category.内存卡和模块_category.内存卡和模块品牌厂家，型号_价格_规格

类别是'category.专用模块' (1062)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	Contact plating	表面安装	Number of pins	终端数量					Connector pinout layout	Contacts pitch	Date Of Intro		Electrical mounting	Gross weight		Kind of connector	厂商																	Row pitch	Spatial orientation		Type of connector	Operating temperature	系列	JESD-609代码	无铅代码	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	功能数量	端子间距	Reach合规守则	Current rating	频率	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	电源电压-最大值(Vsup)	温度等级	电源电压-最小值(Vsup)	电压	操作模式	电源电流-最大值	组织结构	输出特性	座位高度-最大	内存宽度	密度	待机电流-最大值	记忆密度	筛选水平	并行/串行	I/O类型	内存IC类型	编程电压	串行总线类型	耐力	数据保持时间	写入保护	待机电压-最小值	Rated voltage	个人资料
W29N08GVBIAA	Winbond	数据表	N/A	-	最小起订量: 1 最小包装量: 1										9X11mm2	VFBGA - 63																					40MHz								2.7 ~ 3.6V							8Gb																	-40~+85˚C
W29N08GVSIAA	Winbond	数据表	N/A	-	最小起订量: 1 最小包装量: 1										12X20mm2	TSOPI - 48																					40MHz								2.7 ~ 3.6V							8Gb																	-40~+85˚C
NM1484KSLAXAJ-3B	Nanya Technology Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1										活跃	NANYA TECHNOLOGY CORP										EAR99			8542.32.00.71						compliant																							存储器电路
SST32HF164-90-4C-EK	Silicon Storage Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	gold-plated	YES	43	48	1x43	2.54mm	THT	2.15 g	female		1048576 words	1000000	70 °C	PLASTIC/EPOXY	TSOP1	TSSOP48,.8,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	3 V	socket	无	Obsolete	SILICON STORAGE TECHNOLOGY INC	TSOP1		TSOP1, TSSOP48,.8,20		straight	90 ns	pin strips	-40...163°C		e0		EAR99	Tin/Lead (Sn/Pb)	ALSO CONTAINS 256K X 16 SRAM	8542.32.00.71	DUAL	鸥翼		1	0.5 mm	unknown	3A			48	R-PDSO-G48	不合格	3.3 V	COMMERCIAL	2.7 V		ASYNCHRONOUS	0.045 mA	1MX16		1.2 mm	16		0.00004 A	16777216 bit				存储器电路							150V	beryllium copper		FLASH+SRAM		18.4 mm	12 mm	0.75µm	UL94V-0
MR2A16AVYS35	Freescale Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	tinned	YES	17	44	1x17	1.27mm	THT	1.18 g	female		262144 words	256000	70 °C	PLASTIC/EPOXY	TSOP2	TSOP44,.46,32	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	有	3.3 V	socket	Transferred	FREESCALE SEMICONDUCTOR INC	TSOP2		0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44		straight	35 ns	pin strips	-40...163°C		e3		EAR99	哑光锡		8542.32.00.71	DUAL	鸥翼	260	1	0.8 mm	compliant	1.5A		40	44	R-PDSO-G44	不合格	3.6 V	COMMERCIAL	3 V		ASYNCHRONOUS		256KX16		1.2 mm	16		0.028 A	4194304 bit				存储器电路							125V	bronze	3			18.41 mm	10.16 mm	4µm	UL94V-0
CY7C261-25WMB	Teledyne e2v	数据表	N/A	-	最小起订量: 1 最小包装量: 1	gold-plated	NO	30	24	2x15	2.54mm	SMT	3.83 g	female	8000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	WDIP	DIP24,.3	RECTANGULAR	IN-LINE, WINDOW	5 V	socket	活跃	TELEDYNE E2V (UK) LTD	DIP-24		25 ns	8192 words	2.54mm	straight		pin strips	-40...163°C				3A001.A.2.C			8542.32.00.61	DUAL	THROUGH-HOLE		1	2.54 mm	compliant	3A				R-CDIP-T24		5.5 V		4.5 V		ASYNCHRONOUS	0.14 mA	8KX8	3-STATE	5.08 mm	8		0.04 A	65536 bit		PARALLEL	COMMON	UVPROM	12.5 V						150V	beryllium copper				31.877 mm	7.62 mm	0.75µm	UL94V-0
DS1990C-F5	Analog Devices	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Analog Devices Inc./Maxim Integrated											Bulk	DS1990			活跃			-
