category.内存卡和模块_category.内存卡和模块品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量																			JESD-609代码	无铅代码	ECCN 代码	类型	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	功能数量	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	电源电压-最大值(Vsup)	温度等级	电源电压-最小值(Vsup)	操作模式	电源电流-最大值	组织结构	输出特性	座位高度-最大	内存宽度	待机电流-最大值	记忆密度	并行/串行	I/O类型	内存IC类型	编程电压	串行总线类型	耐力	数据保持时间	写入保护	备用内存宽度	数据轮询	拨动位	命令用户界面	扇区/尺寸数	行业规模	页面尺寸	准备就绪/忙碌	引导模块	通用闪存接口	长度
MX25R4035FZUIL2	Macronix International Co Ltd	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	8	512000	85 °C	-40 °C	PLASTIC/EPOXY	HVSON	RECTANGULAR	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	1.8 V	活跃	MACRONIX INTERNATIONAL CO LTD	HVSON,	108 MHz	524288 words			EAR99			IT CAN ALSO BE CONFIGURED AS 2M X 2 AND 4M X 1	8542.32.00.51	DUAL	无铅	未说明	1	0.5 mm	unknown	未说明		R-PDSO-N8		3.6 V	INDUSTRIAL	1.65 V	SYNCHRONOUS		512KX8		0.6 mm	8		4194304 bit	SERIAL		FLASH	1.8 V					4										3 mm	2 mm
K9F1216U0A-DIB0	Samsung Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	63	30 ns	33554432 words	32000000	85 °C	-40 °C	PLASTIC/EPOXY	VFBGA	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	3.3 V	Obsolete	SAMSUNG SEMICONDUCTOR INC	BGA	VFBGA,			EAR99			CONTAINS ADDITIONAL 16M BIT NAND FLASH	8542.32.00.51	BOTTOM	BALL		1	0.8 mm	unknown		63	R-PBGA-B63	不合格	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS		32MX16		1 mm	16		536870912 bit	PARALLEL		FLASH	2.7 V															11 mm	9 mm
MR27V852EJA	LAPIS Semiconductor Co Ltd	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	42	SOJ	SOJ, SOJ42,.44	100 ns	524288 words	512000	70 °C	PLASTIC/EPOXY	SOJ	SOJ42,.44	RECTANGULAR	小概要	3.3 V	无	Obsolete	LAPIS SEMICONDUCTOR CO LTD	e0		EAR99		Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	J BEND		1	1.27 mm	unknown		42	R-PDSO-J42	不合格	3.6 V	COMMERCIAL	3 V	ASYNCHRONOUS	0.08 mA	512KX16	3-STATE	3.75 mm	16	0.00005 A	8388608 bit	PARALLEL	COMMON	OTP ROM						8										27.3 mm	10.16 mm
AM28F010-200LI	Rochester Electronics LLC	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	32	128000	85 °C	-40 °C	CERAMIC, METAL-SEALED COFIRED	QCCN	RECTANGULAR	CHIP CARRIER	5 V	接触制造商	ROCHESTER ELECTRONICS LLC	QCCN,	200 ns	131072 words	e0		EAR99	NOR型号	锡铅	BULK ERASE	8542.32.00.51	QUAD	无铅		1	1.27 mm	unknown			R-CQCC-N32		5.5 V	INDUSTRIAL	4.5 V	ASYNCHRONOUS		128KX8		2.54 mm	8		1048576 bit	PARALLEL		FLASH	12 V															13.97 mm	11.43 mm
AM28F010-200LI	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	32	ADVANCED MICRO DEVICES INC	QFJ	CERAMIC, LCC-32	200 ns	131072 words	128000	85 °C	-40 °C	CERAMIC, METAL-SEALED COFIRED	QCCN	LCC32,.45X.55	RECTANGULAR	CHIP CARRIER	5 V	无	Obsolete	e0	无	EAR99	NOR型号	锡铅	BULK ERASE	8542.32.00.51	QUAD	无铅		1	1.27 mm	unknown		32	R-CQCC-N32	不合格	5.5 V	INDUSTRIAL	4.5 V	ASYNCHRONOUS	0.03 mA	128KX8	3-STATE	2.54 mm	8	0.0001 A	1048576 bit	PARALLEL		FLASH	12 V		10000 Write/Erase Cycles				NO	NO	YES							13.97 mm	11.43 mm
