类别是'category.应用特定微控制器' (5057)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 端口的数量 | uPs/uCs/外围ICs类型 | 比特数 | 电源电流-最大值 | 座位高度-最大 | 地址总线宽度 | 主时钟/晶体频率-名 | 外部数据总线宽度 | 输出时钟频率-最大值 | 总线兼容性 | 时间-最小值 | 中断能力 | 易失性 | 信息访问方法 | 显示配置 | 长度 | 宽度 | |||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | THGBM5G5A1JBAIRYMJ | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MK1418STR | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | LSOP, SOP8,.25 | 70 °C | PLASTIC/EPOXY | LSOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE | 5.5 V | 4.5 V | 5 V | 无 | Transferred | INTEGRATED CIRCUIT SYSTEMS INC | SOIC | e0 | 无 | EAR99 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | unknown | 8 | R-PDSO-G8 | 不合格 | COMMERCIAL | CLOCK GENERATOR, OTHER | 1.5494 mm | 14.318 MHz | 24.576 MHz | 4.8895 mm | 3.937 mm | ||||||||||||||||||||||
![]() | XCZU6CG-1FBVB900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 900 | BGA-900 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 0.876 V | 0.825 V | 0.85 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | e1 | 锡银铜 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 31 mm | 31 mm | |||||||||||||||||||||||||
![]() | XCZU6CG-1FBVB900I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 900 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 0.876 V | 0.825 V | 0.85 V | 有 | Transferred | XILINX INC | BGA, BGA900,30X30,40 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 31 mm | 31 mm | |||||||||||||||||||||||||||||
![]() | SYM53C180 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 192 | BALL | Obsolete | BROADCOM LTD | PLASTIC/EPOXY | BGA | UNSPECIFIED | EAR99 | 8542.39.00.01 | QUAD | BUTT | compliant | X-PBGA-B192 | |||||||||||||||||||||||||||||||||||||||||||
![]() | TMPZ84C20AM-8 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 40 | 0.450 INCH, PLASTIC, SSOP-40 | 8 MHz | 16 | 70 °C | -10 °C | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 5.25 V | 4.75 V | 5 V | Obsolete | TOSHIBA CORP | SSOP | EAR99 | 8542.39.00.01 | DUAL | 鸥翼 | 0.8 mm | unknown | 40 | R-PDSO-G40 | 不合格 | COMMERCIAL | 2 | PARALLEL IO PORT, GENERAL PURPOSE | 10 mA | 2.8 mm | 8 | 17.5 mm | 8.8 mm | |||||||||||||||||||||||
![]() | XCZU6CG-1LFFVC900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 900 | PLASTIC/EPOXY | -40 °C | 100 °C | 4 | FCBGA-900 | ADVANCED MICRO DEVICES INC | 活跃 | 有 | 0.85 V | 网格排列 | SQUARE | BGA900,30X30,40 | BGA | e1 | 锡银铜 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||||||||||||||||||||||||||||
![]() | IMISC471AYBD | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PCF2116CU/10 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 128 | 0.225 MHz | 85 °C | -40 °C | UNSPECIFIED | DIE | UNSPECIFIED | UNCASED CHIP | 6 V | 2.5 V | 5 V | Obsolete | NXP SEMICONDUCTORS | WAFER | DIE, | 8542.31.00.01 | UPPER | 无铅 | unknown | X-XUUC-N | 不合格 | INDUSTRIAL | DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER | 1.1 mA | 1 | 8 | I2C | 32 X 60 DOTS | ||||||||||||||||||||||||||||
![]() | XCZU6CG-1SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 784 | BGA-784 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.876 V | 0.825 V | 0.85 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | e1 | 锡银铜 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | |||||||||||||||||||||||||
![]() | XCZU6CG-1SFVC784I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 784 | FBGA, BGA78428X28,32 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.876 V | 0.825 V | 0.85 V | 有 | Transferred | XILINX INC | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | |||||||||||||||||||||||||
