类别是'category.FPGA 评估板' (3802)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 内存大小 | 传播延迟 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 筛选水平 | 速度等级 | 输出功能 | 宏细胞数 | CLB-Max的组合延时 | 逻辑块数量 | JTAG BST | 逻辑单元数 | 专用输入数量 | 等效门数 | 系统内可编程 | 长度 | 宽度 | 辐射硬化 | ||||||||||||||||||||||||||||
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![]() | M2GL025TS-1VFG256T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | MICROSEMI CORP | 微芯片技术 | VFBGA-256 | 5.8 | 3 | 125 °C | -40 °C | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.26 V | 1.2 V | 未说明 | 1.2000 V | 138 | Tray | M2GL025 | 活跃 | 1.14 V | Automotive grade | M2GL025TS-1VFG256T2 | 有 | 活跃 | -40 to 125 °C | Automotive, AEC-Q100, IGLOO2 | 有 | 1.14V ~ 2.625V | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | S-PBGA-B256 | AUTOMOTIVE | 1.56 mm | 现场可编程门阵列 | 27696 | 1130496 | AEC-Q100 | 1 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||
![]() | LFXP2-17E-6F484C8W | Lattice Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | BGA | 23 X 23 MM, FPBGA-484 | 5.91 | 357 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 1.14 V | LFXP2-17E-6F484C8W | 无 | Obsolete | LATTICE SEMICONDUCTOR CORP | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | 484 | S-PBGA-B484 | 358 | 不合格 | 1.2,1.2/3.3,3.3 V | OTHER | 358 | 2.6 mm | 现场可编程门阵列 | 17000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL150S-1FCG1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | BGA1152,34X34,40 | SQUARE | 网格排列 | 1.2 V | M2GL150S-1FCG1152I | 有 | 活跃 | MICROSEMI CORP | BGA, BGA1152,34X34,40 | 5.82 | 4 | PLASTIC/EPOXY | BGA | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 574 | 现场可编程门阵列 | 146124 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL050S-1FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 484 | SQUARE | 网格排列 | 1.2 V | 267 | Compliant | M2GL050S-1FGG484I | 有 | 活跃 | MICROSEMI CORP | 5.82 | 3 | PLASTIC/EPOXY | BGA | BGA484,22X22,40 | 100 °C | -40 °C | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | 228.3 kB | 267 | 现场可编程门阵列 | 56340 | 56340 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL025S-1VFG400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | YES | 400 | 400 | GRID ARRAY, FINE PITCH | 1.2 V | 207 | Compliant | M2GL025S-1VFG400I | 有 | 活跃 | MICROSEMI CORP | 5.82 | 3 | PLASTIC/EPOXY | FBGA | BGA400,20X20,32 | SQUARE | 100 °C | -40 °C | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 138 kB | 207 | 现场可编程门阵列 | 27696 | 27696 | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S100T-1FC1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 未说明 | 1.14 V | M2S100T-1FC1152I | 无 | 活跃 | MICROSEMI CORP | 35 X 35 MM, 1 MM PITCH, FBGA-1152 | 5.86 | PLASTIC/EPOXY | e0 | 锡铅 | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 574 | 2.9 mm | 现场可编程门阵列 | 99512 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL100T-FCG1152 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | M2GL100T-FCG1152 | 有 | Obsolete | MICROSEMI CORP | 5.82 | PLASTIC | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 1.2 V | 8542.39.00.01 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 574 | 现场可编程门阵列 | 99512 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S100-1FCG1152I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 4 | PLASTIC/EPOXY | BGA | BGA1152,34X34,40 | SQUARE | 网格排列 | 1.26 V | 1.2 V | 未说明 | 1.14 V | M2S100-1FCG1152I | 有 | 活跃 | MICROSEMI CORP | BGA, BGA1152,34X34,40 | 5.8 | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 574 | 2.9 mm | 现场可编程门阵列 | 99512 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2GL100-FCG1152 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 网格排列 | 1.2 V | M2GL100-FCG1152 | 有 | Obsolete | MICROSEMI CORP | BGA, BGA1152,34X34,40 | 5.82 | PLASTIC | BGA | BGA1152,34X34,40 | SQUARE | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 574 | 现场可编程门阵列 | 99512 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC3190A-09PP175C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 175 | PGA | HPGA, PGA175,16X16 | 5.81 | 370 MHz | 85 °C | PLASTIC/EPOXY | HPGA | PGA175,16X16 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 5.25 V | 4.75 V | 5 V | 未说明 | XC3190A-09PP175C | 无 | Obsolete | XILINX INC | 无 | MAX USABLE 6000 LOGIC GATES | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 未说明 | 2.54 mm | compliant | 175 | S-PPGA-P175 | 144 | 不合格 | 5 V | OTHER | 144 | 320 CLBS, 5000 GATES | 4.191 mm | 现场可编程门阵列 | 1.5 ns | 320 | 320 | 5000 | 42.164 mm | 42.164 mm | |||||||||||||||||||||||||||||||||||||||