ID240L02	Sharp Corp	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	68	UNSPECIFIED	UNSPECIFIED	微电子组件	5 V	Obsolete	SHARP CORP	PC CARD-68	200 ns	10485760 words	10000000	60 °C			EAR99	NOR型号			8542.32.00.51	UNSPECIFIED	UNSPECIFIED		1		unknown			X-XXMA-X68	不合格	5.5 V	COMMERCIAL	4.5 V	ASYNCHRONOUS		10MX16			16		167772160 bit	PARALLEL		FLASH	5 V					8
S29GL064A90TFIR73	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48	Obsolete	SPANSION INC	TSOP1	LEAD FREE, MO-142EC, TSOP-48	90 ns	3	4194304 words	4000000	85 °C	-40 °C	PLASTIC/EPOXY	TSSOP	TSSOP48,.8,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	3.3 V	有	e3	有	EAR99	NOR型号	哑光锡		8542.32.00.51	DUAL	鸥翼	260	1	0.5 mm	unknown	40	48	R-PDSO-G48	不合格	3.6 V	INDUSTRIAL	3 V	ASYNCHRONOUS	0.06 mA	4MX16		1.2 mm	16	0.000005 A	67108864 bit	PARALLEL		FLASH	3 V						YES	YES	YES	128	32K	4 words	YES		YES	18.4 mm	12 mm
SST39LF100-45-4C-WIE	Silicon Storage Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	40	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	3.3 V	45 ns	TSOP1, TSSOP40,.56,20	TSOP1	SILICON STORAGE TECHNOLOGY INC	Obsolete	有	65536 words	64000	70 °C	PLASTIC/EPOXY	TSOP1	TSSOP40,.56,20			EAR99	NOR型号			8542.32.00.51	DUAL	鸥翼	260	1	0.5 mm	unknown		40	R-PDSO-G40	不合格	3.6 V	COMMERCIAL	3 V	ASYNCHRONOUS	0.03 mA	64KX16		1.2 mm	16	0.00002 A	1048576 bit	PARALLEL		FLASH	3 V						YES	YES	YES	32	2K					12.4 mm	10 mm
SST29VF040-55-4C-NHE	Silicon Storage Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	32	QFJ	QCCJ, LDCC32,.5X.6	55 ns	524288 words	512000	70 °C	PLASTIC/EPOXY	QCCJ	LDCC32,.5X.6	RECTANGULAR	CHIP CARRIER	3 V	有	Transferred	SILICON STORAGE TECHNOLOGY INC	e3		EAR99	NOR型号	哑光锡		8542.32.00.51	QUAD	J BEND		1	1.27 mm	unknown		32	R-PQCC-J32	不合格	3.6 V	COMMERCIAL	2.7 V	ASYNCHRONOUS	0.03 mA	512KX8		3.55 mm	8	0.000015 A	4194304 bit	PARALLEL		FLASH	2.7 V						YES	YES		4K	128					13.97 mm	11.43 mm
M29W400DT55ZE6	STMicroelectronics	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48	STMICROELECTRONICS	BGA	6 X 8 MM, 0.80 MM PITCH, TFBGA-48	55 ns	262144 words	256000	85 °C	-40 °C	PLASTIC/EPOXY	TFBGA	BGA48,6X8,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	3 V	有	Transferred	e0		EAR99	NOR型号	锡铅	TOP BOOT BLOCK	8542.32.00.51	BOTTOM	BALL		1	0.8 mm	unknown		48	R-PBGA-B48	不合格	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.02 mA	256KX16		1.2 mm	16	0.0001 A	4194304 bit	PARALLEL		FLASH	3 V					8	YES	YES	YES	1,2,1,7	16K,8K,32K,64K		YES	TOP		8 mm	6 mm
M29W400DT55ZE6	Numonyx Memory Solutions	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48	NUMONYX	BGA	6 X 8 MM, 0.80 MM PITCH, TFBGA-48	3.3 V	GRID ARRAY, THIN PROFILE, FINE PITCH	RECTANGULAR	BGA48,6X8,32	TFBGA	PLASTIC/EPOXY	-40 °C	85 °C	256000	262144 words	55 ns	有	Transferred	e0		EAR99	NOR型号	锡铅	TOP BOOT BLOCK	8542.32.00.51	BOTTOM	BALL		1	0.8 mm	unknown		48	R-PBGA-B48	不合格	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.02 mA	256KX16		1.2 mm	16	0.0001 A	4194304 bit	PARALLEL		FLASH	3 V					8	YES	YES	YES	1,2,1,7	16K,8K,32K,64K		YES	TOP		8 mm	6 mm