SST32HF802-70-4C-L3KE	Silicon Storage Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	gold-plated	YES	20	48	2x10	2.54mm	THT	0.94 g	female		524288 words	512000	70 °C	PLASTIC/EPOXY	LFBGA	BGA48,6X8,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V	socket	有	Obsolete	SILICON STORAGE TECHNOLOGY INC	BGA		LFBGA, BGA48,6X8,32	2.54mm	straight	70 ns	pin strips	-40...163°C		e1		EAR99	锡银铜	SRAM IS ORGANIZED AS 128K X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown	1.5A			48	R-PBGA-B48	不合格	3.3 V	COMMERCIAL	2.7 V		ASYNCHRONOUS	0.055 mA	512KX16		1.4 mm	16		0.00004 A	8388608 bit				存储器电路							60V	beryllium copper		FLASH+SRAM		8 mm	6 mm	0.254µm	UL94V-0
SST32HF802-70-4C-L3KE	Greenliant Systems Ltd	数据表	N/A	-	最小起订量: 1 最小包装量: 1	gold-plated	YES	16	48	2x8	2.54mm	THT	0.72 g	female	PLASTIC/EPOXY	LFBGA	BGA48,6X8,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V	socket	Obsolete	GREENLIANT SYSTEMS LTD	,	70 ns		524288 words	512000		2.54mm	straight	70 °C	pin strips	-40...163°C				EAR99		SRAM IS ORGANIZED AS 128K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant	1.5A				R-PBGA-B48		3.3 V		2.7 V		ASYNCHRONOUS		512KX16		1.4 mm	16			8388608 bit				存储器电路							60V	beryllium copper		FLASH+SRAM		8 mm	6 mm	0.254µm	UL94V-0
FM1114-QGTR	Ramtron International Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	,												Obsolete			RAMTRON INTERNATIONAL CORP						EAR99			8542.32.00.71						unknown																							存储器电路
M4-4114S-Z2	Moujen Switch	数据表	N/A	-	最小起订量: 1 最小包装量: 1
S72WS256NEEBFWUB0	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	137			85 °C			-25 °C	PLASTIC/EPOXY	FBGA	BGA137,10X14,32	RECTANGULAR	GRID ARRAY, FINE PITCH	1.8 V			有	活跃	ADVANCED MICRO DEVICES INC	FBGA, BGA137,10X14,32						70 ns						EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	compliant					R-PBGA-B137	不合格		OTHER				0.06 mA						0.00004 A					存储器电路										FLASH+SDRAM
S72NS512PE0KFFG00	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	128	TFBGA,			33554432 words			32000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V			有	Obsolete	SPANSION INC	BGA											3A991.B.1.A		DRAM IS ORGANISED AS 16M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE	8542.32.00.51	BOTTOM	BALL	260	1	0.65 mm	unknown			40	128	S-PBGA-B128	不合格	1.95 V	OTHER	1.7 V		ASYNCHRONOUS		32MX16		1.05 mm	16			536870912 bit				存储器电路												12 mm	12 mm
FM24VN02-G	Ramtron International Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	8		SOP			PLASTIC/EPOXY			-40 °C	85 °C	32000	32768 words	3.4 MHz	SOP, SOP8,.25	SOIC	RAMTRON INTERNATIONAL CORP	Obsolete			3.3 V	小概要	RECTANGULAR	SOP8,.25										EAR99			8542.32.00.71	DUAL	鸥翼		1	1.27 mm	unknown				8	R-PDSO-G8	不合格	3.6 V		2 V		SYNCHRONOUS	0.0001 mA	32KX8		1.75 mm	8		0.00015 A	262144 bit		SERIAL		FRAM		I2C	100000000000000 Write/Erase Cycles	10	HARDWARE	2 V						4.9 mm	3.9 mm
S71VS256RC0ZHK2L0	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	56	VFBGA,			16777216 words			16000000	85 °C	-25 °C	PLASTIC/EPOXY	VFBGA	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	1.8 V			有	Obsolete	SPANSION INC	BGA											EAR99		PSRAM IS ORGANIZED AS 4M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.5 mm	unknown			40	56	R-PBGA-B56	不合格	1.95 V	OTHER	1.7 V		SYNCHRONOUS		16MX16		1 mm	16			268435456 bit				存储器电路												7.7 mm	6.2 mm
XC17S50XLSOG20C	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	20	SOP,			3			559232 words	559232	70 °C	PLASTIC/EPOXY	SOP	RECTANGULAR	小概要	3.3 V			有	Obsolete	XILINX INC	SOIC									e3	有	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	鸥翼	260	1	1.27 mm	compliant			30	20	R-PDSO-G20	不合格	3.6 V	COMMERCIAL	3 V		SYNCHRONOUS		559232X1		2.65 mm	1			559232 bit				存储器电路												12.8 mm	7.5 mm
M4-4101S-Z3	Moujen Switch	数据表	N/A	-	最小起订量: 1 最小包装量: 1