![]() | ML60851DTBZ03A | OKI Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6CG-L1SFVC784I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 784 | FBGA, BGA78428X28,32 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.742 V | 0.698 V | 0.72 V | 有 | Transferred | XILINX INC | 锡银铜 | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | ||||||||||||||||||||||||
![]() | XCZU6CG-L1SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 784 | BGA-784 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.742 V | 0.698 V | 0.72 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | e1 | 锡银铜 | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | ||||||||||||||||||||||||
![]() | S-3511AEFS | ABLIC Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | SEIKO INSTRUMENTS USA INC | SOIC | SOP, SSOP8,.25 | 0.032 MHz | 70 °C | -20 °C | PLASTIC/EPOXY | SOP | SSOP8,.25 | RECTANGULAR | 小概要 | 5.5 V | 1.7 V | 3 V | 无 | Obsolete | e0 | EAR99 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 0.65 mm | compliant | 8 | R-PDSO-G8 | 不合格 | COMMERCIAL | TIMER, REAL TIME CLOCK | 1.3 mm | SECONDS | Y | YES | SERIAL, 3-WIRE | 4.4 mm | 3.1 mm | |||||||||||||||||||
![]() | HCMP1852P | Hughes Microelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | DIP, DIP24,.6 | 16 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 10.5 V | 4 V | 5 V | 无 | Obsolete | HUGHES MICROELECTRONICS | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | 不合格 | INDUSTRIAL | 2 | PARALLEL IO PORT, GENERAL PURPOSE | 8 | 5.72 mm | 8 | 32.258 mm | 15.24 mm | ||||||||||||||||||||||
![]() | TLC34058-110FN | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 84 | QCCJ, | 110 MHz | 70 °C | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 5.25 V | 4.75 V | 5 V | 无 | Obsolete | TEXAS INSTRUMENTS INC | LCC | 无 | 3A001.A.3 | 8542.31.00.01 | QUAD | J BEND | 未说明 | 1.27 mm | not_compliant | 未说明 | 84 | S-PQCC-J84 | 不合格 | COMMERCIAL | DISPLAY CONTROLLER, PALETTE DAC | 4.57 mm | 2 | 8 | 1280 X 1024 PIXELS | 29.3116 mm | 29.3116 mm | |||||||||||||||||||||
![]() | PCF2127T | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 4.2 V | 1.8 V | 3.3 V | 活跃 | NXP SEMICONDUCTORS | SOP, | 0.032 MHz | 85 °C | EAR99 | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | unknown | R-PDSO-G16 | INDUSTRIAL | TIMER, REAL TIME CLOCK | 2.65 mm | SERIAL(I2C), SERIAL(SPI) | 10.3 mm | 7.5 mm | |||||||||||||||||||||||||||||
![]() | S-3510ACFJ | Seiko Epson Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | PLASTIC/EPOXY | -20 °C | 70 °C | 0.032 MHz | SEIKO EPSON CORP | Obsolete | 3 V | 1.7 V | 5.5 V | 小概要 | RECTANGULAR | SOP | EAR99 | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | unknown | R-PDSO-G8 | 不合格 | COMMERCIAL | TIMER, REAL TIME CLOCK | 1.75 mm | SERIAL, 3-WIRE | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||
![]() | PSD312-20L | Waferscale Integration Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | CERAMIC, METAL-SEALED COFIRED | WQCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER, WINDOW | 5.5 V | 4.5 V | 5 V | 无 | Obsolete | WAFERSCALE INTEGRATION INC | 19 | 70 °C | e0 | 锡铅 | QUAD | J BEND | 1.27 mm | unknown | S-CQCC-J44 | 不合格 | COMMERCIAL | 3 | PARALLEL IO PORT, GENERAL PURPOSE | 95 mA | 4.57 mm | 16 | 16.485 mm | 16.485 mm | ||||||||||||||||||||||||||
![]() | MSM6242BJS | LAPIS Semiconductor Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 18 | QCCJ, LDCC18,.33X.53 | 0.032 MHz | 85 °C | -30 °C | PLASTIC/EPOXY | QCCJ | LDCC18,.33X.53 | RECTANGULAR | CHIP CARRIER | 6 V | 4 V | 5 V | 无 | Obsolete | LAPIS SEMICONDUCTOR CO LTD | e0 | EAR99 | Tin/Lead (Sn/Pb) | TIMEKEEPING CURRENT = 10UA; MIN PROGRAMMABLE DELAY = 0.01562S; 30 SEC ADJUSTMENT | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | R-PQCC-J18 | 不合格 | OTHER | TIMER, REAL TIME CLOCK | 4 | SECONDS | N | NO | PARALLEL, DIRECT ADDRESS | ||||||||||||||||||||||
