类别是'category.微处理器' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | Contact plating | 表面安装 | Number of pins | 房屋材料 | 终端数量 | 捆绑中心至安装中心 | Conductor Diameter (Cross Section) | Connector pinout layout | Contacts pitch | Date Of Intro | Electrical mounting | Gross weight | Gross Weight | Kind of connector | Row pitch | Spatial orientation | Transport packaging size/quantity | Type of connector | Wire Insulation Color | Wire Length | Operating temperature | 操作温度 | JESD-609代码 | 无铅代码 | ECCN 代码 | 连接器类型 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | 深度 | Reach合规守则 | Current rating | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 接头数量 | 电源 | 温度等级 | 速度 | uPs/uCs/外围ICs类型 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 座位高度-最大 | 地址总线宽度 | 线圈型 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 串行I/O数 | Rated voltage | 定时器数量 | 只读存储器可编程性 | 外部中断数量 | 片上数据 RAM 宽度 | DMA通道数 | 个人资料 | 饱和电流 | 高度 | 长度 | 宽度 | Plating thickness | Flammability rating | |||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | 8155PP5 | Hifn Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 576 | HIFN | BGA, BGA576,30X30,50 | 70 °C | PLASTIC/EPOXY | BGA | BGA576,30X30,50 | SQUARE | 网格排列 | 无 | Transferred | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | S-PBGA-B576 | 不合格 | COMMERCIAL | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8280CZUUPEA | Rochester Electronics LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 480 | 无 | 活跃 | ROCHESTER ELECTRONICS LLC | BGA | 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480 | 100 MHz | 70 °C | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 1.6 V | 1.45 V | 1.5 V | e0 | 无 | 锡铅 | ALSO REQUIRES 3.3V SUPPLY | BOTTOM | BALL | 260 | 1.27 mm | unknown | 40 | 480 | S-PBGA-B480 | COMMERCIAL | COMMERCIAL | 450 MHz | MICROPROCESSOR, RISC | 32 | 1.65 mm | 32 | YES | NO | 64 | 浮点 | YES | 4 | 37.5 mm | 37.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TSPC603RMGU10LC | Teledyne e2v | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 255 | Obsolete | E2V TECHNOLOGIES PLC | BGA | BGA, | 233 MHz | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | 网格排列 | 2.625 V | 2.375 V | 2.5 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 255 | S-CBGA-B255 | 不合格 | MILITARY | 233 MHz | MICROPROCESSOR, RISC | 32 | 3 mm | 32 | YES | YES | 64 | 浮点 | YES | 21 mm | 21 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TSPC603RMGU14LC | Atmel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 255 | 无 | Transferred | ATMEL CORP | BGA | BGA, BGA255,16X16,50 | 75 MHz | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA255,16X16,50 | SQUARE | 网格排列 | 2.625 V | 2.375 V | 2.5 V | e0 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 255 | S-CBGA-B255 | 不合格 | MILITARY | 300 MHz | MICROPROCESSOR, RISC | 32 | 3 mm | 32 | YES | YES | 64 | 浮点 | YES | 21 mm | 21 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AV8062700849508 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1023 | BGA | BGA, | 133 MHz | PLASTIC/EPOXY | BGA | RECTANGULAR | 网格排列 | Obsolete | INTEL CORP | 5A992.C | 8542.31.00.01 | BOTTOM | BALL | compliant | 1023 | R-PBGA-B1023 | 2900 MHz | MICROPROCESSOR | 64 | YES | YES | 固定点 | YES | 31 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MIMXRT1064DVL6B | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 4 Weeks | YES | 196 | 活跃 | NXP SEMICONDUCTORS | MAPBGA-196 | 24 MHz | 3 | 85 °C | PLASTIC/EPOXY | LFBGA | BGA196,14X14,25 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.3 V | 1.25 V | 有 | BOTTOM | BALL | 260 | 0.65 mm | compliant | 40 | S-PBGA-B196 | OTHER | 600 MHz | MICROPROCESSOR, RISC | 110 mA | 32 | 1.43 mm | YES | YES | FLOATING-POINT | YES | 1048576 | 10 | 8 | 32 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8569ECVJAQLJB | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 4 Weeks | YES | 783 | 有 | Obsolete | NXP SEMICONDUCTORS | 29 X 29 MM, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783 | 133 MHz | 3 | 105 °C | -40 °C | PLASTIC/EPOXY | HBGA | BGA783,28X28,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 1.03 V | 0.97 V | 1 V | e1 | 5A002.A.1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B783 | 不合格 | 1067 MHz | MICROPROCESSOR, RISC | 32 | 3.94 mm | 16 | YES | YES | 64 | 浮点 | YES | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PC8640MSH1067NE | Teledyne e2v | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1023 | TELEDYNE E2V (UK) LTD | 266 MHz | 125 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | HBGA | BGA1023,32X32,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 1 V | 0.9 V | 0.95 V | Obsolete | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-CBGA-B1023 | MILITARY | 1067 MHz | MICROPROCESSOR, RISC | 32 | 2.77 mm | 32 | YES | YES | 32 | 浮点 | YES | 12 | 4 | 33 mm | 33 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC68000P8 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 64 | MOTOROLA SEMICONDUCTOR PRODUCTS | DIP, DIP64,.9 | 70 °C | PLASTIC/EPOXY | DIP | DIP64,.9 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T64 | 不合格 | 5 V | COMMERCIAL | 8 MHz | MICROPROCESSOR, RISC | 32 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RE464XDEC44HJ | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | ADVANCED MICRO DEVICES INC | 8542.31.00.01 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9328MX21VM | Rochester Electronics LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 289 | 有 | 活跃 | ROCHESTER ELECTRONICS LLC | BGA | 14 X 14 MM, 1.41 MM HEIGHT, 0.65 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-289 | 32 MHz | 3 | 70 °C | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.65 V | 1.45 V | 1.5 V | e1 | 有 | 锡银铜 | ALSO REQUIRES 3.3 V I/O SUPPLY; UNAVAILABLE FOR IMPORT OR SALE IN US | BOTTOM | BALL | 260 | 0.8 mm | unknown | 40 | 289 | S-PBGA-B289 | COMMERCIAL | COMMERCIAL | 266 MHz | MICROPROCESSOR | 32 | 1.6 mm | 26 | YES | YES | 32 | 固定点 | YES | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MIMXRT1052CVL5B | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 4 Weeks | YES | 196 | 活跃 | NXP SEMICONDUCTORS | MABGA-196 | 3 | 105 °C | -40 °C | PLASTIC/EPOXY | LFBGA | BGA196,14X14,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.26 V | 1.15 V | 有 | e1 | 5A992.C | Tin/Silver/Copper (Sn/Ag/Cu) | 24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE | 8542.31.00.01 | BOTTOM | BALL | 260 | 0.65 mm | compliant | 40 | S-PBGA-B196 | INDUSTRIAL | SoC | 1.52 mm | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9328MXLVM20 | Rochester Electronics LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 有 | 活跃 | ROCHESTER ELECTRONICS LLC | BGA | 14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256 | 16 MHz | 3 | 70 °C | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 2 V | 1.8 V | 1.9 V | e1 | 有 | 锡银铜 | ALSO REQUIRES 3.3V SUPPLY | BOTTOM | BALL | 260 | 0.8 mm | unknown | 40 | 256 | S-PBGA-B256 | COMMERCIAL | COMMERCIAL | 200 MHz | MICROPROCESSOR, RISC | 32 | 1.6 mm | 25 | YES | YES | 32 | 固定点 | YES | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | FH8065802420503 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCIMX6U6AVM10ADR REV.1.4 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TDA1MEVAASQ4RQ1 | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XPC750PRX300LE | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 360 | FREESCALE SEMICONDUCTOR INC | BGA | BGA, | 100 MHz | CERAMIC, METAL-SEALED COFIRED | BGA | SQUARE | 网格排列 | 2 V | 1.8 V | 1.9 V | Transferred | 3A991.A.2 | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | unknown | 360 | S-CBGA-B360 | 不合格 | 300 MHz | MICROPROCESSOR, RISC | 32 | 3.2 mm | NO | YES | 固定点 | NO | 25 mm | 25 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PC8640MGH1067NE | Teledyne e2v | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 166.66 MHz | 125 °C | -40 °C | 1.1 V | 1 V | 1.05 V | Obsolete | TELEDYNE E2V (UK) LTD | 3A991.A.2 | 8542.31.00.01 | unknown | 1067 MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | 64 | 浮点 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GG8067402570603 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1667 | 2017-04-20 | BGA, | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 活跃 | INTEL CORP | 5A992.C | 8542.31.00.01 | BOTTOM | BALL | compliant | S-PBGA-B1667 | 2100 MHz | MICROPROCESSOR | NO | NO | 固定点 | YES | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TMS9980AJDL | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | NO | 66 | 40 | 2x33 | 2.54mm | THT | 3.57 g | TEXAS INSTRUMENTS INC | female | DIP, DIP40,.6 | 70 °C | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | socket | 无 | 2.54mm | straight | Obsolete | pin strips | -40...163°C | 8542.31.00.01 | DUAL | THROUGH-HOLE | 未说明 | 2.54 mm | not_compliant | 1.5A | 未说明 | R-XDIP-T40 | 不合格 | COMMERCIAL | MICROPROCESSOR, RISC | 16 | 60V | beryllium copper | 0.75µm | UL94V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | R7S910025CBG | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 22 | 320 | 0 | 活跃 | 2x11 | 2.54mm | SMT | 1.05 g | RENESAS ELECTRONICS CORP | female | FBGA, | 25 MHz | 209 | 125 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA320,20X20,32 | SQUARE | GRID ARRAY, FINE PITCH | 1.26 V | 1.14 V | 1.2 V | 2.54mm | straight | socket | pin strips | -40...163°C | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | compliant | 1.5A | S-PBGA-B320 | AUTOMOTIVE | 450 MHz | MICROCONTROLLER, RISC | 651 mA | 32 | YES | YES | YES | NO | 1.75 mm | 1048576 | CORTEX-R4 | YES | YES | 32 | 浮点 | YES | 60V | 33 | ROM LESS | 20 | 8 | 32 | beryllium copper | 17 mm | 17 mm | 0.254µm | UL94V-0 | ||||||||||||||||||||||||||||||||||
![]() | MC68HC000P10 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 64 | MOTOROLA SEMICONDUCTOR PRODUCTS | DIP, DIP64,.9 | 70 °C | PLASTIC/EPOXY | DIP | DIP64,.9 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T64 | 不合格 | 5 V | COMMERCIAL | 10 MHz | MICROPROCESSOR, RISC | 30 mA | 32 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC750ARX266TH | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | nylon PA66 (UL94V0), black | 255 | 0.12mm2 (26AWG), insulation - PVC 0.4mm | Obsolete | 4.48 | FREESCALE SEMICONDUCTOR INC | BGA | CERAMIC, BGA-255 | 266 MHz | 105 