Silicon Storage Technology SST32HF802-70-4C-L3KE

表面安装

YES

Contact plating

gold-plated

Number of pins

20

终端数量

48

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SILICON STORAGE TECHNOLOGY INC

Part Package Code

BGA

Package Description

LFBGA, BGA48,6X8,32

Access Time-Max

70 ns

Number of Words

524288 words

Number of Words Code

512000

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Equivalence Code

BGA48,6X8,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Nom (Vsup)

3 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x10

Row pitch

2.54mm

Gross weight

0.94 g

Operating temperature

-40...163°C

JESD-609代码

e1

ECCN 代码

EAR99

端子表面处理

锡银铜

附加功能

SRAM IS ORGANIZED AS 128K X 16

HTS代码

8542.32.00.71

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

0.8 mm

Reach合规守则

unknown

Current rating

1.5A

引脚数量

48

JESD-30代码

R-PBGA-B48

资历状况

不合格

电源电压-最大值(Vsup)

3.3 V

温度等级

COMMERCIAL

电源电压-最小值(Vsup)

2.7 V

操作模式

ASYNCHRONOUS

电源电流-最大值

0.055 mA

组织结构

512KX16

座位高度-最大

1.4 mm

内存宽度

16

待机电流-最大值

0.00004 A

记忆密度

8388608 bit

内存IC类型

存储器电路

Rated voltage

60V

个人资料

beryllium copper

混合内存类型

FLASH+SRAM

长度

8 mm

宽度

6 mm

Plating thickness

0.254µm

Flammability rating

UL94V-0