SSDSC2KB240G701	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2018-07-23											Obsolete	INTEL CORP			,						EAR99			8542.32.00.71						compliant																							存储器电路
S82S141F883C	Philips Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24		90 ns			512 words			512	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	DIP24,.6	RECTANGULAR	IN-LINE	5 V			无	Obsolete	SIGNETICS CORP	DIP, DIP24,.6								e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	THROUGH-HOLE		1	2.54 mm	unknown					R-CDIP-T24	不合格	5.5 V	MILITARY	4.5 V		ASYNCHRONOUS	0.185 mA	512X8			8			4096 bit	MIL-STD-883			存储器电路
S82S141F883C	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24			DIP, DIP24,.6			90 ns			512 words	512	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	DIP24,.6	RECTANGULAR	IN-LINE	5 V			无	Obsolete	SIGNETICS CORP	DIP							e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	THROUGH-HOLE		1	2.54 mm	unknown				24	R-CDIP-T24	不合格	5.5 V	MILITARY	4.5 V		ASYNCHRONOUS	0.185 mA	512X8			8			4096 bit	MIL-STD-883			存储器电路
HY64UD16322A-DF70E	SK Hynix Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48	2097152 words			2000000			85 °C	-25 °C	PLASTIC/EPOXY	FBGA	BGA48,6X8,30	RECTANGULAR	GRID ARRAY, FINE PITCH	3 V			Obsolete	SK HYNIX INC	FBGA, BGA48,6X8,30	70 ns											EAR99			8542.32.00.71	BOTTOM	BALL			0.75 mm	unknown					R-PBGA-B48	不合格		OTHER				0.025 mA	2MX16	3-STATE		16		0.000002 A	33554432 bit			COMMON
S72NS256PD0AJBLG3	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	133		8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133			3			16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V			有	Obsolete	SPANSION INC	BGA								e2		EAR99	TIN SILVER COPPER NICKEL	DRAM IS ORGANISED AS 16M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE	8542.32.00.71	BOTTOM	BALL	260	1	0.5 mm	unknown			40	133	S-PBGA-B133	不合格	1.95 V	OTHER	1.7 V		ASYNCHRONOUS		16MX16		1.1 mm	16			268435456 bit				存储器电路												8 mm	8 mm
PF38F5060M0Y0B0	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	105			TFBGA, BGA105,9X12,32			3			33554432 words	32000000	85 °C	-30 °C	PLASTIC/EPOXY	TFBGA	BGA105,9X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V			有	Transferred	INTEL CORP	BGA							e1		EAR99	锡银铜	PSEUDO SRAM IS ORGANIZED AS 8M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant				105	R-PBGA-B105	不合格	2 V	OTHER	1.7 V		SYNCHRONOUS		32MX16		1.2 mm	16		0.00012 A	536870912 bit				存储器电路										FLASH+PSRAM		11 mm	9 mm
TH50VSF2580AASB	Toshiba America Electronic Components	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	69			LFBGA, BGA69,10X12,32			90 ns			2097152 words	2000000	85 °C	-40 °C	PLASTIC/EPOXY	LFBGA	BGA69,10X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V			无	Transferred	TOSHIBA CORP	BGA							e0	无	EAR99	锡铅	USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 256 X 16 OR 512K X 8	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown				69	R-PBGA-B69	不合格	3.6 V	INDUSTRIAL	2.7 V		ASYNCHRONOUS	0.05 mA	2MX16		1.4 mm	16			33554432 bit				存储器电路										FLASH+SRAM		12 mm	9 mm
RD28F3208C3T70	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	66			LFBGA, BGA68,8X12,32			70 ns			2097152 words	2000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	BGA68,8X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V			无	Obsolete	INTEL CORP	BGA									EAR99		SRAM IS ORGANIZED AS 512K X 16	8542.32.00.71	BOTTOM	BALL	240	1	0.8 mm	compliant			30	66	R-PBGA-B66	不合格	3.3 V	商业扩展	2.7 V		ASYNCHRONOUS	0.055 mA	2MX16		1.4 mm	16		0.000006 A	33554432 bit				存储器电路										FLASH+SRAM		10 mm	8 mm