类别是'category.应用特定微控制器' (5057)

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对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

表面安装

终端数量

Date Of Intro

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

资历状况

温度等级

端口的数量

uPs/uCs/外围ICs类型

比特数

电源电流-最大值

座位高度-最大

地址总线宽度

主时钟/晶体频率-名

外部数据总线宽度

输出时钟频率-最大值

总线兼容性

时间-最小值

中断能力

易失性

信息访问方法

显示配置

长度

宽度

THGBM5G5A1JBAIRYMJ
THGBM5G5A1JBAIRYMJ
Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

最小包装量: 1

MK1418STR
MK1418STR
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

8

LSOP, SOP8,.25

70 °C

PLASTIC/EPOXY

LSOP

SOP8,.25

RECTANGULAR

SMALL OUTLINE, LOW PROFILE

5.5 V

4.5 V

5 V

Transferred

INTEGRATED CIRCUIT SYSTEMS INC

SOIC

e0

EAR99

锡铅

8542.39.00.01

DUAL

鸥翼

1.27 mm

unknown

8

R-PDSO-G8

不合格

COMMERCIAL

CLOCK GENERATOR, OTHER

1.5494 mm

14.318 MHz

24.576 MHz

4.8895 mm

3.937 mm

XCZU6CG-1FBVB900I
XCZU6CG-1FBVB900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

900

BGA-900

4

100 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

网格排列

0.876 V

0.825 V

0.85 V

活跃

ADVANCED MICRO DEVICES INC

e1

锡银铜

BOTTOM

BALL

245

1 mm

compliant

30

S-PBGA-B900

INDUSTRIAL

PROGRAMMABLE SoC

2.88 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

31 mm

31 mm

XCZU6CG-1FBVB900I
XCZU6CG-1FBVB900I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

900

100 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

网格排列

0.876 V

0.825 V

0.85 V

Transferred

XILINX INC

BGA, BGA900,30X30,40

8542.31.00.01

BOTTOM

BALL

1 mm

unknown

S-PBGA-B900

INDUSTRIAL

PROGRAMMABLE SoC

2.88 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

31 mm

31 mm

SYM53C180
SYM53C180
Broadcom Limited 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

192

BALL

Obsolete

BROADCOM LTD

PLASTIC/EPOXY

BGA

UNSPECIFIED

EAR99

8542.39.00.01

QUAD

BUTT

compliant

X-PBGA-B192

TMPZ84C20AM-8
TMPZ84C20AM-8
Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

40

0.450 INCH, PLASTIC, SSOP-40

8 MHz

16

70 °C

-10 °C

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

5.25 V

4.75 V

5 V

Obsolete

TOSHIBA CORP

SSOP

EAR99

8542.39.00.01

DUAL

鸥翼

0.8 mm

unknown

40

R-PDSO-G40

不合格

COMMERCIAL

2

PARALLEL IO PORT, GENERAL PURPOSE

10 mA

2.8 mm

8

17.5 mm

8.8 mm

XCZU6CG-1LFFVC900I
XCZU6CG-1LFFVC900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

900

PLASTIC/EPOXY

-40 °C

100 °C

4

FCBGA-900

ADVANCED MICRO DEVICES INC

活跃

0.85 V

网格排列

SQUARE

BGA900,30X30,40

BGA

e1

锡银铜

BOTTOM

BALL

1 mm

compliant

S-PBGA-B900

INDUSTRIAL

PROGRAMMABLE SoC

3.42 mm

CAN, I2C, SPI, UART

31 mm

31 mm

IMISC471AYBD
IMISC471AYBD
Cypress Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

PCF2116CU/10
PCF2116CU/10
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

128

0.225 MHz

85 °C

-40 °C

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

6 V

2.5 V

5 V

Obsolete

NXP SEMICONDUCTORS

WAFER

DIE,

8542.31.00.01

UPPER

无铅

unknown

X-XUUC-N

不合格

INDUSTRIAL

DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER

1.1 mA

1

8

I2C

32 X 60 DOTS

XCZU6CG-1SFVC784I
XCZU6CG-1SFVC784I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

BGA-784

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

活跃

ADVANCED MICRO DEVICES INC

e1

锡银铜

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

XCZU6CG-1SFVC784I
XCZU6CG-1SFVC784I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

FBGA, BGA78428X28,32

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

Transferred

XILINX INC

锡银铜

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

unknown

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

ML60851DTBZ03A
ML60851DTBZ03A
OKI Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

XCZU6CG-L1SFVC784I
XCZU6CG-L1SFVC784I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

FBGA, BGA78428X28,32

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.742 V

0.698 V

0.72 V

Transferred

XILINX INC

锡银铜

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

unknown

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

XCZU6CG-L1SFVC784I
XCZU6CG-L1SFVC784I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

BGA-784

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.742 V

0.698 V

0.72 V

活跃

ADVANCED MICRO DEVICES INC

e1

锡银铜

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

S-3511AEFS
S-3511AEFS
ABLIC Inc. 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