![]() | XCV200E-7FGG256I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | BGA | BGA, BGA256,16X16,40 | 5.8 | 400 MHz | 3 | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 30 | 1.71 V | XCV200E-7FGG256I | 有 | Obsolete | XILINX INC | e1 | 有 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 256 | S-PBGA-B256 | 176 | 不合格 | 1.2/3.6,1.8 V | 176 | 1176 CLBS, 63504 GATES | 2 mm | 现场可编程门阵列 | 0.42 ns | 1176 | 5292 | 63504 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||
![]() | XCV400E-8BGG560C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 560 | BGA | BGA-560 | 5.8 | 416 MHz | 3 | 85 °C | PLASTIC/EPOXY | LBGA | BGA560,33X33,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | 30 | 1.71 V | XCV400E-8BGG560C | 有 | Obsolete | XILINX INC | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 560 | S-PBGA-B560 | 404 | 不合格 | 1.2/3.6,1.8 V | OTHER | 404 | 2400 CLBS, 129600 GATES | 1.7 mm | 现场可编程门阵列 | 0.4 ns | 2400 | 10800 | 129600 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||||||||||||
![]() | XC6VLX550T-2FFG1760I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1760 | XILINX INC | BGA | 42.50 X 42.50 MM, LEAD FREE, FBGA-1760 | 5.22 | 1286 MHz | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1760,42X42,40 | SQUARE | 网格排列 | 1.05 V | 1 V | 30 | 0.95 V | XC6VLX550T-2FFG1760I | 有 | 活跃 | e1 | 有 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | not_compliant | 1760 | S-PBGA-B1760 | 1200 | 不合格 | 1,1.2/2.5 V | INDUSTRIAL | 1200 | 3.5 mm | 现场可编程门阵列 | 4.29 ns | 549888 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||||||||||||||
![]() | XC4VFX140-12FFG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | XC4VFX140-12FFG1517I | 有 | 活跃 | XILINX INC | , | 5.25 | 4 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | not_compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC6VSX475T-2FFG1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1156 | XILINX INC | BGA | 35 X 35 MM, LEAD FREE, FBGA-1156 | 5.21 | 1286 MHz | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | SQUARE | 网格排列 | 1.05 V | 1 V | 30 | 0.95 V | XC6VSX475T-2FFG1156I | 有 | 活跃 | e1 | 有 | 3A001.A.7.A | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | not_compliant | 1156 | S-PBGA-B1156 | 600 | 不合格 | 1,1.2/2.5 V | INDUSTRIAL | 600 | 3.5 mm | 现场可编程门阵列 | 4.29 ns | 476160 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||
![]() | XC6VLX760-2FFG1760I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1760 | XILINX INC | BGA | 42.50 X 42.50 MM, LEAD FREE, FBGA-1760 | 5.22 | 1286 MHz | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA1760,42X42,40 | SQUARE | 网格排列 | 1.05 V | 1 V | 30 | 0.95 V | XC6VLX760-2FFG1760I | 有 | 活跃 | e1 | 有 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | not_compliant | 1760 | S-PBGA-B1760 | 1200 | 不合格 | 1,1.2/2.5 V | INDUSTRIAL | 1200 | 3.5 mm | 现场可编程门阵列 | 4.29 ns | 758784 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||||||||||||||
![]() | XC4013XLA-08BGG256C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | BGA | BGA, | 5.3 | 263 MHz | 3 | 85 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 3.6 V | 3.3 V | 30 | 3 V | XC4013XLA-08BGG256C | 有 | Obsolete | XILINX INC | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | CAN ALSO USE 30000 GATES | 8542.39.00.01 | BOTTOM | BALL | 250 | 1.27 mm | compliant | 256 | S-PBGA-B256 | 不合格 | OTHER | 576 CLBS, 10000 GATES | 2.55 mm | 现场可编程门阵列 | 1 ns | 576 | 10000 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | XC4013L-5PQ240C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | FLATPACK, FINE PITCH | 5.25 V | 5 V | 4.75 V | XC4013L-5PQ240C | Obsolete | XILINX INC | QFP | FQFP, | 5.27 | PLASTIC/EPOXY | FQFP | SQUARE | TYP. GATES = 10000-30000 | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | 240 | S-PQFP-G240 | 不合格 | 576 CLBS, 10000 GATES | 4.1 mm | 现场可编程门阵列 | 576 | 10000 | 32 mm | 32 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV1000-5FGG680I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 680 | LBGA, | 5.79 | 294 MHz | 3 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 2.625 V | 2.5 V | 30 | 2.375 V | XCV1000-5FGG680I | 有 | Obsolete | XILINX INC | BGA | e1 | 有 | 3A001.A.7.A | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 680 | S-PBGA-B680 | 不合格 | 6144 CLBS, 1124022 GATES | 1.7 mm | 现场可编程门阵列 | 0.7 ns | 6144 | 1124022 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | XCV1000-6FGG680I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 680 | LBGA, | 5.79 | 333 MHz | 3 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 2.625 V | 2.375 V | 2.5 V | 30 | XCV1000-6FGG680I | 有 | Obsolete | XILINX INC | BGA | e1 | 有 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 680 | S-PBGA-B680 | 不合格 | 6144 CLBS, 1124022 GATES | 1.7 mm | 现场可编程门阵列 | 0.6 ns | 6144 | 1124022 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCV400E-7BGG432I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 432 | BGA | BGA-432 | 5.79 | 400 MHz | 3 | PLASTIC/EPOXY | LBGA | BGA432,31X31,50 | SQUARE | GRID ARRAY, LOW PROFILE | 1.89 V | 1.8 V | 30 | 1.71 V | XCV400E-7BGG432I | 有 | Obsolete | XILINX INC | e1 | 有 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | unknown | 432 | S-PBGA-B432 | 316 | 不合格 | 1.2/3.6,1.8 V | 316 | 2400 CLBS, 129600 GATES | 1.7 mm | 现场可编程门阵列 | 0.42 ns | 2400 | 10800 | 129600 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||
