类别是'category.FPGA 评估板' (3802)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 配置 | 通道数量 | 模拟 IC - 其他类型 | 内存大小 | uPs/uCs/外围ICs类型 | 可调阈值 | 传播延迟 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 供应电流-最大值(Isup) | 极性/通道类型 | 阀门数量 | 速度等级 | 输出功能 | 最大耗散功率(Abs) | 宏细胞数 | CLB-Max的组合延时 | 集电极电流-最大值(IC) | 最小直流增益(hFE) | 逻辑块数量 | JTAG BST | 逻辑单元数 | 专用输入数量 | 等效门数 | 系统内可编程 | 长度 | 宽度 | 辐射硬化 | |||||||||||||||||||||||||
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![]() | XC9501B095AR | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | 5.77 | , | TOREX SEMICONDUCTOR LTD | 活跃 | 有 | XC9501B095AR | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC9504B093AR | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | 5.75 | , | TOREX SEMICONDUCTOR LTD | 活跃 | 有 | XC9504B093AR | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC6108N10AMR | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 5 | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | 2 V | +1V | XC6108N10AMR | 有 | 不推荐 | TOREX SEMICONDUCTOR LTD | LSSOP, TSOP5/6,.11,37 | 5.22 | 1 | 85 °C | -40 °C | EAR99 | DETECTION VOLTAGE IS 1.0 V | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 0.95 mm | compliant | R-PDSO-G5 | 不合格 | 6 V | 1/6 V | INDUSTRIAL | 1 V | 1 | 电源支持电路 | NO | 1.3 mm | 0.0018 mA | 2.9 mm | 1.6 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | XC61CC2502MR | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 3 | -40 °C | PLASTIC/EPOXY | LSSOP | TO-236 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | 1 V | +2.5V | 未说明 | XC61CC2502MR | 有 | 活跃 | TOREX SEMICONDUCTOR LTD | LSSOP, TO-236 | 5.21 | 1 | 85 °C | EAR99 | DETECTOR VOLTAGE IS 2.5V | 8542.39.00.01 | DUAL | 鸥翼 | 未说明 | 1 | 0.95 mm | compliant | R-PDSO-G3 | 不合格 | 10 V | 1/10 V | INDUSTRIAL | 0.7 V | 1 | 电源支持电路 | NO | 1.3 mm | 2.9 mm | 1.6 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | XC6219A12AMR | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 有 | 活跃 | TOREX SEMICONDUCTOR LTD | 5.57 | 1 | XC6219A12AMR | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC61CN6002MR | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 3 | -40 °C | PLASTIC/EPOXY | LSSOP | TO-236 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | 1 V | +6V | 未说明 | XC61CN6002MR | 有 | 活跃 | TOREX SEMICONDUCTOR LTD | LSSOP, TO-236 | 5.21 | 1 | 85 °C | EAR99 | DETECTOR VOLTAGE IS 6V | 8542.39.00.01 | DUAL | 鸥翼 | 未说明 | 1 | 0.95 mm | compliant | R-PDSO-G3 | 不合格 | 10 V | 1/10 V | INDUSTRIAL | 0.7 V | 1 | 电源支持电路 | NO | 1.3 mm | 2.9 mm | 1.6 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | XC7A350T-1FBG484C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | SQUARE | 网格排列 | 1 V | XC7A350T-1FBG484C | 有 | 活跃 | XILINX INC | BGA, BGA484,22X22,40 | 5.83 | 1098 MHz | 4 | PLASTIC | BGA | BGA484,22X22,40 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 285 | 不合格 | 1 V | 285 | 现场可编程门阵列 | 348480 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU29DR-L2FFVF1760I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1760 | BGA | RECTANGULAR | 网格排列 | 0.742 V | 0.72 V | 未说明 | 0.698 V | XCZU29DR-L2FFVF1760I | 有 | 活跃 | XILINX INC | FCBGA-1760 | 5.61 | 100 °C | -40 °C | PLASTIC/EPOXY | BOTTOM | BALL | 未说明 | compliant | R-PBGA-B1760 | INDUSTRIAL | 微处理器电路 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7VX330T-1FFV1761I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1761 | 1 V | 未说明 | 0.97 V | XC7VX330T-1FFV1761I | 有 | 活跃 | XILINX INC | FBGA-1761 | 5.79 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.03 V | e1 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1761 | 25500 CLBS | 3.77 mm | 现场可编程门阵列 | 0.74 ns | 25500 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XQ7A200T-2RB484I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | SQUARE | 网格排列 | 1.05 V | 1 V | 0.95 V | XQ7A200T-2RB484I | 无 | 活跃 | XILINX INC | BGA, BGA484,22X22,40 | 5.89 | 1286 MHz | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | 3A991.D | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 285 | 不合格 | 1 V | 285 | 16825 CLBS | 3.35 mm | 现场可编程门阵列 | 1.05 ns | 16825 | 215360 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | M1AFS250-QNG180I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 180 | 350 MHz | 2 | 85 °C | -40 °C | UNSPECIFIED | VBCC | LGA180,20X20,20 | SQUARE | CHIP CARRIER, VERY