N/A

-

Zynq UltraScale+

1

76 mm x 52 mm

This product may require additional documentation to export from the United States.

Details

Xilinx

XCZU6EG-1FFVC900E

4 GB

4 GB

GPIO, SPI

0 C

+ 85 C

128 MB

DDR4

-

3.3 V

5.2 cm x 7.6 cm

N/A

-

Zynq UltraScale+

1

5.2 cm x 7.6 cm

This product may require additional documentation to export from the United States.

Details

Xilinx

XCZU7EV-1FBVB900E

4 GB

4 GB

PCIe

128 MB

DDR4

32 GB

eMMC

5.2 cm x 7.6 cm

N/A

-

N/A

-

表面贴装

YES

484

M2GL090S-1FG484I

无

活跃

MICROSEMI CORP

5.3

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.2 V

267

Non-Compliant

100 °C

-40 °C

BOTTOM

BALL

1 mm

unknown

S-PBGA-B484

267

不合格

1.2 V

323.3 kB

267

现场可编程门阵列

86316

86316

N/A

-

无

Obsolete

MICROSEMI CORP

20

,

5.85

3

M2S010S-1FG484I

e0

Tin/Lead (Sn/Pb)

225

compliant

现场可编程门阵列

N/A

-

YES

516

PLASTIC/EPOXY

BGA

SQUARE

网格排列

2.7 V

2.5 V

30

2.3 V

LFX500EB-03FH516C

无

活跃

ROCHESTER ELECTRONICS INC

BGA

BGA,

5.86

3

70 °C

e0

无

锡铅

ALSO OPERATES WITH 3.3V SUPPLY

BOTTOM

BALL

225

1 mm

unknown

516

S-PBGA-B516

COMMERCIAL

COMMERCIAL

1764 CLBS, 476000 GATES

2.6 mm

现场可编程门阵列

1.07 ns

1764

476000

31 mm

31 mm

N/A

-

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

1.14 V

M2S090TS-1FGG484I

有

活跃

MICROSEMI CORP

FBGA-484

5.8

3

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.26 V

1.2 V

40

1.2000 V

267

Tray

M2S090

活跃

-

166 MHz

86316 LE

SMD/SMT

-

64 kB

-40 to 100 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

1

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.26 V

1.2 V

30

209

Compliant

Tray

M2GL005

活跃

1.14 V

M2GL005-1FGG484

有

活跃

MICROSEMI CORP

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

5.3

3

85 °C

0°C ~ 85°C (TJ)

IGLOO2

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

209

不合格

1.2 V

OTHER

87.9 kB

209

2.44 mm

现场可编程门阵列

6060

719872

6060

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

1.26 V

1.2 V

30

M2GL090-1FGG676

有

活跃

MICROSEMI CORP

BGA, BGA676,26X26,40

5.27

3

85 °C

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

网格排列

425

Compliant

Tray

M2GL090

活跃

86184 LE

+ 85 C

0 C

SMD/SMT

1.14 V

0°C ~ 85°C (TJ)

IGLOO2

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B676

425

不合格

1.2 V

1.2 V

OTHER

323.3 kB

425

2.44 mm

现场可编程门阵列

86316

2648064

86316

27 mm

27 mm

N/A

-

484-BFBGA

YES

484-FBGA (19x19)

484

微芯片技术

4

85 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

1.26 V

1.2 V

40

273

Tray

M2S150

活跃

1.14 V

M2S150T-FCVG484

有

活跃

MICROSEMI CORP

VFBGA-484

5.77

0°C ~ 85°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B484

273

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

273

3.15 mm

现场可编程门阵列

FPGA - 150K Logic Modules

146124

512KB

19 mm

19 mm

N/A

-

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325

325-FCBGA (11x11)

325

微芯片技术

166 MHz

56520 LE

+ 100 C

- 40 C

-

64 kB

1.14 V

3

PLASTIC/EPOXY

TFBGA

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.26 V

1.2 V

40

M2S060-FCSG325I

有

活跃

MICROSEMI CORP

FBGA-325

5.79

1.2000 V

1.14 V

1.26 V

200

Tray

M2S060

活跃

Compliant

-

-40 to 100 °C

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-40 °C

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

250

0.5 mm

compliant

S-PBGA-B325

200

不合格

1.2 V

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

STD

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.26 V

1.2 V

30

267

Compliant

Tray

M2GL050

活跃

1.14 V

M2GL050-1FGG484

有

活跃

MICROSEMI CORP

23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484

5.3

3

85 °C

0°C ~ 85°C (TJ)