![]() | WPCS6052C.B0-900261 | Inphi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | INPHI CORP | , | Transferred | 8542.31.00.01 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | R2A20150SA | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | RENESAS ELECTRONICS CORP | TSSOP | TSSOP, TSSOP16,.25 | PTSP0016JB | 0.4 MHz | 8 | 85 °C | -30 °C | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | 有 | Obsolete | 有 | 3A991 | 8542.39.00.01 | DUAL | 鸥翼 | 未说明 | 0.635 mm | compliant | 未说明 | 16 | R-PDSO-G16 | 不合格 | OTHER | 1 | PARALLEL IO PORT, GENERAL PURPOSE | 8 | |||||||||||||||||||||||
![]() | XCZU5EV-3SFVC784I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 784 | 2017-02-15 | PLASTIC/EPOXY | FBGA | SQUARE | GRID ARRAY, FINE PITCH | 0.9 V | 有 | Transferred | XILINX INC | FBGA, | 4 | 100 °C | -40 °C | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||
![]() | XCZU5EV-3SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 784 | -40 °C | PLASTIC/EPOXY | FBGA | SQUARE | GRID ARRAY, FINE PITCH | 0.9 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-784 | 4 | 100 °C | e1 | 锡银铜 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | 23 mm | 23 mm |
THGBM5G5A1JBAIRYMJ
Toshiba America Electronic Components
分类:Embedded - Microcontrollers - Application Specific
MK1418STR
Integrated Device Technology Inc
分类:Embedded - Microcontrollers - Application Specific
XCZU6CG-1FBVB900I
AMD
分类:Embedded - Microcontrollers - Application Specific
XCZU6CG-1FBVB900I
AMD Xilinx
分类:Embedded - Microcontrollers - Application Specific
SYM53C180
Broadcom Limited
分类:Embedded - Microcontrollers - Application Specific
TMPZ84C20AM-8
Toshiba America Electronic Components
分类:Embedded - Microcontrollers - Application Specific
XCZU6CG-1LFFVC900I
AMD
分类:Embedded - Microcontrollers - Application Specific
IMISC471AYBD
Cypress Semiconductor
分类:Embedded - Microcontrollers - Application Specific
PCF2116CU/10
NXP Semiconductors
分类:Embedded - Microcontrollers - Application Specific
XCZU6CG-1SFVC784I
AMD
分类:Embedded - Microcontrollers - Application Specific
XCZU6CG-1SFVC784I
AMD Xilinx
分类:Embedded - Microcontrollers - Application Specific
ML60851DTBZ03A
OKI Semiconductor
分类:Embedded - Microcontrollers - Application Specific
XCZU6CG-L1SFVC784I
AMD Xilinx
分类:Embedded - Microcontrollers - Application Specific
XCZU6CG-L1SFVC784I
AMD
分类:Embedded - Microcontrollers - Application Specific
S-3511AEFS
ABLIC Inc.
分类:Embedded - Microcontrollers - Application Specific
HCMP1852P
Hughes Microelectronics
分类:Embedded - Microcontrollers - Application Specific
TLC34058-110FN
Texas Instruments
分类:Embedded - Microcontrollers - Application Specific
PCF2127T
NXP Semiconductors
分类:Embedded - Microcontrollers - Application Specific
S-3510ACFJ
Seiko Epson Corporation
分类:Embedded - Microcontrollers - Application Specific
PSD312-20L
Waferscale Integration Inc
分类:Embedded - Microcontrollers - Application Specific
MSM6242BJS
LAPIS Semiconductor Co Ltd
分类:Embedded - Microcontrollers - Application Specific
WPCS6052C.B0-900261
Inphi Corporation
分类:Embedded - Microcontrollers - Application Specific
R2A20150SA
Renesas Electronics Corporation
分类:Embedded - Microcontrollers - Application Specific
XCZU5EV-3SFVC784I
AMD Xilinx
分类:Embedded - Microcontrollers - Application Specific
XCZU5EV-3SFVC784I
AMD
分类:Embedded - Microcontrollers - Application Specific
