类别是'category.专用模块' (1062)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 表面安装 | 越来越多的功能 | 材料 | 终端数量 | Date Of Intro | 厂商 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 连接器类型 | 类型 | 定位的数量 | 端子表面处理 | 应用 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 输出量 | 引脚数量 | 触点表面处理 | JESD-30代码 | 功能 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 磁卡种类 | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | I/O类型 | 内存IC类型 | 插入、移除方法 | 产品 | 喷射器侧 | 特征 | 混合内存类型 | 长度 | 宽度 | 触点表面处理厚度 | 板上高度 | ||||||||||||||||||||||||||
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![]() | TM1STNTCRN6153P | Schneider | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Other | 3 | Clamp | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5123058000 | Schneider | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Stainless steel | 100 | 2 | Clamp | 119025 | Schneider | 无显示 | Duct | 1.8 kOhm NTC | Temperature | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DS1990C-F5 | Analog Devices | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Analog Devices Inc./Maxim Integrated | Bulk | DS1990 | 活跃 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DS1411-009# | Analog Devices | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | DB9 Adapter | Analog Devices Inc./Maxim Integrated | DS1411 | Bulk | 活跃 | iButton® | Retainer, Serial Port | Holder | 2 | - | iButton | Push In, Pull Out | Accessories | - | ID芯片 | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S72WS256NEEBFWUB0 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 137 | FBGA | BGA137,10X14,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FBGA, BGA137,10X14,32 | 70 ns | 85 °C | -25 °C | PLASTIC/EPOXY | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B137 | 不合格 | OTHER | 0.06 mA | 0.00004 A | 存储器电路 | FLASH+SDRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M4-4101S-Z3 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SSDSC2KB240G701 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2018-07-23 | Obsolete | INTEL CORP | , | EAR99 | 8542.32.00.71 | compliant | 存储器电路 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | FM1114-QGTR | Ramtron International Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | RAMTRON INTERNATIONAL CORP | , | EAR99 | 8542.32.00.71 | unknown | 存储器电路 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S72NS256PD0AJBLG3 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 133 | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 有 | Obsolete | SPANSION INC | BGA | 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133 | 3 | 16777216 words | e2 | EAR99 | TIN SILVER COPPER NICKEL | DRAM IS ORGANISED AS 16M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 40 | 133 | S-PBGA-B133 | 不合格 | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 16MX16 | 1.1 mm | 16 | 268435456 bit | 存储器电路 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | PF38F5060M0Y0B0 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 105 | 33554432 words | 32000000 | 85 °C | -30 °C | PLASTIC/EPOXY | TFBGA | BGA105,9X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 有 | Transferred | INTEL CORP | BGA | TFBGA, BGA105,9X12,32 | 3 | e1 | EAR99 | 锡银铜 | PSEUDO SRAM IS ORGANIZED AS 8M X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 105 | R-PBGA-B105 | 不合格 | 2 V | OTHER | 1.7 V | SYNCHRONOUS | 32MX16 | 1.2 mm | 16 | 0.00012 A | 536870912 bit | 存储器电路 | FLASH+PSRAM | 11 mm | 9 mm | |||||||||||||||||||||||||||||||||||||||
![]() | TH50VSF2580AASB | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 69 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | BGA69,10X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | 无 | Transferred | TOSHIBA CORP | BGA | LFBGA, BGA69,10X12,32 | 90 ns | e0 | 无 | EAR99 | 锡铅 | USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 256 X 16 OR 512K X 8 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 69 | R-PBGA-B69 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.05 mA | 2MX16 | 1.4 mm | 16 | 33554432 bit | 存储器电路 | FLASH+SRAM | 12 mm | 9 mm | ||||||||||||||||||||||||||||||||||||||
![]() | S82S141F883C | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | SIGNETICS CORP | DIP, DIP24,.6 | 90 ns | 512 words | 512 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-CDIP-T24 | 不合格 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.185 mA | 512X8 | 8 | 4096 bit | MIL-STD-883 | 存储器电路 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | S82S141F883C | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | 512 words | 512 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | SIGNETICS CORP | DIP | DIP, DIP24,.6 | 90 ns | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 24 | R-CDIP-T24 | 不合格 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.185 mA | 512X8 | 8 | 4096 bit | MIL-STD-883 | 存储器电路 | |||||||||||||||||||||||||||||||||||||||||||