S29GL128N11FAI010	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	64	Obsolete	SPANSION INC	BGA	13 X 11 MM, FBGA-64	110 ns	3	8388608 words	8000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	BGA64,8X8,40	RECTANGULAR	GRID ARRAY, LOW PROFILE	3 V	无	e0	无	3A991.B.1.A	NOR型号	锡铅		8542.32.00.51	BOTTOM	BALL	260	1	1 mm	not_compliant		64	R-PBGA-B64	不合格	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.09 mA	8MX16		1.4 mm	16	0.000005 A	134217728 bit	PARALLEL		FLASH	3 V					8	YES	YES	YES	128	128K	8/16 words	YES		YES	13 mm	11 mm
S29GL128N11FAI010	Cypress Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	64	13 X 11 MM, FBGA-64	110 ns	3	8388608 words	8000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	RECTANGULAR	GRID ARRAY, LOW PROFILE	3 V	无	Obsolete	CYPRESS SEMICONDUCTOR CORP	e0		EAR99	NOR型号	锡铅		8542.32.00.51	BOTTOM	BALL	260	1	1 mm	not_compliant			R-PBGA-B64		3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.09 mA	8MX16		1.4 mm	16		134217728 bit	PARALLEL		FLASH	3 V					8										13 mm	11 mm
S29GL128N11FAI010	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	64	8000000	85 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA64,8X8,40	SQUARE	网格排列	无	Transferred	ADVANCED MICRO DEVICES INC	110 ns	8388608 words	e0		EAR99	NOR型号	Tin/Lead (Sn/Pb)		8542.32.00.51	BOTTOM	BALL			1 mm	unknown			S-PBGA-B64	不合格		INDUSTRIAL			0.09 mA	8MX16			16	0.000005 A	134217728 bit	PARALLEL		FLASH						8	YES	YES	YES	128	128K	8/16 words	YES		YES
W49F002UP12BN	Winbond Electronics Corp	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	32	262144 words	256000	70 °C	PLASTIC/EPOXY	QCCJ	RECTANGULAR	CHIP CARRIER	5 V	Obsolete	WINBOND ELECTRONICS CORP	QFJ	PLASTIC, LCC-32	120 ns			EAR99	NOR型号			8542.32.00.51	QUAD	J BEND		1	1.27 mm	unknown		32	R-PQCC-J32	不合格	5.5 V	COMMERCIAL	4.5 V	ASYNCHRONOUS		256KX8		3.56 mm	8		2097152 bit	PARALLEL		FLASH	5 V													TOP		13.97 mm	11.43 mm
TMM24256AP	Toshiba America Electronic Components	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	28	200 ns	32768 words	32000	70 °C	PLASTIC/EPOXY	DIP	DIP28,.6	RECTANGULAR	IN-LINE	5 V	无	接触制造商	TOSHIBA CORP	DIP, DIP28,.6	e0		EAR99		Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	THROUGH-HOLE			2.54 mm	unknown			R-PDIP-T28	不合格		COMMERCIAL			0.1 mA	32KX8	3-STATE		8		262144 bit		COMMON	OTP ROM	12.5 V
EN25F10A-104RBIP	Eon Silicon Solution Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	8	128000	85 °C	-40 °C	PLASTIC/EPOXY	VSOP	RECTANGULAR	SMALL OUTLINE, VERY THIN PROFILE	3 V	Transferred	EON SILICON SOLUTION INC	0.150 INCH, HALOGEN FREE, ROHS AND REACH COMPLIANT, VSOP-8	104 MHz	131072 words			EAR99	NOR型号			8542.32.00.51	DUAL	鸥翼		1	1.27 mm	unknown			R-PDSO-G8		3.6 V	INDUSTRIAL	2.7 V	SYNCHRONOUS		128KX8		0.9 mm	8		1048576 bit	SERIAL		FLASH	2.7 V															4.9 mm	3.9 mm
EN29GL064AT-70TIP	Eon Silicon Solution Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48	4000000	85 °C	-40 °C	PLASTIC/EPOXY	TSOP1	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	3 V	Transferred	EON SILICON SOLUTION INC	TSOP1,	70 ns	4194304 words			EAR99				8542.32.00.51	DUAL	鸥翼		1	0.5 mm	unknown			R-PDSO-G48		3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS		4MX16		1.2 mm	16		67108864 bit	PARALLEL		FLASH	3 V					8										18.4 mm	12 mm