IGLOO2

85 °C

0 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

228.3 kB

267

2.44 mm

现场可编程门阵列

56340

1869824

56340

23 mm

23 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

896

400.011771 mg

896

1.575 V

1.5 V

20

620

Compliant

1.425 V

M1AGLE3000V5-FG896I

无

Obsolete

MICROSEMI CORP

FBGA-896

5.88

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B896

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

3e+06

892.86 MHz

75264

75264

3000000

1.73 mm

29 mm

29 mm

无

N/A

-

Production (Last Updated: 2 months ago)

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

M2S060T-FGG676

有

活跃

MICROSEMI CORP

BGA, BGA676,26X26,40

5.81

3

85 °C

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

网格排列

1.26 V

1.2 V

40

Non-Compliant

387

Tray

M2S060

活跃

-

166 MHz

56520 LE

-

64 kB

1.14 V

0°C ~ 85°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

387

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

387

2.44 mm

现场可编程门阵列

FPGA - 60K Logic Modules

56520

1 Core

256KB

27 mm

27 mm

N/A

-

表面贴装

BGA-256

YES

256-FPBGA (14x14)

256

703 kbit

微芯片技术

6060 LE

161 I/O

+ 85 C

0.025037 oz

0 C

119

SMD/SMT

505 LAB

Microchip Technology / Atmel

340 MHz

IGLOO2

Details

Tray

M2GL005

活跃

M2GL005-VFG256

有

活跃

MICROSEMI CORP

LFBGA,

5.27

FPGA IGLOOu00ae2 Family 6060 Cells 1.2V 256-Pin VFBGA Tray

3

85 °C

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

1.14 V

1.2 V

30

有

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

M2GL005

8542.39.00.01

可编程逻辑集成电路

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

-

1.56 mm

现场可编程门阵列

6060

FPGA - Field Programmable Gate Array

719872

STD

-

FPGA - Field Programmable Gate Array

14 mm

14 mm

N/A

-

表面贴装

256-LFBGA

YES

256-FPBGA (14x14)

256

微芯片技术

119

SMD/SMT

Microchip Technology / Atmel

IGLOO2

Details

1.14 V

M2GL025-VFG256

有

活跃

MICROSEMI CORP

14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256

5.26

IC FPGA 138 I/O 256FBGA

3

85 °C

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

1.2 V

30

138

Tray

M2GL025

活跃

有

27696 LE

+ 85 C

0 C

0°C ~ 85°C (TJ)

Tray

IGLOO2

8542.39.00.01

可编程逻辑集成电路

1.14V ~ 2.625V

BOTTOM

BALL

260

0.8 mm

compliant

S-PBGA-B256

1.2 V

OTHER

667 Mb/s

1.56 mm

现场可编程门阵列

27696

FPGA - Field Programmable Gate Array

1130496

STD

2 Transceiver

FPGA - Field Programmable Gate Array

14 mm

14 mm

N/A

-

VFPBGA-400

YES

400-VFBGA (17x17)

400

This product may require additional documentation to export from the United States.