8

SEIKO INSTRUMENTS USA INC

SOIC

SOP, SSOP8,.25

0.032 MHz

70 °C

-20 °C

PLASTIC/EPOXY

SOP

SSOP8,.25

RECTANGULAR

小概要

5.5 V

1.7 V

3 V

Obsolete

e0

EAR99

锡铅

8542.39.00.01

DUAL

鸥翼

0.65 mm

compliant

8

R-PDSO-G8

不合格

COMMERCIAL

TIMER, REAL TIME CLOCK

1.3 mm

SECONDS

Y

YES

SERIAL, 3-WIRE

4.4 mm

3.1 mm

HCMP1852P
HCMP1852P
Hughes Microelectronics 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

24

DIP, DIP24,.6

16

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP24,.6

RECTANGULAR

IN-LINE

10.5 V

4 V

5 V

Obsolete

HUGHES MICROELECTRONICS

e0

EAR99

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-PDIP-T24

不合格

INDUSTRIAL

2

PARALLEL IO PORT, GENERAL PURPOSE

8

5.72 mm

8

32.258 mm

15.24 mm

TLC34058-110FN
TLC34058-110FN
Texas Instruments 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

QCCJ,

110 MHz

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

Obsolete

TEXAS INSTRUMENTS INC

LCC

3A001.A.3

8542.31.00.01

QUAD

J BEND

未说明

1.27 mm

not_compliant

未说明

84

S-PQCC-J84

不合格

COMMERCIAL

DISPLAY CONTROLLER, PALETTE DAC

4.57 mm

2

8

1280 X 1024 PIXELS

29.3116 mm

29.3116 mm

PCF2127T
PCF2127T
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

-40 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

4.2 V

1.8 V

3.3 V

活跃

NXP SEMICONDUCTORS

SOP,

0.032 MHz

85 °C

EAR99

8542.39.00.01

DUAL

鸥翼

1.27 mm

unknown

R-PDSO-G16

INDUSTRIAL

TIMER, REAL TIME CLOCK

2.65 mm

SERIAL(I2C), SERIAL(SPI)

10.3 mm

7.5 mm

S-3510ACFJ
S-3510ACFJ
Seiko Epson Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

8

PLASTIC/EPOXY

-20 °C

70 °C

0.032 MHz

SEIKO EPSON CORP

Obsolete

3 V

1.7 V

5.5 V

小概要

RECTANGULAR

SOP

EAR99

8542.39.00.01

DUAL

鸥翼

1.27 mm

unknown

R-PDSO-G8

不合格

COMMERCIAL

TIMER, REAL TIME CLOCK

1.75 mm

SERIAL, 3-WIRE

4.9 mm

3.9 mm

PSD312-20L
PSD312-20L
Waferscale Integration Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

CERAMIC, METAL-SEALED COFIRED

WQCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER, WINDOW

5.5 V

4.5 V

5 V

Obsolete

WAFERSCALE INTEGRATION INC

19

70 °C

e0

锡铅

QUAD

J BEND

1.27 mm

unknown

S-CQCC-J44

不合格

COMMERCIAL

3

PARALLEL IO PORT, GENERAL PURPOSE

95 mA

4.57 mm

16

16.485 mm

16.485 mm

MSM6242BJS
MSM6242BJS
LAPIS Semiconductor Co Ltd 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

18

QCCJ, LDCC18,.33X.53

0.032 MHz

85 °C

-30 °C

PLASTIC/EPOXY

QCCJ

LDCC18,.33X.53

RECTANGULAR

CHIP CARRIER

6 V

4 V

5 V

Obsolete

LAPIS SEMICONDUCTOR CO LTD

e0

EAR99

Tin/Lead (Sn/Pb)

TIMEKEEPING CURRENT = 10UA; MIN PROGRAMMABLE DELAY = 0.01562S; 30 SEC ADJUSTMENT

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

R-PQCC-J18

不合格

OTHER

TIMER, REAL TIME CLOCK

4

SECONDS

N

NO

PARALLEL, DIRECT ADDRESS

WPCS6052C.B0-900261
WPCS6052C.B0-900261
Inphi Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

INPHI CORP

,

Transferred

8542.31.00.01

compliant

R2A20150SA
R2A20150SA
Renesas Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

RENESAS ELECTRONICS CORP

TSSOP

TSSOP, TSSOP16,.25

PTSP0016JB

0.4 MHz

8

85 °C

-30 °C

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

5 V

Obsolete

3A991

8542.39.00.01

DUAL

鸥翼

未说明

0.635 mm

compliant

未说明

16

R-PDSO-G16

不合格

OTHER

1

PARALLEL IO PORT, GENERAL PURPOSE

8

XCZU5EV-3SFVC784I
XCZU5EV-3SFVC784I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

2017-02-15

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

0.9 V

Transferred

XILINX INC

FBGA,

4

100 °C

-40 °C

e1

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

23 mm

23 mm

XCZU5EV-3SFVC784I
XCZU5EV-3SFVC784I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

-40 °C

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

0.9 V

活跃

ADVANCED MICRO DEVICES INC

FCBGA-784

4

100 °C

e1

锡银铜

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

23 mm

23 mm