Sn) | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 5 V | AUTOMOTIVE | 4.5 V | SYNCHRONOUS | 0.005 mA | 512X8 | 1.2 mm | 8 | 0.000001 A | 4096 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 4.4 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24AA1026T-I/SM | Microchip Technology | 数据表 | 4850 In Stock | - | 最小起订量: 1 最小包装量: 1 | 5 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 200 YEARS DATA RETENTION | 1.7V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 24AA1026 | 8 | 5.5V | 1.7V | I2C, Serial | 1Mb 128K x 8 | 5mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 1 Mb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDMR | 2.03mm | 5.26mm | 5.25mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST25VF040B-50-4I-QAE | Microchip Technology | 数据表 | 490 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 8-WDFN Exposed Pad | YES | 8 | Non-Volatile | -40°C~85°C TA | Tube | 1998 | SST25 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 2.7V~3.6V | DUAL | 1 | 1.27mm | SST25VF040B | 3.3V | 3.6V | 2.7V | SPI, Serial | 4Mb 512K x 8 | 50MHz | FLASH | SPI | 4MX1 | 1 | 10μs | 4 Mb | 2.7V | 6mm | 5mm | 无 | ROHS3 Compliant |
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