-

微芯片技术

166 MHz

12084 LE

0.236569 oz

90

SMD/SMT

1007 LAB

Microchip Technology / Atmel

Details

-

64 kB

195

Tray

M2S010

活跃

1.14 V

M2S010-VFG400I

有

活跃

MICROSEMI CORP

VFBGA-400

5.73

3

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.26 V

1.2 V

40

2.5, 3.3 V

MSL 3 - 168 hours

有

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

195

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

195

1.51 mm

现场可编程门阵列

SoC FPGA

400Kbit

STD

FPGA - 10K Logic Modules

12084

1 Core

256KB

SoC FPGA

17 mm

17 mm

N/A

-

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

微芯片技术

M1A3PE3000L-FG896I

无

活跃

MICROSEMI CORP

BGA, BGA896,30X30,40

5.3

350 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA896,30X30,40

SQUARE

网格排列

1.575 V

1.2 V

30

1.2000 V

1.14 V

1.26 V

620

Tray

M1A3PE3000

活跃

1.14 V

-40 to 85 °C

ProASIC3L

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5/3.3 V

INDUSTRIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

31 mm

31 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

896

400.011771 mg

896

620

Compliant

1.425 V

M1AGLE3000V5-FG896

无

Obsolete

MICROSEMI CORP

FBGA-896

5.88

3

70 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.5 V

20

e0

Tin/Lead (Sn/Pb)

70 °C

0 °C

8542.39.00.01

BOTTOM

BALL

225

1 mm

unknown

S-PBGA-B896

不合格

1.5 V

COMMERCIAL

1.575 V

1.425 V

63 kB

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

75264

3e+06

892.86 MHz

75264

75264

3000000

1.73 mm

29 mm

29 mm

无

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

400.011771 mg

484

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.5 V

40

235

Compliant

1.425 V

M1AGL600V5-FGG484I

有

Obsolete

MICROSEMI CORP

BGA,

5.81

108 MHz

3

100 °C

e1

锡银铜

85 °C

-40 °C

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

13824

600000

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

896-BGA

YES

896-FBGA (31x31)

896

微芯片技术

M1A3PE3000L-FG896

无

活跃

MICROSEMI CORP

31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896

5.3

350 MHz

3

70 °C

PLASTIC/EPOXY

BGA

BGA896,30X30,40

SQUARE

网格排列

1.575 V

1.2 V

30

1.2000 V

1.14 V

1.26 V

620

Tray

M1A3PE3000

活跃

1.14 V

0 to 70 °C

ProASIC3L

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

896

S-PBGA-B896

620

不合格

1.5/3.3 V

COMMERCIAL

620

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

31 mm

31 mm

N/A

-

表面贴装

676-BGA

YES

676-FBGA (27x27)

676

微芯片技术

活跃

MICROSEMI CORP

BGA,

5.3

3

85 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.575 V

1.5 V

30

1.5000 V

1.425 V

1.575 V

252

Tray

M1AFS1500

活跃

1.425 V

M1AFS1500-1FG676I

无

-40 to 85 °C

Fusion®

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B676

不合格

INDUSTRIAL

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

1500000

25 mm

25 mm

N/A

-

YES

484

3

70 °C

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.575 V

1.2 V

40

1.14 V

M1A3P1000L-FGG484

有

Obsolete

MICROSEMI CORP

BGA, BGA484,22X22,40

5.27

350 MHz

e1

锡银铜

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

300

不合格

1.5/3.3 V

COMMERCIAL

300

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

24576

24576

1000000

23 mm

23 mm

N/A

-

Obsolete (Last Updated: 2 months ago)

表面贴装

YES

484

400.011771 mg

484

BGA

SQUARE

网格排列

1.575 V

1.14 V

1.2 V

30

235

Non-Compliant

M1AGL600V2-FG484I

无

Obsolete

MICROSEMI CORP

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

5.86

108 MHz

3

100 °C

-40 °C

PLASTIC/EPOXY

e0

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

1.575 V

1.14 V

13.5 kB

13824 CLBS, 600000 GATES

2.44 mm

现场可编程门阵列

13824

600000

13824

600000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FBGA-484

YES

484-FPBGA (23x23)

484

微芯片技术

Microchip Technology / Atmel

IGLOO2

N

Tray

M2GL090

活跃

1.14 V

M2GL090TS-1FG484I

无

活跃

MICROSEMI CORP

BGA, BGA484,22X22,40

5.3

3

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

网格排列

1.26 V

1.2 V

20

有

This product may require additional documentation to export from the United States.

86316

267 I/O

+ 100 C

0.627572 oz

- 40 C

60

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

M2GL090TS

100 °C

-40 °C

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

323.3 kB

667 Mb/s

267

2.44 mm

现场可编程门阵列

86316

FPGA - Field Programmable Gate Array

2648064

4 Transceiver

86316

FPGA - Field Programmable Gate Array

23 mm

23 mm