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | BGA | BGA360,19X19,50 | SQUARE | 网格排列 | 2.6 V | 无 | 48*32*22.5/3000 | red; black | 4*300mm | 0…+80 °C | e0 | 3A991 | BLS-4 with 2.54mm pitch | Interconnect Power Cable Connector (F - F) 2 x BLS | 锡铅 | ALSO REQUIRES 3.3V I/O SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | connector housing - 14mm | not_compliant | 255 | S-CBGA-B255 | 不合格 | 4 | INDUSTRIAL | 266 MHz | MICROPROCESSOR, RISC | 32 | 32 | NO | YES | 64 | 浮点 | YES | 1 | connector housing - 2.6mm | connector housing - 10.16mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | TDA2HVBRQABCRQ1 | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | YES | 6 | 760 | 活跃 | 2x3 | 2.54mm | THT | 0.36 g | TEXAS INSTRUMENTS INC | female | FBGA, | 125 °C | -40 °C | PLASTIC/EPOXY | FBGA | SQUARE | GRID ARRAY, FINE PITCH | 1.2 V | 1.11 V | 1.15 V | socket | 2.54mm | straight | 有 | pin strips | -40...163°C | e1 | 有 | 5A992.C | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 1.5A | 30 | S-PBGA-B760 | AUTOMOTIVE | SoC | 2.96 mm | AEC-Q100 | 60V | beryllium copper | 3 | 23 mm | 23 mm | 0.75µm | UL94V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AMD-K6-2/400ACK | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | gold-plated | NO | 49 | 321 | 2 V | 1.9 V | 1x49 | 2.54mm | THT | 4.66 g | 2.1 V | female | 网格排列 | SQUARE | SPGA321,37X37 | PGA | CERAMIC, METAL-SEALED COFIRED | 80 °C | 100 MHz | PGA, SPGA321,37X37 | PGA | ADVANCED MICRO DEVICES INC | Obsolete | 无 | socket | straight | pin strips | -40...163°C | e0 | 3A991.A.2 | 锡铅 | ALSO REQUIRES 3.135V TO 3.6V FOR I/O | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 1.5A | 321 | S-CPGA-P321 | 不合格 | 商业扩展 | 400 MHz | MICROPROCESSOR, RISC | 32 | 3.63 mm | 32 | YES | YES | 64 | 浮点 | YES | 60V | beryllium copper | 49.53 mm | 49.53 mm | 0.75µm | UL94V-0 |
8155PP5
Hifn Inc
分类:Embedded - Microprocessors
MPC8280CZUUPEA
Rochester Electronics LLC
分类:Embedded - Microprocessors
TSPC603RMGU10LC
Teledyne e2v
分类:Embedded - Microprocessors
TSPC603RMGU14LC
Atmel Corporation
分类:Embedded - Microprocessors
AV8062700849508
Intel Corporation
分类:Embedded - Microprocessors
MIMXRT1064DVL6B
NXP Semiconductors
分类:Embedded - Microprocessors
MPC8569ECVJAQLJB
NXP Semiconductors
分类:Embedded - Microprocessors
PC8640MSH1067NE
Teledyne e2v
分类:Embedded - Microprocessors
MC68000P8
Freescale Semiconductor
分类:Embedded - Microprocessors
RE464XDEC44HJ
AMD
分类:Embedded - Microprocessors
MC9328MX21VM
Rochester Electronics LLC
分类:Embedded - Microprocessors
MIMXRT1052CVL5B
NXP Semiconductors
分类:Embedded - Microprocessors
MC9328MXLVM20
Rochester Electronics LLC
分类:Embedded - Microprocessors
FH8065802420503
Intel Corporation
分类:Embedded - Microprocessors
MCIMX6U6AVM10ADR REV.1.4
NXP Semiconductors
分类:Embedded - Microprocessors
TDA1MEVAASQ4RQ1
Texas Instruments
分类:Embedded - Microprocessors
XPC750PRX300LE
Freescale Semiconductor
分类:Embedded - Microprocessors
PC8640MGH1067NE
Teledyne e2v
分类:Embedded - Microprocessors
GG8067402570603
Intel Corporation
分类:Embedded - Microprocessors
TMS9980AJDL
Texas Instruments
分类:Embedded - Microprocessors
R7S910025CBG
Renesas Electronics Corporation
分类:Embedded - Microprocessors
MC68HC000P10
Freescale Semiconductor
分类:Embedded - Microprocessors
MPC750ARX266TH
Freescale Semiconductor
分类:Embedded - Microprocessors
TDA2HVBRQABCRQ1
Texas Instruments
分类:Embedded - Microprocessors
AMD-K6-2/400ACK
AMD
分类:Embedded - Microprocessors