THIN PROFILE | 1.575 V | 1.5 V | 未说明 | 1.425 V | M1AFS250-QNG180I | 有 | Obsolete | MICROSEMI CORP | VBCC, LGA180,20X20,20 | 5.31 | 8542.39.00.01 | BOTTOM | BUTT | 未说明 | 0.5 mm | compliant | S-XBCC-B180 | 65 | 不合格 | 1.5,3.3 V | INDUSTRIAL | 65 | 6144 CLBS, 250000 GATES | 0.8 mm | 现场可编程门阵列 | 6144 | 6144 | 250000 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | 2S305 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 175 °C | 0.25 MHz | 2S305 | 无 | Obsolete | Texas INC | 5.67 | not_compliant | Single | PNP | 0.3 W | 0.15 A | 10 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5962-1222501VZC | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 5.82 | 5962-1222501VZC | Obsolete | MICROCHIP TECHNOLOGY INC | , | 8542.39.00.01 | compliant | Qualified | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10M50DAF484C8GES | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | ALTERA CORP | 5.27 | 10M50DAF484C8GES | 8542.39.00.01 | unknown | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV100E-6BGG352C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 352 | 5.81 | 357 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | BGA352,26X26,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | 30 | 1.71 V | XCV100E-6BGG352C | 有 | Obsolete | XILINX INC | BGA | BGA-352 | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 352 | S-PBGA-B352 | 196 | 不合格 | 1.2/3.6,1.8 V | OTHER | 196 | 600 CLBS, 32400 GATES | 1.7 mm | 现场可编程门阵列 | 0.47 ns | 600 | 2700 | 32400 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||
![]() | XCV600E-7BGG432C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 432 | 5.8 | 400 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | BGA432,31X31,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | 30 | 1.71 V | XCV600E-7BGG432C | 有 | Obsolete | XILINX INC | BGA | BGA-432 | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 432 | S-PBGA-B432 | 316 | 不合格 | 1.2/3.6,1.8 V | OTHER | 316 | 3456 CLBS, 186624 GATES | 1.7 mm | 现场可编程门阵列 | 0.42 ns | 3456 | 15552 | 186624 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||
![]() | XC73108-20PQ100C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 5.85 | 35.7 MHz | 3 | 47 | 70 °C | PLASTIC/EPOXY | QFP | QFP100,.7X.9 | RECTANGULAR | FLATPACK | 5.25 V | 5 V | 4.75 V | XC73108-20PQ100C | 无 | Obsolete | XILINX INC | QFP | PLASTIC, QFP-100 | e0 | EAR99 | Tin/Lead (Sn85Pb15) | 108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS | 8542.39.00.01 | QUAD | 鸥翼 | 0.65 mm | not_compliant | 100 | R-PQFP-G100 | 不合格 | 3.3/5,5 V | COMMERCIAL | 45 ns | 12 DEDICATED INPUTS, 47 I/O | 3.4 mm | OT PLD | MACROCELL | 108 | NO | 12 | NO | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||
![]() | XC3030-125PQ100C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 5.82 | 125 MHz | 3 | 85 °C | PLASTIC/EPOXY | QFP | QFP100,.7X.9 | RECTANGULAR | FLATPACK | 5.25 V | 5 V | Non-Compliant | 4.75 V | XC3030-125PQ100C | 无 | Obsolete | XILINX INC | QFP | QFP, QFP100,.7X.9 | e0 | Tin/Lead (Sn85Pb15) | 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA | QUAD | 鸥翼 | 0.65 mm | not_compliant | 100 | R-PQFP-G100 | 80 | 不合格 | 5 V | OTHER | 80 | 100 CLBS, 1500 GATES | 2.87 mm | 现场可编程门阵列 | 2000 | 5.5 ns | 100 | 100 | 1500 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||
![]() | XCV400E-8FGG676C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 676 | FBGA-676 | 5.79 | 416 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA676,26X26,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | Compliant | 1.71 V | XCV400E-8FGG676C | 有 | Obsolete | XILINX INC | BGA | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 85 °C | 0 °C | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | unknown | 676 | S-PBGA-B676 | 404 | 不合格 | 1.8 V | 1.2/3.6,1.8 V | OTHER | 20 kB | 404 | 2400 CLBS, 129600 GATES | 2.6 mm | 现场可编程门阵列 | 8 | 0.4 ns | 2400 | 10800 | 129600 | 27 mm | 27 mm | 无 | ||||||||||||||||||||||||||||
![]() | XCV300E-8BGG432I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 432 | 416 MHz | 3 | PLASTIC/EPOXY | LBGA | BGA432,31X31,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | 30 | 1.71 V | XCV300E-8BGG432I | 有 | Obsolete | XILINX INC | BGA | LBGA, BGA432,31X31,50 | 5.81 | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 432 | S-PBGA-B432 | 316 | 不合格 | 1.2/3.6,1.8 V | 316 | 1536 CLBS, 82944 GATES | 1.7 mm | 现场可编程门阵列 | 0.4 ns | 1536 | 6912 | 82944 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||