AM29F010-55JE	AMD	数据表	617 In Stock	-	最小起订量: 1 最小包装量: 1	YES	32	ADVANCED MICRO DEVICES INC	QFJ	PLASTIC, LCC-32	55 ns	131072 words	128000	125 °C	-55 °C	PLASTIC/EPOXY	QCCJ	LDCC32,.5X.6	RECTANGULAR	CHIP CARRIER	5 V	无	Obsolete	e0	无	3A001.A.2.C	NOR型号	锡铅	EMBEDDED ALGORITHM; HARDWARE DATA PROTECTION	8542.32.00.51	QUAD	J BEND		1	1.27 mm	unknown		32	R-PQCC-J32	不合格	5.5 V	MILITARY	4.5 V	ASYNCHRONOUS	0.05 mA	128KX8	3-STATE	3.556 mm	8	0.0001 A	1048576 bit	PARALLEL		FLASH	5 V		100000 Write/Erase Cycles				YES	YES	YES	8	16K					13.97 mm	11.43 mm
MX25L12833FM2I-10G/TUBE	Macronix International Co Ltd	数据表	N/A	-	最小起订量: 1 最小包装量: 1
S29GL256P11FFIR20	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	64	SPANSION INC	BGA	LBGA,	110 ns	3	16777216 words	16000000	85 °C	-40 °C	PLASTIC/EPOXY	LBGA	RECTANGULAR	GRID ARRAY, LOW PROFILE	3.3 V	有	Transferred	e1	有	EAR99	NOR型号	锡银铜		8542.32.00.51	BOTTOM	BALL		1	1 mm	compliant		64	R-PBGA-B64	不合格	3.6 V	INDUSTRIAL	3 V	ASYNCHRONOUS		16MX16	3-STATE	1.4 mm	16		268435456 bit	PARALLEL		FLASH	3 V															13 mm	11 mm
PF48F2000P0ZTQ0	Micron Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88	4000000	85 °C	-40 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V	Obsolete	MICRON TECHNOLOGY INC	8 X 10 MM, 1.20 MM HEIGHT, LEAD FREE, SCSP-88	88 ns	4194304 words			EAR99	NOR型号		可进行同步突发模式操作	8542.32.00.51	BOTTOM	BALL		1	0.8 mm	unknown			R-PBGA-B88		2 V	INDUSTRIAL	1.7 V	ASYNCHRONOUS		4MX16		1.2 mm	16		67108864 bit	PARALLEL		FLASH	1.8 V													TOP		10 mm	8 mm
EN27SN1G08-45CEIP	Eon Silicon Solution Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	63	-40 °C	PLASTIC/EPOXY	VFBGA	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	1.8 V	Transferred	EON SILICON SOLUTION INC	VFBGA,	134217728 words	128000000	85 °C			EAR99				8542.32.00.51	BOTTOM	BALL		1	0.8 mm	unknown			R-PBGA-B63		1.95 V	INDUSTRIAL	1.7 V	ASYNCHRONOUS		128MX8		1 mm	8		1073741824 bit	PARALLEL		FLASH	1.8 V															11 mm	9 mm
X25F128P-5	Xicor Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	8	1 MHz	16384 words	16000	70 °C	PLASTIC/EPOXY	DIP	DIP8,.3	RECTANGULAR	IN-LINE	5 V	无	Obsolete	XICOR INC	PLASTIC, DIP-8	e0			NOR型号	锡铅	SPI SERIAL FLASH		DUAL	THROUGH-HOLE		1	2.54 mm	unknown			R-PDIP-T8	不合格	5.5 V	COMMERCIAL	4.5 V	SYNCHRONOUS	0.005 mA	16KX8	3-STATE	4.32 mm	8	0.00001 A	131072 bit	SERIAL		FLASH	5 V	SPI	100000 Write/Erase Cycles	100	HARDWARE/SOFTWARE											10.03 mm	7.62 mm
5962-9461302HXC	White Microelectronics	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	66	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	SQUARE	微电子组件	5 V	Obsolete	WHITE MICROELECTRONICS	HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66	100 ns	4194304 words	4000000	e4				GOLD	CONFIGURABLE AS 2M X 16 OR 1M X 32		HEX	PIN/PEG		1		unknown			S-CHMA-P66	不合格	5.5 V	MILITARY	4.5 V	ASYNCHRONOUS		4MX8			8		33554432 bit	PARALLEL		FLASH MODULE	12 V