![]() | S71PL129JB0BAW9Z0 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | BGA64,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FBGA, BGA64,10X12,32 | 70 ns | 85 °C | -25 °C | PLASTIC/EPOXY | FBGA | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B64 | 不合格 | OTHER | 0.07 mA | 0.000005 A | 存储器电路 | FLASH+PSRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RP-SMLF32RP0 | Panasonic Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M4-4106-Z3 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71GL128NB0BFW9Z | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC57256D-20 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 无 | Transferred | TOSHIBA CORP | , | e0 | EAR99 | 锡铅 | 8542.32.00.71 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC17S40SOG20I | AMD Xilinx | 数据表 | 779 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | 329312 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 有 | Obsolete | XILINX INC | SOIC | SOP, | 3 | 329312 words | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | 不合格 | 5.5 V | INDUSTRIAL | 4.5 V | SYNCHRONOUS | 329312X1 | 2.65 mm | 1 | 329312 bit | 存储器电路 | 12.8 mm | 7.5 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | MM5260N | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 无 | Obsolete | NATIONAL SEMICONDUCTOR CORP | DIP, DIP16,.3 | 1024 words | 1000 | 70 °C | -25 °C | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | OTHER | 1KX1 | 3-STATE | 1 | 1024 bit | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S71PL032J80BAW070 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | 2000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 有 | Obsolete | SPANSION INC | BGA | TFBGA, | 3 | 2097152 words | e1 | EAR99 | 锡银铜 | PSRAM IS ORGANIZED AS 512K X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 56 | R-PBGA-B56 | 不合格 | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | 存储器电路 | 9 mm | 7 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | S71PL032J80BAW070 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | FBGA | BGA56,8X8,32 | SQUARE | GRID ARRAY, FINE PITCH | 3 V | 有 | Obsolete | ADVANCED MICRO DEVICES INC | FBGA, BGA56,8X8,32 | 70 ns | 85 °C | -25 °C | PLASTIC/EPOXY | EAR99 | 8542.32.00.71 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B56 | 不合格 | OTHER | 0.07 mA | 0.000005 A | 存储器电路 | FLASH+PSRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | UPD41101C-2 | NEC Electronics Group | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | UPD41101C-2 | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | DIP24,.3 | RECTANGULAR | IN-LINE | 无 | Obsolete | RENESAS ELECTRONICS CORP | DIP-24 | 27 ns | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | 不合格 | COMMERCIAL | 0.09 mA | 0.09 A | 存储器电路 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY7C274-55QMB | Teledyne e2v | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | E2V TECHNOLOGIES PLC | , | 3A001.A.2.C | 8542.32.00.61 | compliant |
TM1STNTCRN6153P
Schneider
分类:Specialized
5123058000
Schneider
分类:Specialized
DS1990C-F5
Analog Devices
分类:Specialized
DS1411-009#
Analog Devices
分类:Specialized
S72WS256NEEBFWUB0
AMD
分类:Specialized
M4-4101S-Z3
Moujen Switch
分类:Specialized
SSDSC2KB240G701
Intel Corporation
分类:Specialized
FM1114-QGTR
Ramtron International Corporation
分类:Specialized
S72NS256PD0AJBLG3
Spansion
分类:Specialized
PF38F5060M0Y0B0
Intel Corporation
分类:Specialized
TH50VSF2580AASB
Toshiba America Electronic Components
分类:Specialized
S82S141F883C
Philips Semiconductors
分类:Specialized
S82S141F883C
NXP Semiconductors
分类:Specialized
S71PL129JB0BAW9Z0
AMD
分类:Specialized
RP-SMLF32RP0
Panasonic Electronic Components
分类:Specialized
M4-4106-Z3
Moujen Switch
分类:Specialized
S71GL128NB0BFW9Z
Spansion
分类:Specialized
TC57256D-20
Toshiba America Electronic Components
分类:Specialized
XC17S40SOG20I
AMD Xilinx
分类:Specialized
MM5260N
Texas Instruments
分类:Specialized
S71PL032J80BAW070
Spansion
分类:Specialized
S71PL032J80BAW070
AMD
分类:Specialized
UPD41101C-2
NEC Electronics Group
分类:Specialized
UPD41101C-2
Renesas Electronics Corporation
分类:Specialized
CY7C274-55QMB
Teledyne e2v
分类:Specialized