![]() | XCV300E-8FGG256I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 416 MHz | 3 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | XCV300E-8FGG256I | 有 | Obsolete | XILINX INC | BGA | BGA, BGA256,16X16,40 | 5.81 | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 256 | S-PBGA-B256 | 176 | 不合格 | 1.2/3.6,1.8 V | 176 | 1536 CLBS, 82944 GATES | 2 mm | 现场可编程门阵列 | 0.4 ns | 1536 | 6912 | 82944 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||
![]() | XCV600E-8FGG900C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 900 | 5.8 | 416 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | XCV600E-8FGG900C | 有 | Obsolete | XILINX INC | BGA | BGA, BGA900,30X30,40 | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | 900 | S-PBGA-B900 | 512 | 不合格 | 1.2/3.6,1.8 V | OTHER | 512 | 3456 CLBS, 186624 GATES | 2.6 mm | 现场可编程门阵列 | 0.4 ns | 3456 | 15552 | 186624 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||
![]() | XCS05XL-3VQG100C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 85 °C | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 3.6 V | 3.3 V | 30 | 3 V | XCS05XL-3VQG100C | 有 | Obsolete | XILINX INC | QFP | TFQFP, | 5.8 | 3 | e3 | 有 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 100 | S-PQFP-G100 | 不合格 | OTHER | 100 CLBS, 2000 GATES | 1.2 mm | 现场可编程门阵列 | 100 | 2000 | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XC3164A-5PG132C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 132 | 85 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA132,14X14 | SQUARE | 网格排列 | 5.25 V | 5 V | 4.75 V | XC3164A-5PG132C | 有 | Obsolete | XILINX INC | PGA | PGA, PGA132,14X14 | 5.82 | 188 MHz | TYP. GATES = 3500-4500 | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 132 | S-CPGA-P132 | 110 | 不合格 | 5 V | OTHER | 110 | 224 CLBS, 3500 GATES | 4.318 mm | 现场可编程门阵列 | 4.1 ns | 224 | 224 | 3500 | 37.084 mm | 37.084 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | XC9536XV-5PCG44C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | 5.66 | 3 | 34 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | 2.62 V | 2.5 V | 40 | 2.37 V | XC9536XV-5PCG44C | 有 | Obsolete | XILINX INC | LCC | QCCJ, LDCC44,.7SQ | e3 | Matte Tin (Sn) | YES | 8542.39.00.01 | QUAD | J BEND | 245 | 1.27 mm | compliant | 44 | S-PQCC-J44 | 不合格 | 1.8/3.3,2.5 V | COMMERCIAL | 5 ns | 0 DEDICATED INPUTS, 34 I/O | 4.57 mm | 闪存 PLD | MACROCELL | 36 | YES | YES | 16.5862 mm | 16.5862 mm |
XC9501B095AR
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC9504B093AR
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC6108N10AMR
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC61CC2502MR
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC6219A12AMR
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC61CN6002MR
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC7A350T-1FBG484C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCZU29DR-L2FFVF1760I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC7VX330T-1FFV1761I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XQ7A200T-2RB484I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M1AFS250-QNG180I
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
2S305
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
5962-1222501VZC
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
10M50DAF484C8GES
Intel
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV100E-6BGG352C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV600E-7BGG432C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC73108-20PQ100C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC3030-125PQ100C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV400E-8FGG676C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV300E-8BGG432I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV300E-8FGG256I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV600E-8FGG900C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCS05XL-3VQG100C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC3164A-5PG132C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC9536XV-5PCG44C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