![]() | XCR3128-12TQ128I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 128 | QFP | LFQFP, QFP128,.63X.87,20 | 5.69 | 69 MHz | 96 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK, LOW PROFILE, FINE PITCH | 3.63 V | 3.3 V | 2.97 V | XCR3128-12TQ128I | 无 | Obsolete | XILINX INC | YES | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | 128 | R-PQFP-G128 | 不合格 | 3.3 V | INDUSTRIAL | 12 ns | 2 DEDICATED INPUTS, 96 I/O | 1.6 mm | EE PLD | MACROCELL | 128 | YES | 2 | YES | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | XCV200E-8PQG240C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 240 | XILINX INC | QFP | PLASTIC, QFP-240 | 5.8 | 416 MHz | 3 | 85 °C | PLASTIC/EPOXY | FQFP | QFP240,1.3SQ,20 | SQUARE | FLATPACK, FINE PITCH | 1.89 V | 1.8 V | 30 | Compliant | 1.71 V | XCV200E-8PQG240C | 有 | Obsolete | e3 | 有 | EAR99 | Matte Tin (Sn) | 85 °C | 0 °C | 8542.39.00.01 | QUAD | 鸥翼 | 245 | 0.5 mm | unknown | 240 | S-PQFP-G240 | 158 | 不合格 | 1.8 V | 1.2/3.6,1.8 V | OTHER | 14 kB | 158 | 1176 CLBS, 63504 GATES | 4.1 mm | 现场可编程门阵列 | 8 | 0.4 ns | 1176 | 5292 | 63504 | 32 mm | 32 mm | 无 | |||||||||||||||||||||||||||||
![]() | XCV600E-8FGG680I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 680 | BGA | BGA, BGA680,39X39,40 | 5.81 | 416 MHz | 3 | PLASTIC/EPOXY | BGA | BGA680,39X39,40 | SQUARE | 网格排列 | 1.89 V | 1.8 V | 40 | 1.71 V | XCV600E-8FGG680I | 有 | Obsolete | XILINX INC | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 680 | S-PBGA-B680 | 512 | 不合格 | 1.2/3.6,1.8 V | 512 | 3456 CLBS, 186624 GATES | 1.9 mm | 现场可编程门阵列 | 0.4 ns | 3456 | 15552 | 186624 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | XC3190A-4PG175C | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 175 | PGA | HPGA, PGA175,16X16 | 5.8 | 227 MHz | 85 °C | CERAMIC, METAL-SEALED COFIRED | HPGA | PGA175,16X16 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 5.25 V | 5 V | 未说明 | 4.75 V | XC3190A-4PG175C | 无 | Obsolete | XILINX INC | e0 | 无 | 锡铅 | MAX USABLE 6000 LOGIC GATES | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 未说明 | 2.54 mm | compliant | 175 | S-CPGA-P175 | 144 | 不合格 | 5 V | OTHER | 144 | 320 CLBS, 5000 GATES | 4.318 mm | 现场可编程门阵列 | 3.3 ns | 320 | 320 | 5000 | 42.164 mm | 42.164 mm |
M2GL025TS-1VFG256T2
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
LFXP2-17E-6F484C8W
Lattice Semiconductor
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL150S-1FCG1152I
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL050S-1FGG484I
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL025S-1VFG400I
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2S100T-1FC1152I
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL100T-FCG1152
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2S100-1FCG1152I
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
M2GL100-FCG1152
Microchip
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC3190A-09PP175C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV200E-7FGG256I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV400E-8BGG560C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC6VLX550T-2FFG1760I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4VFX140-12FFG1517I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC6VSX475T-2FFG1156I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC6VLX760-2FFG1760I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4013XLA-08BGG256C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC4013L-5PQ240C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV1000-5FGG680I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV1000-6FGG680I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV400E-7BGG432I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCR3128-12TQ128I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV200E-8PQG240C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XCV600E-8FGG680I
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
XC3190A-4PG175C
Xilinx
分类:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
